Abstract: The present invention provides a semiconductor device comprising: a silicon based semiconductor substrate provided with a step including an non-horizontal surface, a horizontal surface and a connection region for connecting the non-horizontal surface and the horizontal surface; a gate insulating film formed in at least a part of the step; and a gate electrode formed on the gate insulating film, wherein the entirety or a part of the gate insulating film is formed of a silicon oxynitride film that contains a rare gas element at a area density of 1010 cm?2 or more in at least a part of the silicon oxynitride film.

Abstract: A non-volatile semiconductor memory device comprising at least: a first electrode containing silicon atoms; and a second electrode formed on the first electrode through an insulating film, wherein the insulating film is formed of at least two layers of: a lower silicon nitride film on the first electrode side obtained by nitriding the first electrode; and an upper silicon nitride film formed on the lower silicon nitride film according to a chemical vapor deposition method, and at least a part of the lower silicon nitride film contains a rare gas element at an area density of 1010 cm?2 or more.

Abstract: A non-volatile semiconductor memory device comprising: a first insulating film provided on a silicon based substrate; a first electrode provided on the first insulating film as a floating gate; a second insulating film provided on the first electrode; and a second electrode formed as a control gate on the first electrode through the second insulating film, wherein the first insulating film is formed of at least two layers of: a lower silicon nitride film obtained by nitriding the silicon based substrate; and an upper silicon nitride film or upper silicon oxide film formed on the lower silicon nitride film according to a chemical vapor deposition method, and the lower silicon nitride film contains rare gas elements at an area density of 1010 cm?2 or more in at least a part of the lower silicon nitride film.

Abstract: A method of treating exhaust gases containing halogen compound, the improvement in that the exhaust gases containing halogen compounds such as halogen gases and/or hydrogen halide gases (halogenated acid gases) are brought into contact with simple metals. The halogen compounds such as acid gases and halogen gases can thereby effectively be removed from the exhaust gases.

Abstract: The present invention provides a semiconductor device comprising: a silicon based semiconductor substrate provided with a step including an non-horizontal surface, a horizontal surface and a connection region for connecting the non-horizontal surface and the horizontal surface; a gate insulating film formed in at least a part of the step; and a gate electrode formed on the gate insulating film, wherein the entirety or a part of the gate insulating film is formed of a silicon oxynitride film that contains a rare gas element at a area density of 1010 cm−2 or more in at least a part of the silicon oxynitride film.

Abstract: A non-volatile semiconductor memory device comprising at least: a first electrode containing silicon atoms; and a second electrode formed on the first electrode through an insulating film, wherein the insulating film is formed of at least two layers of: a lower silicon nitride film on the first electrode side obtained by nitriding the first electrode; and an upper silicon nitride film formed on the lower silicon nitride film according to a chemical vapor deposition method, and at least a part of the lower silicon nitride film contains a rare gas element at an area density of 1010 cm−2 or more.

Abstract: A non-volatile semiconductor memory device comprising: a first insulating film provided on a silicon based substrate; a first electrode provided on the first insulating film as a floating gate; a second insulating film provided on the first electrode; and a second electrode formed as a control gate on the first electrode through the second insulating film, wherein the first insulating film is formed of at least two layers of: a lower silicon nitride film obtained by nitriding the silicon based substrate; and an upper silicon nitride film or upper silicon oxide film formed on the lower silicon nitride film according to a chemical vapor deposition method, and the lower silicon nitride film contains rare gas elements at an area density of 1010 cm−2 or more in at least a part of the lower silicon nitride film.

Abstract: Disclosed are a method for treatment with ozonized water which comprises feeding primary pure water to an ultrapure-water producing device containing at least a polisher to convert the primary pure water to ultrapure water, injecting an ozone-containing gas into the ultrapure water to produce ozonized water, sending the ozonized water to a point of use, using the ozonized water for treatment, and circulating the resulting spent ozonized water to the ultrapure-water producing device for reuse or discharging the spent water, wherein the method further comprises supplying a hydrogen-containing gas to the spent ozonized water at a point downstream from the use point to remove residual ozone from the ozonized water, a method for the ozone sterilization of ultrapure water which comprises feeding primary pure water from a primary-pure-water tank to an ultrapure-water producing device containing at least a polisher to convert the primary pure water to ultrapure water, sending the ultrapure water to a use point throug

Abstract: The present invention provides a semiconductor device comprising: a silicon based semiconductor substrate provided with a step including an non-horizontal surface, a horizontal surface and a connection region for connecting the non-horizontal surface and the horizontal surface; a gate insulating film formed in at least a part of the step; and a gate electrode formed on the gate insulating film, wherein the entirety or a part of the gate insulating film is formed of a silicon oxynitride film that contains a rare gas element at a area density of 1010 cm?2 or more in at least a part of the silicon oxynitride film.