Patents by Inventor T. Sharanya Kaminda

T. Sharanya Kaminda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board for galvanic effect reduction
    Patent number: 11924964
    Abstract: Devices and methods are described for reducing etching due to Galvanic Effect within a printed circuit board (PCB) that may be used in an electronic device. Specifically, a contact trace is coupled to a contact finger that has a substantially larger surface area than the contact trace. The contact finger is configured to couple the electronic device to a host device. The contact trace is electrically isolated from the rest of the PCB circuitry during a fabrication process by a separation distance between an exposed portion of the contact trace and an impedance trace. The contact finger and the exposed portion of the contact trace are plated with a common material to reduce galvanic etching of the contact trace during fabrication. The contact trace is then connected to the impedance trace using a solder joint.
    Type: Grant
    Filed: April 7, 2022
    Date of Patent: March 5, 2024
    Assignee: Western Digital Technologies, Inc.
    Inventors: Lin Hui Chen, Songtao Lu, Chien Te Chen, Yu Ying Tan, Huang Pao Yi, Ching Chuan Hsieh, T. Sharanya Kaminda, Chia-Hsuan Huang
  • PRINTED CIRCUIT BOARD FOR GALVANIC EFFECT REDUCTION
    Publication number: 20230328873
    Abstract: Devices and methods are described for reducing etching due to Galvanic Effect within a printed circuit board (PCB) that may be used in an electronic device. Specifically, a contact trace is coupled to a contact finger that has a substantially larger surface area than the contact trace. The contact finger is configured to couple the electronic device to a host device. The contact trace is electrically isolated from the rest of the PCB circuitry during a fabrication process by a separation distance between an exposed portion of the contact trace and an impedance trace. The contact finger and the exposed portion of the contact trace are plated with a common material to reduce galvanic etching of the contact trace during fabrication. The contact trace is then connected to the impedance trace using a solder joint.
    Type: Application
    Filed: April 7, 2022
    Publication date: October 12, 2023
    Inventors: Lin Hui Chen, Songtao Lu, Chien Te Chen, Yu Ying Tan, Huang Pao Yi, Ching Chuan Hsieh, T. Sharanya Kaminda, Chia-Hsuan Huang