Patents by Inventor T. S. Chong

T. S. Chong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Preforming of preheated plastic pellets for use in transfer molding
    Patent number: 4569814
    Abstract: Prior to supplying plastic encapsulant to the reservoir of a mold for the purpose of encapsulating semiconductor devices, pellets of the encapsulant are heated until they become soft. An operator then places the pellets into a preforming chamber where they are compressed to form a softened charge of encapsulant. This charge is then removed from the chamber and placed into the reservoir of the mold.
    Type: Grant
    Filed: July 3, 1984
    Date of Patent: February 11, 1986
    Assignee: Motorola, Inc.
    Inventors: T. S. Chong, F. C. Chong, C. K. Ng, T. T. Lim