Patents by Inventor Syunsuke Hirano
Syunsuke Hirano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11990349Abstract: A method for manufacturing a package substrate including an insulating layer and a wiring conductor, including: forming, on one or both sides of a core resin layer, a substrate including a peelable first metal layer that has a thickness of 1-70 ?m, a first insulating resin layer, and a second metal layer; forming a non-through hole reaching a surface of the first metal layer, performing electrolytic and/or electroless copper plating on its inner wall, and connecting the second and first metal layers; arranging a second insulating resin layer and a third metal layer and heating and pressurizing the first substrate to form a substrate; forming a non-through hole reaching a surface of the second metal layer, performing electrolytic and/or electroless copper plating on its inner wall, and connecting the second and third metal layers; peeling a third substrate; and patterning the first and third metal layers to form the wiring conductor.Type: GrantFiled: October 21, 2019Date of Patent: May 21, 2024Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Syunsuke Hirano, Yoshihiro Kato, Takaaki Ogashiwa
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Patent number: 11877396Abstract: Provided is a laminate containing a first resin composition layer, a heat-resistant film layer, and a second resin composition layer laminated in the presented order, wherein the first resin composition layer is in a semi-cured state (B stage), and a difference between a maximum thickness and a minimum thickness of the first resin composition layer is 0.5 to 5 ?m; and the second resin composition layer is in a semi-cured state (B stage), and a difference between a maximum thickness and a minimum thickness of the second resin composition layer is 0.5 to 5 ?m.Type: GrantFiled: August 16, 2019Date of Patent: January 16, 2024Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Syunsuke Hirano, Yoshihiro Kato, Takaaki Ogashiwa
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Patent number: 11664240Abstract: The method for producing a laminate having a patterned metal foil includes masking the whole surface of a first metal foil in a laminate having the first metal foil, a first insulating resin layer having a thickness of 1 to 200 ?m and a second metal foil laminated in this order, and patterning the second metal foil.Type: GrantFiled: November 1, 2018Date of Patent: May 30, 2023Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Syunsuke Hirano, Yoshihiro Kato, Takaaki Ogashiwa, Kazuaki Kawashita, Makoto Murakami
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Publication number: 20220051958Abstract: A method for producing a package substrate for mounting a semiconductor device includes: forming a first substrate by forming a laminate in which a first metal layer that has a thickness of 1 ?m to 70 ?m and that is peelable from a core resin layer, a first insulating resin layer, and a second metal layer are arranged on both sides of the core resin layer having a thickness of 1 ?m to 80 ?m, and heating and pressurizing the laminate simultaneously; forming a pattern on the second metal layer; forming a second substrate by heating and pressurizing a laminate formed by arranging a second insulating resin layer and a third metal layer on a surface of the second metal layer; and peeling, from the core resin layer, a third substrate including the first metal and insulating resin layers, the second metal and insulating layers, and the third metal layer.Type: ApplicationFiled: October 21, 2019Publication date: February 17, 2022Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Syunsuke HIRANO, Yoshihiro KATO, Takaaki OGASHIWA
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Publication number: 20220020602Abstract: A method for manufacturing a package substrate including an insulating layer and a wiring conductor, including: forming, on one or both sides of a core resin layer, a substrate including a peelable first metal layer that has a thickness of 1-70 ?m, a first insulating resin layer, and a second metal layer; forming a non-through hole reaching a surface of the first metal layer, performing electrolytic and/or electroless copper plating on its inner wall, and connecting the second and first metal layers; arranging a second insulating resin layer and a third metal layer and heating and pressurizing the first substrate to form a substrate; forming a non-through hole reaching a surface of the second metal layer, performing electrolytic and/or electroless copper plating on its inner wall, and connecting the second and third metal layers; peeling a third substrate; and patterning the first and third metal layers to form the wiring conductor.Type: ApplicationFiled: October 21, 2019Publication date: January 20, 2022Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Syunsuke HIRANO, Yoshihiro KATO, Takaaki OGASHIWA
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Patent number: 11217445Abstract: A method for manufacturing a package substrate for mounting a semiconductor device including: a first laminate preparing step of preparing a first laminate including a resin layer, a bonding layer that is provided on at least one surface side of the resin layer and includes peeling means, and a first metal layer provided on the bonding layer; a first wiring forming step of forming a first wiring conductor in the first laminate by etching the first metal layer; a second laminate forming step of forming a second laminate by laminating an insulating resin layer and a second metal layer in this order on a surface of the first laminate, the surface being provided with the first wiring conductor; a second wiring forming step of forming a second wiring conductor on the insulating resin layer by forming a non-through hole in the insulating resin layer.Type: GrantFiled: August 4, 2017Date of Patent: January 4, 2022Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Syunsuke Hirano, Yoshihiro Kato, Takaaki Ogashiwa, Kazuaki Kawashita, Youichi Nakajima
