Patents by Inventor Swaroop K. Kommera

Swaroop K. Kommera has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Print head slot ribs
    Patent number: 8888252
    Abstract: A print head die (30) includes slot ribs (41) having edges (62, 64) with triangular notches. In one embodiment, the print head die is formed by dry etching from a first side (50) of a wafer (30) a series of spaced openings (220) completely through the wafer (30) and separated by ribs (41) followed by wet etching the wafer (30) from a second opposite side (44) to recess the ribs (41) from the second side (44).
    Type: Grant
    Filed: July 9, 2008
    Date of Patent: November 18, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Siddhartha Bhowmik, Swaroop K. Kommera, Manish Giri, Robert N. K. Browning, Charles Gustav Schmidt
  • Print head die slot ribs
    Patent number: 8262204
    Abstract: Methods and an apparatus are disclosed, wherein a print head die includes a slot and ribs across the slot. The ribs are recessed from one or both sides of the die.
    Type: Grant
    Filed: October 15, 2007
    Date of Patent: September 11, 2012
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: David M. Braun, Siddhartha Bhowmik, Swaroop K. Kommera, Richard J. Oram, Phillip G. Rourke, Joshua W. Smith, Christopher C. Aschoff
  • PRINT HEAD SLOT RIBS
    Publication number: 20110069120
    Abstract: A print head die (30) includes slot ribs (41) having edges (62, 64) with triangular notches. In one embodiment, the print head die is formed by dry etching from a first side (50) of a wafer (30) a series of spaced openings (220) completely through the wafer (30) and separated by ribs (41) followed by wet etching the wafer (30) from a second opposite side (44) to recess the ribs (41) from the second side (44).
    Type: Application
    Filed: July 9, 2008
    Publication date: March 24, 2011
    Inventors: Siddhartha Bhowmik, Swaroop K. Kommera, Manish Giri, Robert N.K. Browning, Charles Gustav Schmidt
  • Formation of a slot in a silicon substrate
    Patent number: 7855151
    Abstract: A slot is formed that reaches through a first side of a silicon substrate to a second side of the silicon substrate. A trench is laser patterned. The trench has a mouth at the first side of the silicon substrate. The trench does not reach the second side of the silicon substrate. The trench is dry etched until a depth of at least a portion of the trench is extended approximately to the second side of the silicon substrate (12). A wet etch is performed to complete formation of the slot. The wet etch etches silicon from all surfaces of the trench.
    Type: Grant
    Filed: August 21, 2007
    Date of Patent: December 21, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Swaroop K. Kommera, Siddhartha Bhowmik, Richard J. Oram, Sriram Ramamoorthi, David M. Braun
  • PRINT HEAD DIE SLOT RIBS
    Publication number: 20090096845
    Abstract: Methods and an apparatus are disclosed, wherein a print head die includes a slot and ribs across the slot. The ribs are recessed from one or both sides of the die.
    Type: Application
    Filed: October 15, 2007
    Publication date: April 16, 2009
    Inventors: David M. Braun, Siddhartha Bhowmik, Swaroop K. Kommera, Richard J. Oram, Phillip G. Rourke, Joshua W. Smith, Christopher C. Aschoff
  • Formation of a slot in a silicon substrate
    Publication number: 20090053898
    Abstract: A slot is formed that reaches through a first side of a silicon substrate to a second side of the silicon substrate. A trench is laser patterned. The trench has a mouth at the first side of the silicon substrate. The trench does not reach the second side of the silicon substrate. The trench is dry etched until a depth of at least a portion of the trench is extended approximately to the second side of the silicon substrate (12). A wet etch is performed to complete formation of the slot. The wet etch etches silicon from all surfaces of the trench.
    Type: Application
    Filed: August 21, 2007
    Publication date: February 26, 2009
    Inventors: Swaroop K. Kommera, Siddhartha Bhowmik, Richard J. Oram, Sriram Ramamoorthi, David M. Braun
  • Ablation
    Publication number: 20090020511
    Abstract: Embodiments of a method of ablation are disclosed.
    Type: Application
    Filed: July 17, 2007
    Publication date: January 22, 2009
    Inventors: Swaroop K. Kommera, Richard J. Oram, Siddhartha Bhowmik
  • Electromagnetic waveguide
    Patent number: 7470581
    Abstract: A method of manufacturing an electromagnetic (EM) waveguide capable of guiding a wave along a pre-defined propagation path is described. The method includes providing a core region that extends along the propagation path and printing a colloidal crystal comprised of first particles on the waveguide core region.
    Type: Grant
    Filed: July 27, 2006
    Date of Patent: December 30, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Swaroop K. Kommera, Tim R. Koch
  • Electromagnetic waveguide
    Publication number: 20080026495
    Abstract: A method of manufacturing an electromagnetic (EM) waveguide capable of guiding a wave along a pre-defined propagation path is described. The method includes providing a core region that extends along the propagation path and printing a colloidal crystal comprised of first particles on the waveguide core region.
    Type: Application
    Filed: July 27, 2006
    Publication date: January 31, 2008
    Inventors: Swaroop K. Kommera, Tim R. Koch