Abstract: A sheet-shaped heat pipe includes a sheet-shaped container, a wick sealed in the container, and a working fluid sealed in the container, wherein the sheet-shaped container includes a first metal sheet and a second metal sheet, the first metal sheet and the second metal sheet are superposed and at least partially bonded to provide a closed internal space therebetween, and a thickness of the sheet-shaped container is about 0.5 mm or less.

Abstract: A sheet-shaped heat pipe includes a sheet-shaped container, a wick sealed in the container, and a working fluid sealed in the container, the sheet-shaped container including a first metal sheet and a second metal sheet, the first metal sheet and the second metal sheet being superposed in direct contact with each other at a peripheral edge portion, and the sheet-shaped container having a thickness of about 0.5 mm or less, and a thin heat dissipating plate that includes the sheet-shaped heat pipe.

Abstract: A temperature detector is configured to detect the temperature of a housing while in contact with the housing, and a spring pin is in contact with the temperature detector in a separable manner. Thus, at mounting of the temperature detecting device on an electronic device, it is possible to fix the temperature detector to the housing, and the spring pin to a circuit board of the electronic device. At disassembly of the electronic device, it is easy to separate the spring pin from the temperature detector by removing, from the housing, the spring pin together with the circuit board. At assembly of the electronic device, it is easy for the spring pin to contact the temperature detector by attaching, to the housing, the spring pin together with the circuit board.

Abstract: Provided is an electronic apparatus that makes it possible to improve a heat transfer property from a heat generating element to a heat storage material. The electronic apparatus is provided with a heat generating element and a heat storage device for storing heat generated by the heat generating element. The heat storage device includes a reaction chamber containing a heat storage material for absorbing the heat generated by the heat generating element. The reaction chamber is defined by a first surface, a second surface opposed to the first surface, and a plurality of side surfaces connecting the first surface with the second surface. In the reaction chamber, a thermal conductivity of a peripheral part is smaller than a thermal conductivity of a central part of the reaction chamber.

Abstract: An electronic component includes a temperature sensor including a pair of electrodes, at least one metal block electrically connected to an electrode of the temperature sensor, an insulation portion in which the temperature sensor and the at least one metal block are embedded, and an external terminal electrically connected to the electrode of the temperature sensor. The at least one metal block includes a flat surface exposed from the insulation portion. The flat surface defines the external terminal.

Abstract: A sheet-shaped heat pipe includes a sheet-shaped container, a wick sealed in the container, and a working fluid sealed in the container, the sheet-shaped container including a first metal sheet and a second metal sheet, the first metal sheet and the second metal sheet being superposed in direct contact with each other at a peripheral edge portion, and the sheet-shaped container having a thickness of about 0.5 mm or less, and a thin heat dissipating plate that includes the sheet-shaped heat pipe.

Abstract: An electronic component in which a metal layer is unlikely to be peeled from a substrate includes an insulating ceramic substrate, a ceramic layer diffusion-bonded to the substrate, a metal layer including a first principal surface and a second principal surface opposed to the first principal surface, with the first principal surface diffusion-bonded to the ceramic layer, and a characteristic layer diffusion-bonded to the second principal surface of the metal layer and prepared from a ceramic material, wherein the characteristic layer varies in resistance value with respect to ambient temperature or applied voltage.

Abstract: In order to further improve stress tolerance, a thermistor device includes a first base material member made of resin, a thermistor element including a thermistor thin film provided on a metal base material and first and second external electrodes provided on the thermistor thin film, and a first lead electrode and a second lead electrode provided on a principal surface of the first base material member, and connected to the first external electrode and the second external electrode. Each of the metal base material and the thermistor thin film undergoes a deflection between the first external electrode and the second external electrode.

Abstract: A temperature detector is configured to detect the temperature of a housing while in contact with the housing, and a spring pin is in contact with the temperature detector in a separable manner. Thus, at mounting of the temperature detecting device on an electronic device, it is possible to fix the temperature detector to the housing, and the spring pin to a circuit board of the electronic device. At disassembly of the electronic device, it is easy to separate the spring pin from the temperature detector by removing, from the housing, the spring pin together with the circuit board. At assembly of the electronic device, it is easy for the spring pin to contact the temperature detector by attaching, to the housing, the spring pin together with the circuit board.

Abstract: Provided is an electronic apparatus that makes it possible to improve a heat transfer property from a heat generating element to a heat storage material. The electronic apparatus is provided with a heat generating element and a heat storage device for storing heat generated by the heat generating element. The heat storage device includes a reaction chamber containing a heat storage material for absorbing the heat generated by the heat generating element. The reaction chamber is defined by a first surface, a second surface opposed to the first surface, and a plurality of side surfaces connecting the first surface with the second surface. In the reaction chamber, a thermal conductivity of a peripheral part is smaller than a thermal conductivity of a central part of the reaction chamber.

