Patents by Inventor Sylvia Adae-Amoakoh
Sylvia Adae-Amoakoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6998290Abstract: A method for forming a flip-chip joinable substrate having non-plated-on contact pads. The substrate has an external metal foil layer upon a dielectric layer upon a patterned internal metal layer having an internal contact area. An area of the external metal foil layer above the internal contact area is selected. A microvia cavity extending to the internal contact area is perforated centrally within the selected area and is filled with a mass of conductive paste forming an external contact pad. The external contact pad is used as an etch mask for removing the adjacent external metal foil.Type: GrantFiled: November 18, 2003Date of Patent: February 14, 2006Assignee: International Business Machines CorporationInventors: Sylvia Adae-Amoakoh, John S. Kresge, Voya R. Markovich, Thurston B. Youngs, Jr.
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Patent number: 6753612Abstract: A flip-chip joinable substrate having non-plated-on contact pads. The substrate has an external metal foil layer upon a dielectric layer upon a patterned internal metal layer having an internal contact area. An area of the external metal foil layer above the internal contact area is selected. A microvia cavity extending to the internal contact area is perforated centrally within the selected area and is filled with a mass of conductive paste forming an external contact pad. The external contact pad is used as an etch mask for removing the adjacent external metal foil.Type: GrantFiled: April 5, 2001Date of Patent: June 22, 2004Assignee: International Business Machines CorporationInventors: Sylvia Adae-Amoakoh, John S. Kresge, Voya R. Markovich, Thurston B. Youngs, Jr.
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Publication number: 20040099960Abstract: A flip-chip joinable substrate having non-plated-on contact pads and a method for making the same. The substrate has an external metal foil layer upon a dielectric layer upon a patterned internal metal layer having an internal contact area. An area of the external metal foil layer above the internal contact area is selected. A microvia cavity extending to the internal contact area is perforated centrally within the selected area and is filled with a mass of conductive paste forming an external contact pad. The external contact pad is used as an etch mask for removing the adjacent external metal foil.Type: ApplicationFiled: November 18, 2003Publication date: May 27, 2004Inventors: Sylvia Adae-Amoakoh, John S. Kresge, Voya R. Markovich, Thurston B. Youngs
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Patent number: 6524352Abstract: A parallel capacitor structure capable of forming an internal part of a larger circuit board or the like structure to provide capacitance therefore. Alternatively, the capacitor may be used as an interconnector to interconnect two different electronic components (e.g., chip carriers, circuit boards, and even semiconductor chips) while still providing desired levels of capacitance for one or more of said components. The capacitor includes at least one internal conductive layer, two additional conductor layers added on opposite sides of the internal conductor, and inorganic dielectric material (preferably an oxide layer on the second conductor layer's outer surfaces or a suitable dielectric material such as barium titanate applied to the second conductor layers). Further, the capacitor includes outer conductor layers atop the inorganic dielectric material, thus forming a parallel capacitor between the internal and added conductive layers and the outer conductors.Type: GrantFiled: January 9, 2002Date of Patent: February 25, 2003Assignee: International Business Machines CorporationInventors: Sylvia Adae-Amoakoh, John M. Lauffer, Michael D. Lowell, Voya R. Markovich, Joseph J. Sniezek
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Publication number: 20020145203Abstract: A flip-chip joinable substrate having non-plated-on contact pads and a method for making the same. The substrate has an external metal foil layer upon a dielectric layer upon a patterned internal metal layer having an internal contact area. An area of the external metal foil layer above the internal contact area is selected. A microvia cavity extending to the internal contact area is perforated centrally within the selected area and is filled with a mass of conductive paste forming an external contact pad. The external contact pad is used as an etch mask for removing the adjacent external metal foil.Type: ApplicationFiled: April 5, 2001Publication date: October 10, 2002Applicant: International Business Machines CorporationInventors: Sylvia Adae-Amoakoh, John S. Kresge, Voya R. Markovich, Thurston B. Youngs
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Publication number: 20020054471Abstract: A parallel capacitor structure capable of forming an internal part of a larger circuit board or the like structure to provide capacitance therefore. Alternatively, the capacitor may be used as an interconnector to interconnect two different electronic components (e.g., chip carriers, circuit boards, and even semiconductor chips) while still providing desired levels of capacitance for one or more of said components. The capacitor includes at least one internal conductive layer, two additional conductor layers added on opposite sides of the internal conductor, and inorganic dielectric material (preferably an oxide layer on the second conductor layer's outer surfaces or a suitable dielectric material such as barium titanate applied to the second conductor layers). Further, the capacitor includes outer conductor layers atop the inorganic dielectric material, thus forming a parallel capacitor between the internal and added conductive layers and the outer conductors.Type: ApplicationFiled: January 9, 2002Publication date: May 9, 2002Applicant: International Business Machines CorporationInventors: Sylvia Adae-Amoakoh, John M. Lauffer, Michael D. Lowell, Voya R. Markovich, Joseph J. Sniezek
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Patent number: 6370012Abstract: A parallel capacitor structure capable of forming an internal part of a larger circuit board or the like structure to provide capacitance therefore. Alternatively, the capacitor may be used as an interconnector to interconnect two different electronic components (e.g., chip carriers, circuit boards, and even semiconductor chips) while still providing desired levels of capacitance for one or more of said components. The capacitor includes at least one internal conductive layer, two additional conductor layers added on opposite sides of the internal conductor, and inorganic dielectric material (preferably an oxide layer on the second conductor layer's outer surfaces or a suitable dielectric material such as barium titanate applied to the second conductor layers). Further, the capacitor includes outer conductor layers atop the inorganic dielectric material, thus forming a parallel capacitor between the internal and added conductive layers and the outer conductors.Type: GrantFiled: August 30, 2000Date of Patent: April 9, 2002Assignee: International Business Machines CorporationInventors: Sylvia Adae-Amoakoh, John M. Lauffer, Michael D. Lowell, Voya R. Markovich, Joseph J. Sniezek
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Patent number: 5792598Abstract: Photographic developing compositions are provided that are free of dihydroxybenzene developing agents and are used in the processing of photographic elements. The developing compositions have a pH in the range of from 10.1 to 10.9 and comprise at least 0.17 moles per liter of an ascorbic acid developing agent, 0.3 to 0.5 moles per liter of a sulfite and 0.2 to 0.4 moles per liter of a carbonate buffer. Also provided is an ecologically advantageous method for processing photographic elements which utilizes the non-toxic developing compositions.Type: GrantFiled: March 27, 1996Date of Patent: August 11, 1998Assignee: International Paper CompanyInventors: Sylvia Adae-Amoakoh, Bruce Mel Resnick
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Patent number: 5503966Abstract: Photographic developing compositions are provided that are free of dihydroxybenzene developing agents and are used in the processing of photographic elements. The developing compositions have a pH in the range of from 10.1 to 10.9 and comprise at least 0.17 moles per liter of an ascorbic acid developing agent, 0.3 to 0.5 moles per liter of a sulfite and 0.2 to 0.4 moles per liter of a carbonate buffer. Also provided is an ecologically advantageous method for processing photographic elements which utilizes the non-toxic developing compositions.Type: GrantFiled: July 22, 1994Date of Patent: April 2, 1996Assignee: International Paper CompanyInventors: Sylvia Adae-Amoakoh, Bruce M. Resnick