Patents by Inventor Tadao Nishimori

Tadao Nishimori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5093712
    Abstract: A semiconductor device sealed with resin is disclosed. This semiconductor device comprises a semiconductor element, a lead, and a wire electrically connecting said semiconductor element and said lead. The semiconductor element, the wire, and a portion of the lead are sealed with sealing resin. Calcium hydroxide is added into the sealing resin to serve as a corrosion inhibitor. In the semiconductor device sealed with resin, corrosion of the copper wire can thus be suppressed in high temperature environments.
    Type: Grant
    Filed: November 13, 1990
    Date of Patent: March 3, 1992
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yoshihiro Matsunaga, Tadao Nishimori, Hiromasa Matsuoka, Kozo Shimamoto, Kiyoaki Tsumura
  • Patent number: 4917806
    Abstract: Water is allowed to flow in parallel into a mixed bed in which an anion exchange resin and a cation exchange resin are disposed in a mixed state and into a single bed in which an anion exchange resin or a cation exchange resin is disposed. As the proportion of the flow rates of water introduced into the two beds is adjusted, the pH and electrical conductivity of water is controlled. Control is effected in such a manner that the pH and electrical conductivity of water are maintained at appropriate levels without using any chemicals.
    Type: Grant
    Filed: December 20, 1988
    Date of Patent: April 17, 1990
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yoshihiro Matsunaga, Tadao Nishimori, Hiromasa Matsuoka