Patents by Inventor Syuji Katase

Syuji Katase has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer interconnection structure and method for forming the same
    Patent number: 7514355
    Abstract: A multilayer interconnection structure of the present invention includes first interconnection, second interconnection belonging to an interconnection layer different from an interconnection layer to which the first layer belongs, and third interconnection for connecting the first and second interconnections, the third interconnection belonging to a different interconnection layer and including interconnection along a body diagonal for connecting two points in different planes belong to different interconnection layers. A method for producing the multilayer interconnection structure includes a step of forming the third interconnection, the step including a step of forming a through hole along the body diagonal, and a step of filling the through hole with a conductive material.
    Type: Grant
    Filed: June 10, 2005
    Date of Patent: April 7, 2009
    Assignee: Fujitsu Microelectronics Limited
    Inventors: Syuji Katase, Kouichi Suzuki, Kenji Chichii, Katsuji Tabara
  • Multilayer interconnection structure and method for forming the same
    Publication number: 20050287800
    Abstract: A multilayer interconnection structure of the present invention includes first interconnection, second interconnection belonging to an interconnection layer different from an interconnection layer to which the first layer belongs, and third interconnection for connecting the first and second interconnections, the third interconnection belonging to a different interconnection layer and including interconnection along a body diagonal for connecting two points in different planes belong to different interconnection layers. A method for producing the multilayer interconnection structure includes a step of forming the third interconnection, the step including a step of forming a through hole along the body diagonal, and a step of filling the through hole with a conductive material.
    Type: Application
    Filed: June 10, 2005
    Publication date: December 29, 2005
    Applicant: FUJITSU LIMITED
    Inventors: Syuji Katase, Kouichi Suzuki, Kenji Chichii, Katsuji Tabara