Abstract: A radio-frequency module includes a module substrate having major surfaces opposite to each other; a module substrate having major surfaces opposite to each other, the major surface being disposed facing the major surface; a first electronic component disposed on the major surface; a second electronic component that includes a first electrode joined to the major surface and a second electrode joined to the major surface and that is disposed between the major surfaces; and a third electronic component disposed on the major surface; and an external connection terminal disposed on the major surface. The second electronic component is at least one of a chip inductor, a chip capacitor, and a chip resistor. The second electronic component is coupled via the first electrode to the first electronic component and is coupled via the second electrode to the third electronic component or external connection terminal.

Abstract: A radio-frequency module includes a module substrate having a first major surface and a second major surface, a receive filter, a low-noise amplifier, an antenna switch, a first matching circuit disposed on the input side of the receive filter, a second matching circuit disposed on the output side of the receive filter, and a control circuit. The receive filter and the first and second matching circuits are arranged at the first major surface. The low-noise amplifier, the antenna switch, and the control circuit are arranged at the second major surface. When the module substrate is viewed in plan view, the receive filter is positioned between the first and second matching circuits, the control circuit is positioned between the antenna switch and the low-noise amplifier, and respective footprints of the second matching circuit and the low-noise amplifier coincide with each other.

Abstract: A radio-frequency module includes a module substrate having a first major surface and a second major surface, a first receive filter configured to pass a receive signal in a first communication band, a second receive filter configured to pass a receive signal in a second communication band, an antenna switch configured to control connection between the first receive filter and an antenna connection terminal and also control connection between the second receive filter and the antenna connection terminal, and a matching circuit coupled between the antenna connection terminal and the first receive filter. The matching circuit includes matching switches and at least one of an inductor and a capacitor. The first receive filter and the second receive filter are disposed at the first major surface. The antenna switch and the matching switches are included in a single semiconductor integrated circuit disposed at the second major surface.

Abstract: A high-frequency module includes a substrate having a mounting surface, a laminated component disposed on the mounting surface, and a wiring, in which the laminated component includes a lower stage component, and an upper stage component disposed on the lower stage component, the lower stage component includes a lower surface 31 facing the mounting surface, an upper surface facing the lower surface 31 back to back, and a connection terminal 33 provided on the lower surface 31, the upper stage component includes a lower surface 41 facing the upper surface, and a connection terminal 43 provided on the lower surface 41, and the wiring is provided on the upper surface, and is connected with the connection terminal 43.

Abstract: Reduced in size is a radio frequency component provided on a main surface of a mounting substrate on which an external connection electrode is disposed. A radio frequency module includes a mounting substrate, a first radio frequency component, and an external connection electrode. The mounting substrate has a first main surface and a second main surface opposed to each other. The first radio frequency component has a signal terminal and a ground terminal. The first radio frequency component is provided on the second main surface. The external connection electrode is provided on the second main surface. The first radio frequency component has a third main surface and a fourth main surface opposed to each other. The signal terminal is provided on the third main surface. The ground terminal is provided on the fourth main surface.

Abstract: A radio-frequency module includes a module substrate having a first major surface and a second major surface, a receive filter, a low-noise amplifier, an antenna switch, a first matching circuit disposed on the input side of the receive filter, a second matching circuit disposed on the output side of the receive filter, and a control circuit. The receive filter and the first and second matching circuits are arranged at the first major surface. The low-noise amplifier, the antenna switch, and the control circuit are arranged at the second major surface. When the module substrate is viewed in plan view, the receive filter is positioned between the first and second matching circuits, the control circuit is positioned between the antenna switch and the low-noise amplifier, and respective footprints of the second matching circuit and the low-noise amplifier coincide with each other.

Abstract: A radio-frequency module includes a module substrate having a first major surface and a second major surface, a first receive filter configured to pass a receive signal in a first communication band, a second receive filter configured to pass a receive signal in a second communication band, an antenna switch configured to control connection between the first receive filter and an antenna connection terminal and also control connection between the second receive filter and the antenna connection terminal, and a matching circuit coupled between the antenna connection terminal and the first receive filter. The matching circuit includes matching switches and at least one of an inductor and a capacitor. The first receive filter and the second receive filter are disposed at the first major surface. The antenna switch and the matching switches are included in a single semiconductor integrated circuit disposed at the second major surface.

Abstract: A high-frequency module (1) includes a substrate (10), a first electronic component (13) and a second electronic component (14) that are provided on the substrate (10), an insulating layer (15) that covers a part of a side surface of the first electronic component (13) and a side surface and a top surface of the second electronic component (14), and a heat-dissipating layer (16) that covers at least a top surface of the first electronic component (13) and a portion of the side surface of the first electronic component (13) excluding the portion of the side surface of the first electronic component (13) in contact with the insulating layer (15).

Abstract: A high-frequency module that performs filtering of signals transmitted and received through an antenna includes an antenna terminal, a transmission terminal, a reception terminal, a reception filter connected between the antenna terminal and the reception terminal, a transmission filter connected between the antenna terminal and the transmission terminal, a first element connected between the antenna terminal and the transmission filter, and a second element connected in series between the transmission terminal and the transmission filter. The first element and the second element are capacitively coupled to each other.

Abstract: A high-frequency module includes a substrate having a mounting surface, a laminated component disposed on the mounting surface, and a wiring, in which the laminated component includes a lower stage component, and an upper stage component disposed on the lower stage component, the lower stage component includes a lower surface 31 facing the mounting surface, an upper surface facing the lower surface 31 back to back, and a connection terminal 33 provided on the lower surface 31, the upper stage component includes a lower surface 41 facing the upper surface, and a connection terminal 43 provided on the lower surface 41, and the wiring is provided on the upper surface, and is connected with the connection terminal 43.

