Patents by Inventor Tadahiro Ishikawa

Tadahiro Ishikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device
    Patent number: 6518390
    Abstract: A precursor of a polybenzoxazole resin which comprises a crosslinking group in a molecule and has a specific structure, a polybenzoxazole resin obtained from the precursor by the condensation reaction and the crosslinking reaction, an insulating film comprising the polybenzoxazole resin and a semiconductor device comprising an insulating interlayer film in multi-layer wiring or a film for protecting surfaces which comprises the above insulating film. The precursor exhibits excellent processability due to excellent solubility in solvents and, after the ring closure, excellent heat stability in applications. The resin exhibits excellent electric, physical and mechanical properties and is advantageously used for insulating interlayer films of semiconductor devices and the like applications.
    Type: Grant
    Filed: March 28, 2001
    Date of Patent: February 11, 2003
    Assignee: Sumitomo Bakelite Company, Ltd.
    Inventors: Masako Okanuma, Tatsuhiro Yoshida, Hidenori Saito, Nobuhiro Higashida, Masanori Fujimoto, Tadahiro Ishikawa
  • Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device
    Publication number: 20020013443
    Abstract: A precursor of a polybenzoxazole resin which comprises a crosslinking group in a molecule and has a specific structure, a polybenzoxazole resin obtained from the precursor by the condensation reaction and the crosslinking reaction, an insulating film comprising the polybenzoxazole resin and a semiconductor device comprising an insulating interlayer film in multi-layer wiring or a film for protecting surfaces which comprises the above insulating film.
    Type: Application
    Filed: March 28, 2001
    Publication date: January 31, 2002
    Inventors: Masako Okanuma, Tatsuhiro Yoshida, Hidenori Saito, Nobuhiro Higashida, Masanori Fujimoto, Tadahiro Ishikawa