Patents by Inventor Sven Thomas
Sven Thomas has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240132144Abstract: A steering gear for an electromechanical steering system for a vehicle includes an input shaft that can be coupled or connected to a steering column of the steering system, a segment shaft that can be coupled or connected to a steering column lever of the steering system, an angular gear, a servo gear, and an electric motor for driving the servo gear. The angular gear is designed as a bevel gear. The input shaft and the electric motor are connected to the servo gear. The servo gear is connected to the angular gear. The angular gear is connected to the segment shaft. The angular gear is formed to transmit torque from the servo gear to the segment shaft via two transmission paths.Type: ApplicationFiled: October 13, 2020Publication date: April 25, 2024Inventors: Christian WIRTH, Franz-Thomas MITTERER, Janos TOTH, Sven KRUEGER, Ahmed SALEME, Huba NEMETH, Stephan KRINKE
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Publication number: 20240124049Abstract: A steering transmission for an electro-mechanical steering system for a vehicle includes an electric motor, a servo transmission, and an angle transmission for connecting a steering column of the steering system to a control stalk of the steering system. The angle transmission is a mechanically driven recirculating-ball transmission with a ball nut, which is engaged with a segment shaft of the steering transmission that is/can be connected to the steering stalk. A spindle of the recirculating-ball transmission is continuous. The spindle is connected to an output shaft of the servo transmission on one side. The servo transmission is/can be driven by the electric motor.Type: ApplicationFiled: October 14, 2020Publication date: April 18, 2024Inventors: Huba NEMETH, Bernd-Robert HOEHN, Franz-Thomas MITTERER, Janos TOTH, Sven KRUEGER, Ahmed SALEME, Stephan KRINKE
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Publication number: 20240095645Abstract: A method of generating customizable goal representation is disclosed. A request from a user to view a goal representation is received. A flexible goal ontology is accessed that comprises one or more goal entities, one or more goal relationships between the goal entities, or one or more goal properties, the one or more goal properties including one or more metadata attributes relating to the one or more goal entities. A set of mapping rules is obtained that defines mappings between one or more goals. The set of mapping rules is evaluated to assemble a customized goal representation tailored to the user. The customized goal representation is updated based on a revaluation of the mapping rules affected by changes to the one or more goal entities, the one or more goal relationships, or the one or more properties.Type: ApplicationFiled: September 21, 2023Publication date: March 21, 2024Inventors: Sven Martin Andreas Elfgren, Friedrich I. Riha, Elliot Piersa Dahl, Eric Koslow, Nicole Jensen McMullin, Natasha Hede, Connie Lynn Chen, Alexa Jean Kriebel, Chije Wang'ati, JR., Megan McGowan, Ami Tushar Bhatt, Jeffrey Ryan Gurr, Tyler Kowalewski, Rahul Rangnekar, Byron Sha Yang, Jerry Wu, Ricky Rizal Zein, Romain Beauxis, Adnan Chowdhury, Priya Balasubramanian, Gilles Yvetot, Shaylan Hawthorne, Adnan Pirzada, Matthew Michael Parides, Jenna Nicole Soojin Lee, Ian William Richard, Laura Elizabeth Pearson, Christian Nguyen, Tovin Thomas, Adam Carter, David Achee, David Christopher Sally, Miranda Howitt, Vincent Yao, Seth Goldenberg, Aimee Jin Peng, William Qingdong Yan, Matthew Stephen Wysocki, Michael Ryan Shohoney, Ryan Maas, Asha Camper Singh, Leonardo Faria, Elliot Piersa Dahl
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Publication number: 20230168281Abstract: The invention relates to a current-sensing resistor for measuring an electric current (I), comprising two connection parts, a resistor element, a pair of voltage-sensing contacts for measuring a voltage drop across the resistor element, and at least one incision in at least one of the connection parts the incision surrounding one of the voltage-sensing contacts and preventing current flow across the incision. The invention provides for multiple pairs of voltage sensing contacts to be arranged in series in the direction of current flow.Type: ApplicationFiled: February 5, 2021Publication date: June 1, 2023Inventors: Benedikt KRAMM, Felix LEBEAU, Sven THOMAS
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Patent number: 9966355Abstract: A wire, preferably a bonding wire for bonding in microelectronics, contains a copper core with a surface and coating layer containing aluminum superimposed over the surface of the copper core. The ratio of the thickness of the coating layer to the diameter of the copper core is from 0.05 to 0.2 ?m. The wire has a diameter in the range of from 100 ?m to 600 ?m and specified standard deviations of the diameter of the copper core and of the thickness of the coating layer. The invention further relates to a process for making a wire, to a wire obtained by the process, to an electric device containing at least two elements and the wire, to a propelled device containing the electric device, and to a process of connecting two elements through the wire by wedge bonding.Type: GrantFiled: May 7, 2013Date of Patent: May 8, 2018Assignee: Heraeus Deutschland GmbH & Co. KGInventors: Eugen Milke, Peter Prenosil, Sven Thomas
