Abstract: A p-well region (16) is formed in the main surface area of an n-type semiconductor substrate (11). A potential (V.sub.BB) which is lower than an externally input potential is applied to the p-well region (16). In the surface area of the p-well region (16), a first impurity diffused layer (12) of n-type to which the externally input potential (Vin) is applied and a second impurity diffused layer (13) of n-type to which a reference potential is applied are formed. The first impurity diffused layer (12) serves as the drain region of a first MOS transistor (Q9) of n-channel formed in the p-well region (16) and the second impurity diffused layer (13) serves as the drain region of a second MOS transistor (Q10) of n-channel which is also formed in the p-well region (16). The first and second MOS transistors (Q9 and Q10) constitute the input section of an input circuit.

Abstract: A semiconductor memory device includes a cell array having a plurality of memory cells grouped into a plurality of cell blocks and arranged in a matrix form, a plurality of word lines, a plurality of bit lines, bit line sense amplifiers (S/A), a cell block selection circuit,a plurality of data I/O lines, row decoders, a plurality of column selection signal lines, column decoders and a data buffer circuit.

Abstract: According to this invention, a well region is formed on a semiconductor substrate. An n.sup.+ -type first semiconductor region is formed in the well region, and an input pad for receiving an external signal is connected near the first semiconductor region. This input pad is connected to an input circuit of an integrated circuit constituted by an inverter circuit and to an external terminal for receiving an external signal. N.sup.+ -type second semiconductor regions are formed in the well region located on both sides of the first semiconductor region. A ground potential Vss is applied to these second semiconductor regions. A p.sup.+ -type third semiconductor region is formed around these second semiconductor regions in the well region. The ground potential is applied to the third semiconductor region. Therefore, a parallel circuit formed by a parasitic transistor and a parasitic diode is formed between the input pad and the ground potential.

Abstract: A semiconductor memory device includes a cell array having a plurality of memory cells grouped into a plurality of cell blocks and arranged in a matrix form, a plurality of word lines, a plurality of bit lines, bit line sense amplifiers (S/A), a cell block selection circuit, a plurality of data I/O lines, row decoders, a plurality of column selection signal lines, column decoders and a data buffer circuit.

Abstract: A semiconductor memory device includes a cell array having a plurality of memory cells grouped into a plurality of cell blocks and arranged in a matrix form, a plurality of word lines, a plurality of bit lines, bit line sense amplifiers (S/A), a cell block selection circuit, a plurality of data I/O lines, row decoders, a plurality of column selection signal lines, column decoders and a data buffer circuit.

Abstract: A semiconductor device comprises an N-type semiconductor substrate, a first P-type well formed in the semiconductor substrate, a second P-type well formed adjacent to the first P-type well in the semiconductor substrate, the surface impurity concentration of the second P-type well being set lower than that of the first P-type well, a DRAM memory cell structure formed in the first P-type well, and an MOS transistor structure formed in the second P-type well to function in combination with the memory cell structure.

Abstract: According to the invention, a well region is formed on a semiconductor substrate. An n.sup.+ -type first semiconductor region is formed in the well region, and an input pad for receiving an external signal is connected near the first semiconductor region. This input pad is connected to an input circuit of an integrated circuit constituted by an inverter circuit and to an external terminal for receiving an external signal. N.sup.+ -type second semiconductor regions are formed in the well region located on both sides of the first semiconductor region. A ground potential Vss is applied to these second semiconductor regions. A p.sup.+ -type third semiconductor region is formed around these second semiconductor regions in the well region. The ground potential is applied to the third semiconductor region. Therefore, a parallel circuit formed by a parasitic transistor and a parasitic diode is formed between the input pad and the ground potential.

Abstract: According to this invention, a semiconductor apparatus includes a word line group consisting of four word lines, a bit line pair group, word line drive circuits, arrangement patterns of which are alternately inverted, for outputting boosted word line signals to the word line group, and memory contact portions provided to the bit line pair group in a 1/4-pitch system, wherein output terminals of the word line drive circuit having an inverted arrangement pattern are connected to memory cells so as to be aligned in the same order as in output terminals of the word line drive circuit having a non-inverted arrangement pattern.

Abstract: A semiconductor device comprises an N-type semiconductor substrate, a first P-type well formed in the semiconductor substrate, a second P-type well formed adjacent to the first P-type well in the semiconductor substrate, the surface impurity concentration of the second P-type well being set lower than that of the first P-type well, a DRAM memory cell structure formed in the first P-type well, and an MOS transistor structure formed in the second P-type well to function in combination with the memory cell structure.

Abstract: In a CMOS-DRAM, an n-type silicon substrate has a p-type well formed therein, and a DRAM cell array is formed in the p-type well. In a period immediately after an external power supply is turned on, the p-type well is in a substantially floated condition. A predetermined time after the external power supply is turned on, the p-type well is applied with a predetermined DC voltage generated by a well voltage generating circuit. The CMOS-DRAM has a selective grounding circuit. When the external power supply is turned on, the selective grounding circuit forcibly grounds the plate electrode of the DRAM cell array for a predetermined period of time. Therefore, an increase in the well voltage at the cell array region, which increase may occur due to the capacitive coupling, is prevented when the power supply is turned on. Accordingly, adverse effects arising from the increase in the well voltage are prevented.

