Patents by Inventor Syunichi Kuramoto

Syunichi Kuramoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and method of producing the same
    Patent number: 6191494
    Abstract: A semiconductor device and a method of producing the same are provided. The semiconductor device includes: a semiconductor chip; a resin package which seals the semiconductor chip; signal passages which guide the signal terminals of the semiconductor chip outward from the resin package; a grounding metal film in contact with the bottom surface of the semiconductor chip; and a grounding passage which is connected to the grounding metal film and guided outward from the resin package.
    Type: Grant
    Filed: June 29, 1999
    Date of Patent: February 20, 2001
    Assignee: Fujitsu Limited
    Inventors: Nobuo Ooyama, Shinichiro Maki, Fumitoshi Fujisaki, Syunichi Kuramoto, Yukio Saigo, Yasuo Yatsuda, Youichi Matae, Atsushi Yano, Kazuto Tsuji, Masafumi Tetaka