Patents by Inventor Syoichi Nishi
Syoichi Nishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220287212Abstract: A method for manufacturing a mounting board includes a first outer shape position acquisition step, a feature portion position acquisition step, a calculation step, a holding step, a second outer shape position acquisition step, and a mounting step. In the first outer shape position acquisition step, a first outer shape position of a component is acquired. In the feature portion position acquisition step, a position of a feature portion is acquired. In the calculation step, a deviation amount of the position of the feature portion with respect to the first outer shape position is calculated. In the second outer shape position acquisition step, a second outer shape position of the component is acquired. In the mounting step, the feature portion of the component is mounted to be positioned on a target position of a board based on the second outer shape position and the deviation amount.Type: ApplicationFiled: June 9, 2020Publication date: September 8, 2022Inventors: SYOICHI NISHI, HIDEKI SUMI, HIROSHI MURATA, KOJI SAKURAI, KENICHI ICHIKAWA
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Patent number: 10929970Abstract: A component mounting system includes a component mounter, and a server. The component mounter includes a component information recognizer, and a data output unit. The component information recognizer recognizes component information by imaging a character of the component information printed on a surface of a component. The data output unit outputs the component information together with board information to the server, the component information being recognized by the component information recognizer, the board information being information of a board on which the component is installed.Type: GrantFiled: January 9, 2019Date of Patent: February 23, 2021Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Mitsuo Nakamura, Syoichi Nishi, Noboru Higashi
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Publication number: 20190228520Abstract: A component mounting system includes a component mounter, and a server. The component mounter includes a component information recognizer, and a data output unit. The component information recognizer recognizes component information by imaging a character of the component information printed on a surface of a component. The data output unit outputs the component information together with board information to the server, the component information being recognized by the component information recognizer, the board information being information of a board on which the component is installed.Type: ApplicationFiled: January 9, 2019Publication date: July 25, 2019Inventors: Mitsuo Nakamura, Syoichi Nishi, Noboru Higashi
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Patent number: 8371027Abstract: In an electronic components mounting process fabricating a mount circuit board due to an electronic components mounting system formed of a plurality of electronic components mounting apparatuses by connecting them to each other, data of solder paste position which is printed on the circuit board is transmitted as feedforward data to an electronic components placement apparatus and a placement state inspecting apparatus. A control parameter which controls a placing position in a components placement operation due to the electronic components placement apparatus and an inspection parameter which indicates a standard position of the components in a placement state inspection are updated on the basis of the soldering position data. Therefore, it is possible to achieve a precise mounting by effectively and properly using inspection information obtained from each process.Type: GrantFiled: April 12, 2007Date of Patent: February 12, 2013Assignee: Panasonic CorporationInventors: Masafumi Inoue, Mitsuhaya Tsukamoto, Masahiro Kihara, Syoichi Nishi
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Patent number: 8240543Abstract: Regarding electronic component mounting in which an electronic component having plural solder bumps for external connection on its lower surface is mounted on a board, in an electronic component mounting operation of previously measuring the height position of solder paste on the board on which the solder paste has been printed, and mounting the electronic component on the board on which the solder paste has been printed by a loading head, whether the transfer of the solder paste to the solder bumps is necessary or not is judged on the basis of the measurement result of the height of the solder paste. In case that it is judged that the transfer is necessary, the transfer of the solder paste is executed, and thereafter the electronic component is mounted on the board. Hereby, it is possible to prevent the poor joint in case that a thin-sized semiconductor package which causes easily warp deformation is mounted on the board by soldering.Type: GrantFiled: March 26, 2007Date of Patent: August 14, 2012Assignee: Panasonic CorporationInventors: Syoichi Nishi, Mitsuhaya Tsukamoto, Masahiro Kihara, Masafumi Inoue
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Patent number: 8020286Abstract: One objective of the present invention is to provide an electronic component mounting system and an electronic component mounting method that can prevent a mounting defect due to a positioning error in the direction of the thickness of a substrate, and that can deliver a specific mounting quality. According to an electronic component mounting system, which is constituted by coupling a plurality of apparatuses used for mounting electronic components, the height measurement device 22 of a printing inspection apparatus measures the heights at height measurement points, designated on the upper face of a substrate, and outputs the measurement results as substrate height data.Type: GrantFiled: December 20, 2006Date of Patent: September 20, 2011Assignee: Panasonic CorporationInventors: Masafumi Inoue, Mitsuhaya Tsukamoto, Syoichi Nishi, Masahiro Kihara
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Patent number: 7870991Abstract: In a mounting system having a height measuring instrument for measuring the height of solder paste printed on the electrodes and an electronic component placing apparatus, whether the height of solder paste is right or wrong is determined based on the measurement result of measuring the height of solder paste printed on the electrode. Further, whether or not the transfer of solder paste to the solder bump is required based on the determination result, and if it is determined that the transfer is required, the paste is transferred to an electronic component held in a mounting head. Thereby, the mounting quality can be assured by adding adequately an amount of solder in treating the board causing a shortage of the solder amount due to printing failure.Type: GrantFiled: September 6, 2007Date of Patent: January 18, 2011Assignee: Panasonic CorporationInventors: Kazuo Okamoto, Syoichi Nishi, Takeshi Morita, Masanori Hiyoshi, Kazuhiko Tomoyasu
