Abstract: An opto-electric hybrid board for an optical communication module in which an electric circuit part E including a pad for mounting an optical element, a pad for an optical element driving device, and an electrical interconnect line Y including an interconnect line portion A connecting the pads is provided on a first surface side of an insulative layer, and in which an optical waveguide W is on a second surface side of the insulative layer. A portion of a coverlay covering the electric circuit part E which overlaps the interconnect line portion A is removed to form an opening. The interconnect line portion A exposed through the opening is used as a terminal for a burn-in test of an optical element.

Abstract: In an opto-electric hybrid board, an electric circuit part E is provided on a first surface side of an insulative layer, and includes pads for mounting an optical element, pads for a driving device for the optical element, and electrical interconnect lines Y including interconnect line portions A connecting the pads. A metal reinforcement layer and an optical waveguide W partially overlapping the metal reinforcement layer are provided on a second surface side of the insulative layer. A portion of the metal reinforcement layer which faces the interconnect line portions A on the opposite side of the insulative layer therefrom is removed to form an opening. This opto-electric hybrid board is capable of transmitting higher-frequency electric signals because the influence of the metal reinforcement layer on electrical properties is suppressed.

Abstract: An optical communication module substrate includes a wiring board and an opto-electronic hybrid substrate, the wiring board and the opto-electronic hybrid substrate being connected to each other, in which a connection terminal of the wiring board and a connection terminal of the opto-electronic hybrid substrate are electrical connection points, and a frame-shaped removal portion is formed by removing a portion of the metal reinforcing layer of the opto-electronic hybrid substrate that faces the connection terminal with the insulating layer interposed between the metal reinforcing layer and the connection terminal, so as to surround each terminal. According to this configuration, the connection strength at the connection point between the wiring board and the opto-electronic hybrid substrate is sufficiently ensured, and the optical communication module substrate has excellent electrical properties that are compatible with high-speed signal transmission.

Abstract: An optical module includes: an electric circuit board E including an electric circuit provided on a light-permeable resin substrate 1; and an optical element 11 joined onto the electric circuit board E. The optical element 11 is joined to the electric circuit board E, with a light-emitting portion (or light-receiving portion) 11a of the optical element 11 facing an electric circuit surface side of the electric circuit board E. A space between the light-emitting portion (or light-receiving portion) 11a of the optical element 11 and the light-permeable resin substrate 1 is filled with a light-permeable resin cured material X. A relative refractive index difference between the light-permeable resin cured material X and the light-permeable resin substrate 1 is not greater than 20%. This reduces the propagation loss of light with a simple structure.

Abstract: An optical module in which a space between a light emitting portion (or a light receiving portion) (11a) of an optical element (11) and an insulating layer (1) of an electric circuit board (E) is filled with a cured product of a light-transmissive resin composition containing a curing agent component including only a non-antimony-containing curing agent (i.e., an optical element bonding/reinforcing resin cured product (X)) and a junction between the optical element (11) and the electric circuit board (E) is reinforced with the cured product.

Abstract: A semiconductor device capable of preventing the occurrence of defect of electroconductivity, wherein a semiconductor chip 1 equipped with electrodes 11 is mounted on an auxiliary wiring plate 2 in the state of facing the surface of the electrode 11 side, leading conductors 23 are disposed in the inside of the auxiliary wiring plate 2, one end of each leading conductor 23 forms an internal electrode 21 projecting from the surface of the auxiliary wiring plate 2 at the side of mounting the semiconductor chip 1, the other end of the leading conductor 23 forms an external electrode 22 projecting from the surface of the auxiliary wiring plate opposite to the side of mounting the semiconductor chip 1, and each of the internal electrodes 21 is connected to each of the electrodes 11 of the semiconductor chip 1, at least a gap between the semiconductor chip 1 and the auxiliary wiring plate 2 is encapsulated with a heat-welding polyimide resin layer.