Abstract: The present invention relates to. a bioreactor vessel (1) having an outer vessel wall (2) and a bottom (3), further comprising an integrated internal structure (4) providing at least two additional surfaces (4a), (4b) to the internal reactor space of said vessel, said internal structure (4) being spaced apart from said outer vessel wall (2), as well as to a process for growing biological cells using said bioreactor vessel.

Abstract: The invention relates to a positioning device for positioning a substrate, in particular a wafer, comprising: a process chamber; a base body; a carrier element which comprises a support for supporting the substrate, the carrier element being arranged above the base body and formed movable in terms of distance from the base body; and a holder for an additional substrate, in particular an additional wafer or a mask, the holder being arranged opposite the carrier element; wherein there is, between the base body and the carrier element, a sealed-off cavity to which a pressure, in particular a negative pressure, can be applied so as to prevent undesired movement of the carrier element as a result of the action of an external force.

Abstract: A wafer support system has a wafer support device and a dicing frame, wherein the wafer support device has a bottom plate and a top plate. The top plate has a support surface for supporting the wafer, and the bottom plate has a maximum diameter being larger than the maximum diameter of the top plate so that the bottom plate forms a repository for the dicing frame. The dicing frame has a plate-like shape defining a center hole, wherein the minimum diameter of the center hole is larger than the maximum diameter of the top plate so that the dicing frame sinks below the upper surface of the wafer and/or the support surface. Further, a wafer support device, a wafer support system and a mask aligner are provided.

Abstract: A wafer support system has a wafer support device and a dicing frame, wherein the wafer support device has a bottom plate and a top plate. The top plate has a support surface for supporting the wafer, and the bottom plate has a maximum diameter being larger than the maximum diameter of the top plate so that the bottom plate forms a repository for the dicing frame. The dicing frame has a plate-like shape defining a center hole, wherein the minimum diameter of the center hole is larger than the maximum diameter of the top plate so that the dicing frame sinks below the upper surface of the wafer and/or the support surface. Further, a wafer support device, a wafer support system and a mask aligner are provided.

Abstract: A device for treating a disc-shaped substrate is disclosed, comprising a support which has a support face for the disc-shaped substrate and a support adapter which can be coupled to the support and can support a mask used for treating the disc-shaped substrate, wherein an interface is provided which detects the coupling of the support adapter to the support and wherein a control system is provided which cooperates with the interface and detects whether the support adapter is coupled to the support, in particular whether the interface is occupied. A support adapter for use in a device of this type is further disclosed.

Abstract: The invention relates to a positioning device for positioning a substrate, in particular a wafer, comprising: a process chamber; a base body; a carrier element which comprises a support for supporting the substrate, the carrier element being arranged above the base body and formed movable in terms of distance from the base body; and a holder for an additional substrate, in particular an additional wafer or a mask, the holder being arranged opposite the carrier element; wherein there is, between the base body and the carrier element, a sealed-off cavity to which a pressure, in particular a negative pressure, can be applied so as to prevent undesired movement of the carrier element as a result of the action of an external force.

Abstract: The intention is to provide powerful pressure sensitive adhesives with high adhesion and adjustable cohesive failure characteristics. This is accomplished with pressure sensitive adhesives which comprise 30-90 wt % of at least one poly(meth)acrylate; 10-60 wt % of three-dimensional bodies K made from an inorganic material with a maximum extent of 40 to 300 ?m; and 0.1-10 wt % of at least partly expanded microballoons M, based in each case on the total weight of the pressure sensitive adhesive. Another subject of the invention is an adhesive tape which comprises a pressure sensitive adhesive of this kind.

Abstract: The invention describes a double-sided, carrierless self-adhesive tape which can be used in particular for achieving very durable adhesive bonding of a variety of articles. This double-sided, carrierless self-adhesive tape is composed of a homogeneously crosslinked pressure-sensitive acrylate hotmelt composition of single-layer construction, which may have been lined with release materials such as siliconized release papers or release films. The double-sided, carrierless pressure-sensitive adhesive tape is characterized in that it is composed of a photoinitiator-free, thermally homogeneously crosslinked acrylate hotmelt which is crosslinked predominantly by way of urethane units. It is notable in particular for the fact that it is homogeneously chemically crosslinked through the layer and, in contrast to acrylate layers crosslinked by radiation (UV/EBC), does not exhibit any profile of crosslinking through the layer.

Abstract: A chuck for aligning a first planar substrate in parallel to a second planar substrate includes a top plate having a top surface for arrangement of the first planar substrate. A bottom plate is at least one distance measuring sensor configured to measure a distance between the top surface of the top plate and a surface of the second planar substrate, and at least three linear actuators in contact with the top plate and the bottom plate. The method for setting a gap between the first and second planar substrate includes measuring the thickness of the first planar substrate and measuring between a surface of the second planar substrate and the top surface of the top plate. The tilt adjusts between a top surface of the first planar substrate or the chuck and the surface of the second planar substrate by using at least three linear actuators of the chuck.

Abstract: Provided herein is an improved apparatus, method and system for providing a modular LED circuit assembly. Specifically, examples of the present invention include a modular LED circuit which may be scaled and used in a wide variety of form factors. One example of the present invention may provide an apparatus for supporting a light-emitting diode which includes an LED circuit board including a first major surface and a second major surface. The first major surface may include a first contact pad and a second contact pad, where each of the first contact pad and the second contact pad are configured to receive a respective connector from the LED. The second major surface of the LED circuit board may include a first area, a second area, and a third area, where a substrate is attached to the LED circuit board across the third area.