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Publication number: 20160288272Abstract: A bonding wire according to the invention contains a core having a surface and a coating layer which is at least partially superimposed over the surface of the core. The core contains a core main component selected from copper and silver and the coating layer contains a coating component selected from palladium, platinum, gold, rhodium, ruthenium, osmium and iridium. The coating layer is applied on the surface of the core by depositing a film of a liquid containing a coating component precursor onto a wire core precursor and heating the deposited film to decompose the coating component precursor into a metallic phase.Type: ApplicationFiled: November 21, 2013Publication date: October 6, 2016Inventors: Annette LUKAS, Patrick WENZEL, Michael DEUSCHLE, Eugen MILKE, Sven THOMAS, Jürgen SCHARF
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Patent number: 9397064Abstract: The invention is related to a bonding wire containing a core having a surface. The core contains aluminum as a main component and scandium in an amount between 0.05% and 1.0%.Type: GrantFiled: November 12, 2013Date of Patent: July 19, 2016Assignee: Heraeus Deutschland GmbH & Co. KGInventors: Eugen Milke, Sven Thomas, Ute Geissler, Martin Schneider-Ramelow
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Patent number: 9214444Abstract: A ribbon, preferably a bonding ribbon for bonding in microelectronics, contains a first layer containing copper, a coating layer containing aluminum superimposed over the first layer, and an intermediate layer. In a cross-sectional view of the ribbon, the area share of the first layer is from 50 to 96% and the aspect ratio between the width and the height of the ribbon in a cross-sectional view is from 0.03 to less than 0.8. The ribbon has a cross-sectional area of 25,000 ?m2 to 800,000 ?m2. The intermediate layer contains at least one intermetallic phase containing materials of the first and coating layers. The invention further relates to a process for making a wire, to a wire obtained by the process, to an electric device containing the wire, to a propelled device comprising said electric device and to a process of connecting two elements through the wire by wedge-bonding.Type: GrantFiled: May 7, 2013Date of Patent: December 15, 2015Assignee: Heraeus Deutschland GmbH & Co. KGInventors: Eugen Milke, Peter Prenosil, Sven Thomas
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Publication number: 20150303165Abstract: The invention is related to a bonding wire containing a core having a surface. The core contains aluminum as a main component and scandium in an amount between 0.05% and 1.0%.Type: ApplicationFiled: November 12, 2013Publication date: October 22, 2015Applicant: HERAEUS DEUTSCHLAND GMBH & CO. KGInventors: Eugen MILKE, Sven THOMAS, Ute GEISSLER, Martin SCHNEIDER-RAMELOW
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Publication number: 20150155252Abstract: A wire, preferably a bonding wire for bonding in microelectronics, contains a copper core with a surface and coating layer containing aluminum superimposed over the surface of the copper core. The ratio of the thickness of the coating layer to the diameter of the copper core is from 0.05 to 0.2 ?m. The wire has a diameter in the range of from 100 ?m to 600 ?m and specified standard deviations of the diameter of the copper core and of the thickness of the coating layer. The invention further relates to a process for making a wire, to a wire obtained by the process, to an electric device containing at least two elements and the wire, to a propelled device containing the electric device, and to a process of connecting two elements through the wire by wedge bonding.Type: ApplicationFiled: May 7, 2013Publication date: June 4, 2015Applicant: Heraeus Materials Technology GmbH & Co. KGInventors: Eugen Milke, Peter Prenosil, Sven Thomas
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Publication number: 20150137390Abstract: A ribbon, preferably a bonding ribbon for bonding in microelectronics, contains a first layer containing copper, a coating layer containing aluminum superimposed over the first layer, and an intermediate layer. In a cross-sectional view of the ribbon, the area share of the first layer is from 50 to 96% and the aspect ratio between the width and the height of the ribbon in a cross-sectional view is from 0.03 to less than 0.8. The ribbon has a cross-sectional area of 25,000 ?m2 to 800,000 ?m2. The intermediate layer contains at least one intermetallic phase containing materials of the first and coating layers. The invention further relates to a process for making a wire, to a wire obtained by the process, to an electric device containing the wire, to a propelled device comprising said electric device and to a process of connecting two elements through the wire by wedge-bonding.Type: ApplicationFiled: May 7, 2013Publication date: May 21, 2015Inventors: Eugen Milke, Peter Prenosil, Sven Thomas
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Publication number: 20150098170Abstract: The invention relates to a wire, preferably a bonding wire for bonding in microelectronics, containing a copper core with a surface and a coating layer containing aluminum superimposed over the surface of the core. In any cross-sectional view of the wire, the area share of the coating layer is from 20 to 50% based on the total area of the cross-section of the wire, and the aspect ratio between longest and shortest paths through the wire is from larger than 0.8 to 1.0. The wire has a diameter of from 100 ?m to 600 ?m. The invention further relates to a process for making a wire, to a wire obtained by the process, to an electric device containing at least two elements and the wire, to a propelled device containing the electric device, and to a process of connecting two elements through the wire by wedge bonding.Type: ApplicationFiled: May 7, 2013Publication date: April 9, 2015Applicant: HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KGInventors: Eugen Milke, Peter Prenosil, Sven Thomas
