Patents by Inventor Sven Egelkraut

Sven Egelkraut has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductor strip with contact areas having cutouts
    Patent number: 9406592
    Abstract: A power semiconductor circuit includes at least one semiconductor having at least one contact area, and at least one bonding conductor strip having at least one contact region fastened on at least one of the contact areas. The contact region of the bonding conductor strip includes cutouts.
    Type: Grant
    Filed: June 10, 2015
    Date of Patent: August 2, 2016
    Assignee: CONTINENTAL AUTOMOTIVE GMBH
    Inventors: Nico Kohl, Martin Metzler, Sven Egelkraut, Markus Leicht
  • SEMICONDUCTOR CIRCUIT AND METHOD FOR PRODUCING THE SEMICONDUCTOR CIRCUIT
    Publication number: 20150357303
    Abstract: A power semiconductor circuit includes at least one semiconductor having at least one contact area, and at least one bonding conductor strip having at least one contact region fastened on at least one of the contact areas. The contact region of the bonding conductor strip includes cutouts.
    Type: Application
    Filed: June 10, 2015
    Publication date: December 10, 2015
    Applicant: CONTINENTAL AUTOMOTIVE GMBH
    Inventors: Nico Kohl, Martin Metzler, Sven Egelkraut, Markus Leicht
  • HEAT SINK AND METHOD FOR PRODUCING A HEAT SINK
    Publication number: 20090139690
    Abstract: A heat sink includes a base body of an electrically insulating material and one or several metallic molded parts having a mounting portion and a heat-transfer portion, wherein the heat-transfer portion is mechanically connected to the base body. The heat sink can be inserted on a printed circuit board having several heat sources that can be at different electrical potentials, wherein the mounting portions of the molded parts are soldered to respective heat sources or close to the respective heat sources.
    Type: Application
    Filed: November 25, 2008
    Publication date: June 4, 2009
    Applicant: Fraunhofer-Gesellschaft zur, Foerderung der angewandten, Forschung e. V.
    Inventors: Martin MAERZ, Dimitar Tchobanov, Bernd Eckhardt, Stefan Zeltner, Sven Egelkraut, Simon Amesoeder