Patents by Inventor Sylvain Bourdou

Sylvain Bourdou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8947881
    Abstract: A housing (1) for at least one electronic card (2), designed for the aeronautics field, of the type having a standardized width and including two lateral guides designed to work together with slides provided on the inner surfaces of an electronics bay, includes two half-shells, upper (4) and lower (5), pressed together at the lateral guides; the lower half-shell includes at least one bearing area (10) forming the housing for electronic cards; elements (19) for pressing each electronic card (2) in each corresponding housing and for pressing at least one heat sink (16) against the upper surface of at least one electronic card; the function of the body (5) is to take into account the mechanical stresses linked to the electronic cards hosted within the housing, and the function of the cover (4) is to ensure adequate thermal conductivity to allow heat produced by an electronic card in operation to be dissipated.
    Type: Grant
    Filed: April 6, 2010
    Date of Patent: February 3, 2015
    Assignee: European Aeronautic Defence and Space Company EADS France
    Inventors: Jesus Aspas Puertolas, Nicolas Maisonnave, Emile Colongo, Sylvain Bourdou
  • Publication number: 20120140417
    Abstract: A housing (1) for at least one electronic card (2), designed for the aeronautics field, of the type having a standardized width and including two lateral guides designed to work together with slides provided on the inner surfaces of an electronics bay, includes two half-shells, upper (4) and lower (5), pressed together at the lateral guides; the lower half-shell includes at least one bearing area (10) forming the housing for electronic cards; elements (19) for pressing each electronic card (2) in each corresponding housing and for pressing at least one heat sink (16) against the upper surface of at least one electronic card; the function of the body (5) is to take into account the mechanical stresses linked to the electronic cards hosted within the housing, and the function of the cover (4) is to ensure adequate thermal conductivity to allow heat produced by an electronic card in operation to be dissipated.
    Type: Application
    Filed: April 6, 2010
    Publication date: June 7, 2012
    Applicant: European Aeronautic Defence and Space Company Eads
    Inventors: Jesus Aspas Puertolas, Nicolas Maisonnave, Emile Colongo, Sylvain Bourdou