Abstract: A NTC thermistor element that includes a substrate composed of a ceramic material containing Mn, Ni, Fe and Ti; and a pair of external electrodes on the substrate. When the molar amount of Mn in the substrate is a [mol %] and the molar amount of Ni in the substrate is b [mol %], a and b satisfy a+b=100, 44.90?a?65.27 and 34.73?b?55.10. When the molar amount of Fe is c [mol %] and the molar amount of Ti is d [mol %], c and d satisfy 24.22?c?39.57 and 5.04?d?10.18 based on a+b=100.

Abstract: In an thermistor element, a main body includes a first thermistor section and a second thermistor section stacked on the first thermistor section. A first internal electrode and a second internal electrode vertically sandwich the first thermistor section. A second internal electrode and a third internal electrode vertically sandwich the second thermistor section. A temperature coefficient ?TH1 of a portion between the first and second internal electrodes in the first thermistor section is different from a temperature coefficient ?TH2 of a portion between the second and third electrodes in the second thermistor section.

Abstract: An electronic component in which a metal layer is unlikely to be peeled from a substrate includes an insulating ceramic substrate, a ceramic layer diffusion-bonded to the substrate, a metal layer including a first principal surface and a second principal surface opposed to the first principal surface, with the first principal surface diffusion-bonded to the ceramic layer, and a characteristic layer diffusion-bonded to the second principal surface of the metal layer and prepared from a ceramic material, wherein the characteristic layer varies in resistance value with respect to ambient temperature or applied voltage.

Abstract: An electronic-component mounting structure includes an electronic component which includes a metal substrate, a semiconductor ceramic layer located on the metal substrate, a pair of split electrodes located on the semiconductor ceramic layer, and plating films located on the split electrodes and the metal substrate, and a mounting body on which lands to be connected to the respective split electrodes of the electronic component are provided. The position of a peripheral end portion of each land to be connected to the corresponding split electrode is located farther inside than the position of a peripheral end portion of the split electrode. In addition, a plane area of the land is smaller than that of the split electrode.

Abstract: A thermistor includes a metal substrate, a semiconductor ceramic layer on the metal substrate, and a pair of split electrodes on the semiconductor layer. The semiconductor ceramic layer is formed by a solid-phase method. The metal substrate includes ceramic particles and is not interrupted in the direction of thickness by the ceramic particles or a pillar defined by a chain of the ceramic particles. Preferably, the metal substrate and the ceramic layer of the thermistor have a thickness of about 10 ?m to about 80 ?m and about 1 ?m to about 10 ?m, respectively.

Abstract: In order to further improve stress tolerance, a thermistor device includes a first base material member made of resin, a thermistor element including a thermistor thin film provided on a metal base material and first and second external electrodes provided on the thermistor thin film, and a first lead electrode and a second lead electrode provided on a principal surface of the first base material member, and connected to the first external electrode and the second external electrode. Each of the metal base material and the thermistor thin film undergoes a deflection between the first external electrode and the second external electrode.

Abstract: There is provided an electronic apparatus having a novel means capable of suppressing temperature rise of a heat generating element. The electronic apparatus (20), which includes a heat generating element, is provided with a device (or a chemical heat pump) (10) comprising: a reaction chamber (1) containing a chemical heat storage material showing an endothermic reaction in response to heat emitted by the heat generating element (11); a condensation/evaporation chamber (3) for condensing or evaporating a condensable component produced from the endothermic reaction of the chemical heat storage material; and a communication part (5) communicating the reaction chamber (1) with the condensation/evaporation chamber (3) such that the condensable component is movable between the reaction chamber (1) and the condensation/evaporation chamber (3).

Abstract: A NTC thermistor element that includes a substrate composed of a ceramic material containing Mn, Ni, Fe and Ti; and a pair of external electrodes on the substrate. When the molar amount of Mn in the substrate is a [mol %] and the molar amount of Ni in the substrate is b [mol %], a and b satisfy a+b=100, 44.90?a?65.27 and 34.73?b?55.10. When the molar amount of Fe is c [mol %] and the molar amount of Ti is d [mol %], c and d satisfy 24.22?c?39.57 and 5.04?d?10.18 based on a+b=100.

Abstract: A thermistor that includes a metal substrate layer, a thermistor thin film formed on the metal substrate layer, and electrode films formed on the thermistor thin film. The metal substrate layer and the electrode films contain a Ag—Pd alloy, and the content of Pd of the Ag—Pd alloy is 10 percent by weight or more.

Abstract: A gas sensor having high detection sensitivity and a low output signal noise includes a laminate of thermistor ceramic, a catalytic electrode, an internal electrode, and external electrodes. When coming into contact with a detection target gas, the catalytic electrode generates heat, and the resistance of a thermistor layer of a sensing portion is decreased. Since the heat generated by the catalytic electrode is directly transferred to the thermistor layer without passing through an insulating layer or the like, high detection sensitivity is obtained. In addition, the structure can be formed in which heat of the sensing portion is insulated by a hollow portion and heat diffusion is prevented, so that the heat capacity of the sensing portion is further decreased.