Patents by Inventor Tadashi Amano

Tadashi Amano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080113184
    Abstract: An adhesive sheet including a releasable base material, and an adhesive layer formed on one surface of the base material is provided. The adhesive layer includes an adhesive composition including (A) 100 parts by mass of a carboxyl group-containing urethane-modified polyester resin, (B) an epoxy resin, (C) a curing agent, and (D) an inorganic filler, and has a thickness within a range from 40 to 100 ?m. The adhesive sheet has a high degree of adhesiveness and excellent anti-migration properties, and is also effective as an interlayer insulating material.
    Type: Application
    Filed: November 14, 2007
    Publication date: May 15, 2008
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Shinichiro YOSHIDA, Masahiro Usuki, Tadashi Amano
  • Publication number: 20080090075
    Abstract: The present invention provides a halogen-free, flame retardant adhesive composition that exhibits excellent anti-migration properties, not only within single layer structures, but also within multilayer structures of much higher density. The flame retardant adhesive composition according to the present invention comprises: (A) a halogen-free epoxy resin, (B) a carboxyl group-containing acrylic resin and/or a carboxyl group-containing acrylonitrile-butadiene rubber, (C) a curing agent, (E) a specific polyphosphoric acid-melamine-based compound salt and/or polyphosphoric acid-diamine compound salt, and (F) an ion scavenger and/or a heavy metal deactivator.
    Type: Application
    Filed: October 1, 2007
    Publication date: April 17, 2008
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kazunori Kondo, Shigehiro Hoshida, Tadashi Amano
  • Patent number: 7348057
    Abstract: An adhesive sheet made of an acrylic adhesive composition comprising (A) an acrylic polymer containing carboxyl groups and having a Tg of 5-30° C., (B) a resol phenolic resin, (C) an epoxy resin, and (D) a curing accelerator has improved heat resistance, processing and handling as well as good adhesion, and is suited for use in the manufacture of FPC.
    Type: Grant
    Filed: November 9, 2004
    Date of Patent: March 25, 2008
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kazunori Kondo, Shigehiro Hoshida, Michio Aizawa, Tadashi Amano
  • Publication number: 20070282027
    Abstract: A thermally expandable vinyl chloride resin composition is provided. It includes (A) 100 parts by mass of a vinyl chloride resin, (B) 5 to 200 parts by mass of an inorganic filler, (C) 10 to 300 parts by mass of a thermally expandable graphite, (D) 0.1 to 10 parts by mass of a fluororesin, and (E) 10 to 300 parts by mass of a phosphorus compound. The composition exhibits favorable thermal expansion properties and favorable shape retention following thermal expansion upon exposure to high temperatures.
    Type: Application
    Filed: June 5, 2007
    Publication date: December 6, 2007
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Tatsuya Fujimoto, Ken Yahata, Tadashi Amano
  • Publication number: 20070272153
    Abstract: An apparatus for low-temperature plasma treatment of a continuous length plastic film which can work for surface modifying processing for a film using low-temperature plasma while maintaining the dimensional stability without causing damage to the film. The apparatus for performing surface modifying processing for a film comprises: a first vacuum chamber equipped with an unrolling unit for unrolling a rolled plastic film; a second vacuum chamber in which the unrolled plastic film is subjected to a low-temperature plasma treatment on the surface; and a third vacuum chamber equipped with a winding unit for winding the plasma-treated plastic film into a roll, the vacuum chambers being connected together in series along the running direction of the plastic film under treatment.
    Type: Application
    Filed: May 22, 2007
    Publication date: November 29, 2007
    Inventors: Shigehiro Hoshida, Shinji Suzuki, Tadashi Amano
  • Patent number: 7232867
    Abstract: There is provided a process for producing a vinyl chloride-based polymer, in which a suspension polymerization of either vinyl chloride monomer, or a mixture of vinyl chloride monomer and another copolymerizable monomer, is conducted in a polymerization vessel fitted with a reflux condenser, the process including the steps of: (A) adding to the reaction mixture a high-activity, oil-soluble polymerization initiator, with a 10-hour half life temperature of no more than 40° C. at a concentration of 0.1 mol/L in benzene, for a specified time within a period from the commencement of heat removal using the reflux condenser through to completion of the polymerization, and (B) adding an antioxidant either continuously or intermittently to the reaction mixture at least during the period from the commencement of addition of the high-activity, oil-soluble polymerization initiator through to completion of that addition.