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Publication number: 20100230472Abstract: In a mounting system having a height measuring instrument for measuring the height of solder paste printed on the electrodes and an electronic component placing apparatus, whether the height of solder paste is right or wrong is determined based on the measurement result of measuring the height of solder paste printed on the electrode. Further, whether or not the transfer of solder paste to the solder bump is required based on the determination result, and if it is determined that the transfer is required, the paste is transferred to an electronic component held in a mounting head. Thereby, the mounting quality can be assured by adding adequately an amount of solder in treating the board causing a shortage of the solder amount due to printing failure.Type: ApplicationFiled: September 6, 2007Publication date: September 16, 2010Applicant: PANASONIC CORPORATIONInventors: Kazuo Okamoto, Syoichi Nishi, Takeshi Morita, Masanori Hiyoshi, Kazuhiko Tomoyasu
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Patent number: 7793817Abstract: To provide an electronic component placing apparatus and an electronic component mounting method that can prevent a cold joint from occurring when an electronic component likely to cause warp deformation is mounted by means of soldering. In the electronic component placing apparatus for placing the electronic component 16 with a plurality of solder bumps 16a formed on a lower surface on a board, a film 7a having a film thickness distribution for transferring a desired transfer amount of solder paste according to a state of warp deformation to each of the plurality of solder bumps is formed in a paste transfer unit 24, based on the component warp information indicating the state of warp deformation in a reflow process of the electronic component. Thereby, it is possible to prevent a cold joint from occurring when the electronic component likely to cause warp deformation is mounted by means of soldering by additionally supplying a just enough amount of solder to each solder bump 16a.Type: GrantFiled: September 6, 2007Date of Patent: September 14, 2010Assignee: Panasonic CorporationInventors: Kazuo Okamoto, Syoichi Nishi, Takeshi Morita, Masanori Hiyoshi, Kazuhiko Tomoyasu
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Publication number: 20100163602Abstract: To provide an electronic component placing apparatus and an electronic component mounting method that can prevent a cold joint from occurring when an electronic component likely to cause warp deformation is mounted by means of soldering. In the electronic component placing apparatus for placing the electronic component 16 with a plurality of solder bumps 16a formed on a lower surface on a board, a film 7a having a film thickness distribution for transferring a desired transfer amount of solder paste according to a state of warp deformation to each of the plurality of solder bumps is formed in a paste transfer unit 24, based on the component warp information indicating the state of warp deformation in a reflow process of the electronic component. Thereby, it is possible to prevent a cold joint from occurring when the electronic component likely to cause warp deformation is mounted by means of soldering by additionally supplying a just enough amount of solder to each solder bump 16a.Type: ApplicationFiled: September 6, 2007Publication date: July 1, 2010Applicant: PANASONIC CORPORATIONInventors: Kazuo Okamoto, Syoichi Nishi, Takeshi Morita, Masanori Hiyoshi, Kazuhiko Tomoyasu
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Publication number: 20090293265Abstract: One objective of the present invention is to provide an electronic component mounting system and an electronic component mounting method that can prevent a mounting defect due to a positioning error in the direction of the thickness of a substrate, and that can deliver a specific mounting quality. According to an electronic component mounting system, which is constituted by coupling a plurality of apparatuses used for mounting electronic components, the height measurement device 22 of a printing inspection apparatus measures the heights at height measurement points, designated on the upper face of a substrate, and outputs the measurement results as substrate height data.Type: ApplicationFiled: December 20, 2006Publication date: December 3, 2009Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO.Inventors: Masafumi Inoue, Mitsuhaya Tsukamoto, Syoichi Nishi, Masahiro Kihara
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Publication number: 20090064489Abstract: In an electronic components mounting process fabricating a mount circuit board due to an electronic components mounting system formed of a plurality of electronic components mounting apparatuses by connecting them to each other, data of solder paste position which is printed on the circuit board is transmitted as feedforward data to an electronic components placement apparatus and a placement state inspecting apparatus. A control parameter which controls a placing position in a components placement operation due to the electronic components placement apparatus and an inspection parameter which indicates a standard position of the components in a placement state inspection are updated on the basis of the soldering position data. Therefore, it is possible to achieve a precise mounting by effectively and properly using inspection information obtained from each process.Type: ApplicationFiled: April 12, 2007Publication date: March 12, 2009Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Masafumi Inoue, Mitsuhaya Tsukamoto, Masahiro Kihara, Syoichi Nishi
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Publication number: 20090014501Abstract: Regarding electronic component mounting in which an electronic component having plural solder bumps for external connection on its lower surface is mounted on a board, in an electronic component mounting operation of previously measuring the height position of solder paste on the board on which the solder paste has been printed, and mounting the electronic component on the board on which the solder paste has been printed by a loading head, whether the transfer of the solder paste to the solder bumps is necessary or not is judged on the basis of the measurement result of the height of the solder paste. In case that it is judged that the transfer is necessary, the transfer of the solder paste is executed, and thereafter the electronic component is mounted on the board. Hereby, it is possible to prevent the poor joint in case that a thin-sized semiconductor package which causes easily warp deformation is mounted on the board by solder-joint.Type: ApplicationFiled: March 26, 2007Publication date: January 15, 2009Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Syoichi Nishi, Mitsuhaya Tsukamoto, Masahiro Kihara, Masafumi Inoue