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Patent number: 11197379Abstract: The method for producing a printed wiring board according to the present invention with use of a metal-clad laminated sheet including a metal foil laminated on each of both surfaces of an insulating resin base material, the method at least including: a step (1) of irradiating a predetermined position in a surface (A) of the metal-clad laminated sheet with a laser to provide a via hole leading to the metal foil in a surface opposite to the surface (A); and a step (2) of irradiating a predetermined position in a surface (B), located in the opposite side to the surface (A), of the metal-clad laminated sheet with a laser to provide a via hole leading to the metal foil in a surface opposite to the surface (B).Type: GrantFiled: March 29, 2018Date of Patent: December 7, 2021Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Kazuaki Kawashita, Takaaki Ogashiwa, Syunsuke Hirano, Yoshihiro Kato
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Publication number: 20210257207Abstract: A method for manufacturing a package substrate for mounting a semiconductor device including: a first laminate preparing step of preparing a first laminate including a resin layer, a bonding layer that is provided on at least one surface side of the resin layer and includes peeling means, and a first metal layer provided on the bonding layer; a first wiring forming step of forming a first wiring conductor in the first laminate by etching the first metal layer; a second laminate forming step of forming a second laminate by laminating an insulating resin layer and a second metal layer in this order on a surface of the first laminate, the surface being provided with the first wiring conductor; a second wiring forming step of forming a second wiring conductor on the insulating resin layer by forming a non-through hole in the insulating resin layer.Type: ApplicationFiled: April 9, 2021Publication date: August 19, 2021Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Syunsuke HIRANO, Yoshihiro KATO, Takaaki OGASHIWA, Kazuaki KAWASHITA, Youichi NAKAJIMA
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Publication number: 20210204404Abstract: Provided is a laminate containing a first resin composition layer, a heat-resistant film layer, and a second resin composition layer laminated in the presented order, wherein the first resin composition layer is in a semi-cured state (B stage), and a difference between a maximum thickness and a minimum thickness of the first resin composition layer is 0.5 to 5 ?m; and the second resin composition layer is in a semi-cured state (B stage), and a difference between a maximum thickness and a minimum thickness of the second resin composition layer is 0.5 to 5 ?m.Type: ApplicationFiled: August 16, 2019Publication date: July 1, 2021Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Syunsuke HIRANO, Yoshihiro KATO, Takaaki OGASHIWA
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Publication number: 20200388506Abstract: The method for producing a laminate having a patterned metal foil includes masking the whole surface of a first metal foil in a laminate having the first metal foil, a first insulating resin layer having a thickness of 1 to 200 ?m and a second metal foil laminated in this order, and patterning the second metal foil.Type: ApplicationFiled: November 1, 2018Publication date: December 10, 2020Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Syunsuke HIRANO, Yoshihiro KATO, Takaaki OGASHIWA, Kazuaki KAWASHITA, Makoto MURAKAMI
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Patent number: 10727081Abstract: A method for manufacturing a package substrate for mounting a semiconductor device, including a substrate forming step (a) of forming a supporting substrate for circuit formation including a first insulating resin layer, a release layer including at least a silicon compound, and ultrathin copper foil having a thickness of 1 ?m to 5 ?m, in this order; a first wiring conductor forming step (b) of forming a first wiring conductor on the ultrathin copper foil of the supporting substrate for circuit formation by pattern copper electroplating; a lamination step (c) of disposing a second insulating resin layer so as to be in contact with the first wiring conductor, and heating and pressurizing the second insulating resin layer for lamination; a second wiring conductor forming step (d) of forming in the second insulating resin layer a non-through hole reaching the first wiring conductor and connecting an inner wall of the non-through hole.Type: GrantFiled: June 23, 2017Date of Patent: July 28, 2020Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Syunsuke Hirano, Yoshihiro Kato, Takaaki Ogashiwa, Kazuaki Kawashita, Youichi Nakajima
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Publication number: 20200043752Abstract: A support including a heat resistant film layer and a resin layer, wherein the heat resistant film layer is laminated on at least one side (a first side) of the resin layer, and the resin layer is in a semi-cured state (B stage).Type: ApplicationFiled: April 23, 2018Publication date: February 6, 2020Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Syunsuke HIRANO, Yoshihiro KATO, Takaaki OGASHIWA, Kazuaki KAWASHITA
