Abstract: Compositions of ambient-curable anisotropic conductive adhesive comprising an ambient-curable epoxy resin system and a conductive powder are proposed. It can be cured under ambient conditions using common magnet for clamping mechanism. This greatly simplifies many electronic repairs or Do-It-Yourself types of application. This anisotropic conductive adhesive can also be applied using traditional hot-bar laminator, but at lowered temperatures, and this is bound to open up new application possibilities.

Abstract: Compositions consisting of a mixture of filamentary nickel powder(s) and a thermosetting epoxy resin form the basis of anisotropic conductive materials. The filamentary nickel powder has a three-dimensional chain-like network structure. When such filamentary nickel powder is dispersed in a polymer thin film, such as an epoxy resin, it exhibits anisotropic conductivity.

Abstract: Compositions consisting of a mixture of filamentary nickel powder(s) and a thermosetting epoxy resin form the basis of anisotropic conductive materials. The filamentary nickel powder has a three-dimensional chain-like network structure. When such filamentary nickel powder is dispersed in a polymer thin film, such as an epoxy resin, it exhibits anisotropic conductivity.

Abstract: A method for fabricating a multi-layered printed circuit board without via holes is disclosed herein, which includes the steps of: providing a plurality of layers of printed circuit boards each having circuits pre-formed thereon; stacking the plurality of layers of the printed circuit boards; and electrically connecting corresponding pads on the plurality of layers of the printed circuit boards; wherein the circuits to be connected with each other on different layers of the printed circuit boards are electrically connected to the pads that are extended to an edge of the printed circuit boards. The multi-layered printed circuit board without via holes in accordance with the present invention can overcome the prior disadvantages caused by the via holes.

Abstract: A method for fabricating a multi-layered flexible printed circuit board without via holes is disclosed herein, which includes the steps of: providing a flexible printed circuit board formed with a circuit thereon in advance; and fan-folding or rolling the flexible printed circuit board to build up a plurality of layers in order to obtain the multi-layered flexible printed circuit board without via holes; thereby being capable of solving the problems resulting from the via holes formed on a conventional flexible printed circuit board.

Abstract: A thermosetting epoxy resin composition with improved flexibility, adhesion and solder resistance includes (a) 40-100 phr (parts per hundred parts) of dimmer acid modified epoxy resin; (b) 0-60 phr of an additive epoxy resin for adjusting softness; (c) 1-30 phr of a hardening agent; and (d) 0.1-10 phr of a catalyst.

Abstract: A flexible substrate with electromagnetic shielding (EMS) function is provided. This substrate comprises a conductive backing film; and a thermosetting resin layer coated on the conductive backing film. The conductive backing film comprises aluminum foil. The thermosetting resin layer comprises modified carboxylated NBR, dimer acid-modified thermosetting epoxy resins and heat-resistive acrylic resins. This type of substrate can be used for electromagnetic shielding purpose. The flexible substrate can be used in various electronic applications, for example, flexible display applications.

Abstract: An electromagnetic shielding (EMS) tape is provided. The EMS tape comprises a conductive backing film; and a thermosetting resin layer coated on the conductive backing film. The conductive backing film comprises aluminum foil. The thermosetting resin layer comprises modified carboxylated NBR, dimer acid-modified thermosetting epoxy resins and heat-resistive acrylic resins.

Abstract: A flexible printed circuit board substrate comprising a conductive layer and a support layer bonded to the conductive layer, in which the support layer comprises a metal layer for structural support, an adhesive layer formed on one side of the metal layer for bonding the metal layer to the conductive layer, and a protective layer formed on the other side of the metal layer. The flexible printed circuit board substrate according to the present invention can avoid the problem of substrate warpage caused by dimension variations frequently encountered by a conventional flexible printed circuit board substrate.

Abstract: The present invention relates to a solventless thermosetting photosensitive via-filling ink used in a hole-burying procedure in a printed circuit board (PCB) production process, and a method for filling a via using said via-filling ink. The solventless thermosetting photosensitive via-filling ink according to the present invention can be used to fill up the two ends of a via and form a rigid film by exposure to an ultraviolet light in order to protect the via-filling ink in the via from cross-linking, so that the via-filling ink will not flow out during a thermal baking process due to an insufficient viscosity of said ink. As a result, the via-filling ink thus formed has a smooth surface and a solid inside without void or hole formed therein.