Patents by Inventor Ta-Wei Lee

Ta-Wei Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for designing interconnect for a new processing technology
    Publication number: 20070158835
    Abstract: A method is disclosed for determining a size of an interconnect between a first and a second conductor respectively in two layers of an integrated circuit while scaling from a reference processing technology to a predetermined processing technology. The method comprises selecting a set of design rules for the conductors based on the predetermined processing technology, determining a length of a first side of a rectangular cross sectional area of the interconnect based on the design rules and a scaling rule for scaling such a length from the reference processing technology to the predetermined processing technology, and determining a length of a second side of the cross sectional area of the interconnect for compensating an increase of a resistance of the interconnect due to the scaling from the reference processing technology to the predetermined processing technology.
    Type: Application
    Filed: January 12, 2006
    Publication date: July 12, 2007
    Inventors: Jian-Hong Lin, Hsueh-Chung Chen, Yi-Lung Cheng, Ta-Wei Lee, Chih-Tao Lin, Jyh-Kang Ting, Lee-Chung Lu