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Publication number: 20200015363Abstract: The method for producing a printed wiring board according to the present invention with use of a metal-clad laminated sheet including a metal foil laminated on each of both surfaces of an insulating resin base material, the method at least including: a step (1) of irradiating a predetermined position in a surface (A) of the metal-clad laminated sheet with a laser to provide a via hole leading to the metal foil in a surface opposite to the surface (A); and a step (2) of irradiating a predetermined position in a surface (B), located in the opposite side to the surface (A), of the metal-clad laminated sheet with a laser to provide a via hole leading to the metal foil in a surface opposite to the surface (B).Type: ApplicationFiled: March 29, 2018Publication date: January 9, 2020Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Kazuaki KAWASHITA, Takaaki OGASHIWA, Syunsuke HIRANO, Yoshihiro KATO
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Publication number: 20190181000Abstract: A method for manufacturing a package substrate for mounting a semiconductor device including: a first laminate preparing step of preparing a first laminate including a resin layer, a bonding layer that is provided on at least one surface side of the resin layer and includes peeling means, and a first metal layer provided on the bonding layer; a first wiring forming step of forming a first wiring conductor in the first laminate by etching the first metal layer; a second laminate forming step of forming a second laminate by laminating an insulating resin layer and a second metal layer in this order on a surface of the first laminate, the surface being provided with the first wiring conductor; a second wiring forming step of forming a second wiring conductor on the insulating resin layer by forming a non-through hole in the insulating resin layer.Type: ApplicationFiled: August 4, 2017Publication date: June 13, 2019Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Syunsuke HIRANO, Yoshihiro KATO, Takaaki OGASHIWA, Kazuaki KAWASHITA, Youichi NAKAJIMA
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Publication number: 20190148169Abstract: A method for manufacturing a package substrate for mounting a semiconductor device, including a substrate forming step (a) of forming a supporting substrate for circuit formation including a first insulating resin layer, a release layer including at least a silicon compound, and ultrathin copper foil having a thickness of 1 ?m to 5 ?m, in this order; a first wiring conductor forming step (b) of forming a first wiring conductor on the ultrathin copper foil of the supporting substrate for circuit formation by pattern copper electroplating; a lamination step (c) of disposing a second insulating resin layer so as to be in contact with the first wiring conductor, and heating and pressurizing the second insulating resin layer for lamination; a second wiring conductor forming step (d) of forming in the second insulating resin layer a non-through hole reaching the first wiring conductor and connecting an inner wall of the non-through hole.Type: ApplicationFiled: June 23, 2017Publication date: May 16, 2019Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Syunsuke HIRANO, Yoshihiro KATO, Takaaki OGASHIWA, Kazuaki KAWASHITA, Youichi NAKAJIMA
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Publication number: 20150210832Abstract: The present invention provides a resin sheet that exhibits a small reduction in light reflectance due to a heating treatment and a light irradiation treatment with an excellent heat resistance being maintained. The present invention provides a resin sheet including a layer including a resin composition containing an aliphatic epoxy-modified silicone compound (A), a branched imide resin having an isocyanurate group and a carboxyl group (B), titanium dioxide (C) and a wetting and dispersing agent (D).Type: ApplicationFiled: August 13, 2013Publication date: July 30, 2015Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Keisuke Takada, Syunsuke Hirano, Koji Morishita, Hidetoshi Kawai, Yuichi Koga, Yoshihiro Kato
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Publication number: 20150056454Abstract: Provided are a resin composition that can realize a prepreg, a metal foil-clad laminate and the like high in light reflectance in an ultraviolet region and in a visible light region, small in the reduction in light reflectance due to a heating treatment and a light irradiation treatment, good in peel strength of metal foil, also excellent in heat resistance after moisture absorption, also good in outer appearance, and also excellent in preservation stability, and a prepreg, a metal foil-clad laminate and the like using the same. The resin composition of the present invention contains at least an epoxy-modified silicone compound (A), a branched imide resin (B) having an isocyanurate group and a carboxyl group, a phosphorus curing accelerator (C), titanium dioxide (D) and a dispersant (E). The branched imide resin (B) is preferably at least one selected from the group consisting of an epoxy-modified branched imide resin, an alcohol-modified branched imide resin and an amine-modified branched imide resin.Type: ApplicationFiled: March 12, 2013Publication date: February 26, 2015Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Keisuke Takada, Syunsuke Hirano, Koji Morishita, Hidetoshi Kawai, Yuichi Koga, Yoshihiro Kato