Patents by Inventor Syuji ENOKIDA

Syuji ENOKIDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dry-etching method
    Patent number: 10192749
    Abstract: According to the present invention, a dry-etching method for performing plasma etching in a vertical profile while maintaining selectivity relative to a mask, includes: a first process of etching a film to be etched with use of reactive gas to cause an etching profile of the film to be etched to be formed in a footing profile; and a second process of, after the first process, causing the footing profile to be formed in a vertical profile by means of sputtering etching.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: January 29, 2019
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Kenichi Kuwahara, Syuji Enokida
  • DRY-ETCHING METHOD
    Publication number: 20170162397
    Abstract: According to the present invention, a dry-etching method for performing plasma etching in a vertical profile while maintaining selectivity relative to a mask, includes: a first process of etching a film to be etched with use of reactive gas to cause an etching profile of the film to be etched to be formed in a footing profile; and a second process of, after the first process, causing the footing profile to be formed in a vertical profile by means of sputtering etching.
    Type: Application
    Filed: August 26, 2016
    Publication date: June 8, 2017
    Inventors: Kenichi KUWAHARA, Syuji ENOKIDA