Abstract: A semiconductor IC includes a first logic circuit, having a first threshold voltage, for outputting a logic signal corresponding to a level of an input signal which is externally supplied thereto, and an internal circuit for receiving a logic signal from the first logic circuit and executing a predetermined operation. The semiconductor IC further includes a second logic circuit, formed between the first logic circuit and the internal circuit, and having a second threshold voltage higher than the first threshold voltage, one input terminal thereof being connected to an output terminal of the first logic circuit, and the other input terminal receiving a control signal. The control signal is generated while power source noise caused by an operation of the internal circuit is being generated. While the control signal is being generated, a signal of a predetermined logic level is supplied from the second logic circuit to the internal circuit, regardless of an output signal level from the first logic circuit.

Abstract: A method of providing a fibrous thermoplastic resin for depolymerization thereof wherein the fibrous thermoplastic resin is formed into a shaped article having a specific gravity of at least 1/2 of the true specific gravity of the fibrous thermoplastic resin, said shaped article consisting of the fibrous thermoplastic resin mass having on its surface a crusty thin resin layer which may be press-bonded or melt-bonded to the mass. The thus provided shaped article of the fibrous thermoplastic resin can be advantageously employed as a starting material for the depolymerization reaction. In accordance with this invention, the time required for completion of the depolymerization can be greatly shortened as compared with that of the conventional technique and the rate and efficiency of the depolymerization can be greatly improved.