Abstract: A high-frequency module (1) includes a substrate (10), a first electronic component (13) and a second electronic component (14) that are provided on the substrate (10), an insulating layer (15) that covers a part of a side surface of the first electronic component (13) and a side surface and a top surface of the second electronic component (14), and a heat-dissipating layer (16) that covers at least a top surface of the first electronic component (13) and a portion of the side surface of the first electronic component (13) excluding the portion of the side surface of the first electronic component (13) in contact with the insulating layer (15).

Abstract: In an electronic component, a peripheral portion of an external terminal electrode is thicker than a center portion thereof, and at least a portion of the peripheral portion is buried in a component main body. A surface of the external terminal electrode and a principal surface of the component main body are located on the same plane. An electrically insulating coating layer is arranged along the principal surface of the component main body so as to cover at least a portion of the peripheral portion of the external terminal electrode. An end portion of the coating layer is in contact with a thickest portion of the peripheral portion of the external terminal electrode in the principal surface of the component main body. The coating layer and the surface of the external terminal electrode are located on the same plane.

Abstract: A high-frequency module that performs filtering of signals transmitted and received through an antenna includes an antenna terminal, a transmission terminal, a reception terminal, a reception filter connected between the antenna terminal and the reception terminal, a transmission filter connected between the antenna terminal and the transmission terminal, a first element connected between the antenna terminal and the transmission filter, and a second element connected in series between the transmission terminal and the transmission filter. The first element and the second element are capacitively coupled to each other.

Abstract: An inductor that adjust characteristics of a transmit filter circuit is disposed so that the inductor and at least one of common paths, a matching circuit, a receive filter circuit, and receive paths connected to an output terminal of the transmit filter circuit define a propagation path due to magnetic-field coupling and/or electric-field coupling. This configuration does not require the addition of a circuit device to define the propagation path. It is thus possible to improve attenuation characteristics for an RF signal outside the frequency band of a transmitting signal and to improve isolation characteristics between a transmit filter circuit and a receive filter circuit without increasing the size of a radio-frequency module.

Abstract: An inductor that adjust characteristics of a transmit filter circuit is disposed so that the inductor and at least one of common paths, a matching circuit, a receive filter circuit, and receive paths connected to an output terminal of the transmit filter circuit define a propagation path due to magnetic-field coupling and/or electric-field coupling. This configuration does not require the addition of a circuit device to define the propagation path. It is thus possible to improve attenuation characteristics for an RF signal outside the frequency band of a transmitting signal and to improve isolation characteristics between a transmit filter circuit and a receive filter circuit without increasing the size of a radio-frequency module.

Abstract: A high-frequency module includes a multilayer substrate, a filter substrate, a cover layer, a connection electrode, and inductors. The filter substrate includes a first principal surface on which an IDT electrode included in a filter unit is disposed, and the first principal surface faces a mounting surface of the multilayer substrate. The cover layer is spaced apart from and opposite to the first principal surface of the filter substrate. The connection electrode connects the multilayer substrate and the filter substrate. One of the inductors is connected between the filter unit and a first external connection terminal. Another one of the inductors is connected between the filter unit and the ground. The inductors are disposed inside the multilayer substrate. The inductors are inductively coupled to each other.

Abstract: In a circuit module, even if a transmission signal output from a transmission electrode of a mounting substrate to a transmission terminal of a splitter leaks into a ground electrode, the transmission signal that has leaked into the ground electrode flows into via conductors that are connected along an edge portion of the ground electrode close to the transmission electrode and connected to a ground line of a motherboard. Therefore, the transmission signal that has been output from the transmission electrode and leaked into the ground electrode is prevented from traveling along an edge portion of the ground electrode toward a reception electrode side. Thus, characteristics of isolation between the transmission electrode and the reception electrode provided on the mounting substrate on which the splitter is mounted are improved.

Abstract: A high-frequency module includes a multilayer substrate, a filter substrate, a cover layer, a connection electrode, and inductors. The filter substrate includes a first principal surface on which an IDT electrode included in a filter unit is disposed, and the first principal surface faces a mounting surface of the multilayer substrate. The cover layer is spaced apart from and opposite to the first principal surface of the filter substrate. The connection electrode connects the multilayer substrate and the filter substrate. One of the inductors is connected between the filter unit and a first external connection terminal. Another one of the inductors is connected between the filter unit and the ground. The inductors are disposed inside the multilayer substrate. The inductors are inductively coupled to each other.

Abstract: In an electronic component, a peripheral portion of an external terminal electrode is thicker than a center portion thereof, and at least a portion of the peripheral portion is buried in a component main body. A surface of the external terminal electrode and a principal surface of the component main body are located on the same plane. An electrically insulating coating layer is arranged along the principal surface of the component main body so as to cover at least a portion of the peripheral portion of the external terminal electrode. An end portion of the coating layer is in contact with a thickest portion of the peripheral portion of the external terminal electrode in the principal surface of the component main body. The coating layer and the surface of the external terminal electrode are located on the same plane.

Abstract: In a circuit module, even if a transmission signal output from a transmission electrode of a mounting substrate to a transmission terminal of a splitter leaks into a ground electrode, the transmission signal that has leaked into the ground electrode flows into via conductors that are connected along an edge portion of the ground electrode close to the transmission electrode and connected to a ground line of a motherboard. Therefore, the transmission signal that has been output from the transmission electrode and leaked into the ground electrode is prevented from traveling along an edge portion of the ground electrode toward a reception electrode side. Thus, characteristics of isolation between the transmission electrode and the reception electrode provided on the mounting substrate on which the splitter is mounted are improved.