Abstract: A semiconductor device comprises an N-type semiconductor substrate, a first P-type well formed in the semiconductor substrate, a second P-type well formed adjacent to the first P-type well in the semiconductor substrate, the surface impurity concentration of the second P-type well being set lower than that of the first P-type well, a DRAM memory cell structure formed in the first P-type well, and an MOS transistor structure formed in the second P-type well to function in combination with the memory cell structure.

Abstract: A semiconductor device comprises an N-type semiconductor substrate, a first P-type well formed in the semiconductor substrate, a second P-type well formed adjacent to the first P-type well in the semiconductor substrate, the surface impurity concentration of the second P-type well being set lower than that of the first P-type well, a DRAM memory cell structure formed in the first P-type well, and an MOS transistor structure formed in the second P-type well to function in combination with the memory cell structure.

Abstract: Memory cell arrays containing dynamic memory cells and write/read circuits for these memory cell arrays are arranged alternately. In the write/read circuit, read amplifiers are provided at a rate of one for every four columns (bit line pairs). This read amplifier is composed of a preamplifier and a main amplifier. Each column is provided with a multiplexer, which selects a column and connects it to the preamplifier of a read amplifier. The signal amplified by this preamplifier is supplied to the main amplifier. The current-mirror load circuit of this main amplifier is in common use by a plurality of read amplifiers.

Abstract: A semiconductor memory device has a memory cell array region, a plurality of signal lines arranged above the memory cell array region, and a plurality of power-supply lines or grounding lines, each of which has a first end and a second end and which are arranged between the signal lines in a similar pattern to that of the signal lines.

Abstract: In a MOS-type charging circuit in a semiconductor chip using a supply voltage-lowering circuit, a driver MOS transistor is connected not to an output of the supply voltage-lowering circuit but directly to an external power supply. A comparison is made between the voltage at the terminal of the driver MOS transistor connected to a large-capacity capacity load and an output of the supply voltage-lowering circuit, i.e., an internal supply voltage of the chip. On the basis of the result of comparison, the gate potential of the driver MOS transistor is controlled, and the large-capacity load is charged to the level of the internal supply voltage of the chip. Hence, only one driver transistor can be used as conventionally required two driver transistors connecting the external power supply and the large-capacity load, so that the chip area can be reduced.

Abstract: A reference voltage generating circuit device, which is integrally formed on a semiconductor substrate and an external supply voltage is applied thereto, includes a resistor having a first terminal connected to a first supply terminal, which becomes high potential, at least one diode connected between a second terminal of the resistor and a second supply terminal, which becomes low potential, in a forward direction, and at least one second diode connected to the resistor in parallel and connected to the first diode in series and a forward direction, wherein a reference voltage is generated from a node between the first diode and the second diode.

Abstract: A semiconductor memory device is disclosed which comprises a regular row/column memory cell array having blocks obtained by dividing the memory cell array in the column and row directions, a first peripheral circuit irregularly provided between the blocks divided in the column direction, a second peripheral circuit provided between the blocks divided in the row direction and including a first decoder, a third peripheral circuit provided between the first peripheral circuit and the respective block and including a second decoder, and a fourth peripheral circuit provided at the marginal portion of the memory cell array and including bonding pads and input protection circuit.

Abstract: A semiconductor memory device such as dynamic random access memories comprises a work line drive circuit provided with two MOS transistors and a word line to which a word line drive signal is supplied, a substrate bias generation circuit for applying a bias voltage to a semiconductor substrate for MOS transistors, a burn-in mode detection circuit for detecting a burn-in test mode signal, and a substrate bias control circuit for controlling the substrate bias generation circuit. When the semiconductor memory device is subjected to a burn-in test, the power supply level Vcc is increased to raise the voltage of the word line drive signal as compared to that at a normal operation. Accordingly, a high level word line drive signal will be applied to cell transistors, thereby performing correct screening thereof.

Abstract: A semiconductor device comprises an N-type semiconductor substrate, a first P-type well formed in the semiconductor substrate, a second P-type well formed adjacent to the first P-type well in the semiconductor substrate, the surface impurity concentration of the second P-type well being set lower than that of the first P-type well, a DRAM memory cell structure formed in the first P-type well, and an MOS transistor structure formed in the second P-type well to function in combination with the memory cell structure.

Abstract: A semiconductor memory device is disclosed which comprises a regular row/column memory cell array having blocks obtained by dividing the memory cell array in the column and row directions, .Iadd.the blocks each being further divided in the column direction to form a plurality of sections, .Iaddend.a first peripheral circuit .?.irregularly.!. provided between the blocks divided in the column direction, a second peripheral circuit provided between the blocks divided in the row direction and including a first decoder, a third peripheral circuit provided between the first peripheral circuit and the respective block and including a second decoder, and .?.a fourth peripheral circuit provided at the marginal portion of the memory cell array and including bonding pads and input protection circuit.!. .Iadd.sense amplifiers provided between neighboring sections in each of the blocks.Iaddend..