Abstract: A device for treating a disc-shaped substrate is disclosed, comprising a support which has a support face for the disc-shaped substrate and a support adapter which can be coupled to the support and can support a mask used for treating the disc-shaped substrate, wherein an interface is provided which detects the coupling of the support adapter to the support and wherein a control system is provided which cooperates with the interface and detects whether the support adapter is coupled to the support, in particular whether the interface is occupied. A support adapter for use in a device of this type is further disclosed.

Abstract: The invention relates to a process for preparing homogeneously crosslinked polymers, in which at least one crosslinker is added to a polymer in the melt, in which the polymer is further processed from the melt, and in which a thermal crosslinking reaction is brought about by means of the crosslinker, with at least part of the crosslinking reaction taking place after the further processing at a temperature below the melting temperature of the polymer, characterized in that the crosslinker comprises an at least difunctional compound, at least one of the functional groups being an oxazoline group, and the polymer contains functional groups which, at a temperature below the melting temperature of the polymer, are able to react with the oxazolines in a linking reaction in the sense of the thermal crosslinking reaction.

Abstract: The intention is to provide powerful pressure sensitive adhesives with high adhesion and adjustable cohesive failure characteristics. This is accomplished with pressure sensitive adhesives which comprise 30-90 wt % of at least one poly(meth)acrylate; 10-60 wt % of three-dimensional bodies K made from an inorganic material with a maximum extent of 40 to 300 ?m; and 0.1-10 wt % of at least partly expanded microballoons M, based in each case on the total weight of the pressure sensitive adhesive. Another subject of the invention is an adhesive tape which comprises a pressure sensitive adhesive of this kind.

Abstract: The invention relates to a chuck and a method for suction and holding a wafer by said chuck, wherein the chuck comprises: a flat top face being subdivided into several suction segments, wherein the suction segments are each configured for suctioning a fluid; and a bottom face. The method comprises the steps: bringing, within a fluid, wafer and top face of the chuck into vicinity such that two or more of the suction segments are covered, at least loosely covered, by the wafer; choosing, from the suction segments not yet been activated, a suction segment having a minimal distance to the wafer; activating the suction segment chosen in the previous step; once the wafer in the area of the last-activated suction segment tightly touches the top face of the chuck and as long as at least one suction segment is not yet activated: repeating the foregoing steps.

Abstract: The invention relates to a method and device for expanding the travel or control displacement of linear actuators that is available during an imprinting or embossing stroke. The wedge error compensating head (2) comprises a movable part (4), a stationary part (3) and at least three linear actuators (8). Each linear actuator (8) is connected to one of the parts (3, 4) at one end and to the other of the two parts (4, 3) by wedges (9) at the other end. By means of the wedges (9), it is possible to coarsely or roughly compensate for wedge errors and possible tolerances of individual subcomponents of the system. The linear actuators (8) are only used for fine or precision compensation for the wedge error. In this way, sufficient control displacement is available for the imprinting stroke with the linear actuators.

Abstract: A multi-purpose illumination device and a system and method for operating a multi-purpose illumination device are provided herein. A multi-purpose illumination device may include a lamp housing and a light source disposed within the lamp housing. The lamp housing may include a front, a back, a top, and a bottom, with the light from the light source projecting from the front of the lamp housing. The lamp housing may further define an air channel with an air inlet and an air outlet. The air inlet may be defined in the front of the lamp housing. The air outlet may be defined in the top of the lamp housing. Some embodiments may include a heat sink disposed within the lamp housing, where the air channel is at least partially defined by the heat sink. The heat sink may include at least one heat-dissipating fin disposed within the air channel.

Abstract: The chuck for aligning a first planar substrate, e.g., a wafer, in parallel to a second planar substrate, e.g. a mask, comprises: a top plate having a top surface for arrangement of the first planar substrate, a bottom plate, at least one distance measuring sensor configured to measure a distance between the top surface of the top plate and a surface of the second planar substrate, and at least three linear actuators in contact with the top plate and the bottom plate. The method for setting a gap between a first planar substrate, e.g. a wafer, on a top plate of a chuck, and a second planar substrate, e.g.

Abstract: A multi-purpose illumination device and a system and method for operating a multi-purpose illumination device are provided herein. A multi-purpose illumination device may include a lamp housing and a light source disposed within the lamp housing. The lamp housing may include a front, a back, a top, and a bottom, with the light from the light source projecting from the front of the lamp housing. The lamp housing may further define an air channel with an air inlet and an air outlet. The air inlet may be defined in the front of the lamp housing. The air outlet may be defined in the top of the lamp housing. Some embodiments may include a heat sink disposed within the lamp housing, where the air channel is at least partially defined by the heat sink. The heat sink may include at least one heat-dissipating fin disposed within the air channel.

Abstract: The invention describes a double-sided, carrierless self-adhesive tape which can be used in particular for achieving very durable adhesive bonding of a variety of articles. This double-sided, carrierless self-adhesive tape is composed of a homogeneously crosslinked pressure-sensitive acrylate hotmelt composition of single-layer construction, which may have been lined with release materials such as siliconized release papers or release films. The double-sided, carrierless pressure-sensitive adhesive tape is characterized in that it is composed of a photoinitiator-free, thermally homogeneously crosslinked acrylate hotmelt which is crosslinked predominantly by way of urethane units. It is notable in particular for the fact that it is homogeneously chemically crosslinked through the layer and, in contrast to acrylate layers crosslinked by radiation (UV/EBC), does not exhibit any profile of crosslinking through the layer.