    Type: Grant
    Filed: December 21, 2004
    Date of Patent: June 19, 2007
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Makoto Ooura, Tadashi Amano
  • Publication number: 20070100098
    Abstract: There is provided a process for producing a vinyl chloride-based polymer, in which a suspension polymerization of either vinyl chloride monomer, or a mixture of vinyl chloride monomer and another copolymerizable monomer, is conducted in a polymerization vessel fitted with a reflux condenser, the process including the steps of: (A) adding to the reaction mixture a high-activity, oil-soluble polymerization initiator, with a 10-hour half life temperature of no more than 40° C. at a concentration of 0.1 mol/L in benzene, for a specified time within a period from the commencement of heat removal using the reflux condenser through to completion of the polymerization, and (B) adding an antioxidant either continuously or intermittently to the reaction mixture at least during the period from the commencement of addition of the high-activity, oil-soluble polymerization initiator through to completion of that addition.
    Type: Application
    Filed: December 21, 2004
    Publication date: May 3, 2007
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Makoto Ooura, Tadashi Amano
  • Publication number: 20060264538
    Abstract: Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) an organophosphinate compound, (E) a curing accelerator, and (F) a nitrogen-containing organophosphate compound represented by a general formula (1) shown below: (wherein, R1 to R4 each represent a hydrogen atom or an alkyl group, and X represents a nitrogen-containing bivalent organic group) Also provided are an adhesive sheet having a layer comprising the above composition, and a protective layer for covering the layer comprising the composition; a coverlay film having an electrically insulating film, and a layer comprising the above composition provided on top of the film; and a flexible copper-clad laminate having an electrically insulating film, a layer comprising the above composition provided on top of the film, and a copper foil provided on top of the layer comprising the composition.
    Type: Application
    Filed: May 22, 2006
    Publication date: November 23, 2006
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Toru NAKANISHI, Kazunori Kondo, Shigehiro Hoshida, Tadashi Amano
  • Publication number: 20060257660
    Abstract: The present invention provides an antistatic agent for vinyl chloride-based resins which can impart superior antistatic properties to the vinyl chloride-based resin, and which can thereby solve various problems arising from charging of the vinyl chloride-based resin with static electricity, a vinyl chloride-based resin composition containing this antistatic agent, and a method for manufacturing this composition. The present invention provides an antistatic agent for vinyl chloride-based resins which consists of silica particles containing at least 99.0% by mass of SiO2 and 0.00005% 80.5 ppm by mass or less of sodium, and which has such a particle size distribution that at least 98% by mass of the silica particles is occupied by the particles having a particle diameter in the range from 30 to 1,000 nm.
    Type: Application
    Filed: May 9, 2006
    Publication date: November 16, 2006
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Tatsuya Fujimoto, Ken Yahata, Tadashi Amano
  • Publication number: 20060234045
    Abstract: Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) an organophosphinate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; and a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and electrical characteristics (anti-migration properties).
    Type: Application
    Filed: April 12, 2006
    Publication date: October 19, 2006
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Toru Nakanishi, Kazunori Kondo, Shigehiro Hoshida, Tadashi Amano
  • Publication number: 20060234044
    Abstract: Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a phytate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; and a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and electrical characteristics (anti-migration properties).
    Type: Application
    Filed: April 12, 2006
    Publication date: October 19, 2006
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Toru Nakanishi, Kazunori Kondo, Shigehiro Hoshida, Tadashi Amano
  • Publication number: 20060234043
    Abstract: Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a nitrogen-containing polyphosphate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil; and a method of bonding two substrates, including the steps of sandwiching the above adhesive sheet between two substrates, and curing the adhesive sheet. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate.
    Type: Application
    Filed: April 12, 2006
    Publication date: October 19, 2006
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Toru Nakanishi, Kazunori Kondo, Shigehiro Hoshida, Tadashi Amano
  • Patent number: 7112637
    Abstract: There is provided a process for producing a vinyl chloride-based polymer, in which a suspension polymerization of either vinyl chloride monomer, or a mixture of vinyl chloride monomer and another copolymerizable monomer, is conducted in a polymerization vessel fitted with a reflux condenser, the process including the steps of: (A) adding to the reaction mixture a high-activity, oil-soluble polymerization initiator, with a 10-hour half life temperature of no more than 40° C. at a concentration of 0.
    Type: Grant
    Filed: December 21, 2004
    Date of Patent: September 26, 2006
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Makoto Ooura, Tadashi Amano
  • Publication number: 20060191632
    Abstract: A method for preparing a flexible metal foil/polyimide laminate is characterized by laminating a metal foil and a polyimide film, with a heat resistant adhesive interleaved therebetween, on a heating roll press, and heat treating the laminate for removing the residual solvent from the adhesive layer and heat curing the adhesive layer.
    Type: Application
    Filed: June 16, 2004
    Publication date: August 31, 2006
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Masahiro Usuki, Michio Aizawa, Shigehiro Hoshida, Tadashi Amano
  • Publication number: 20060173146
    Abstract: There is provided a process for producing a vinyl chloride-based polymer, in which a suspension polymerization of either vinyl chloride monomer, or a mixture of vinyl chloride monomer and another copolymerizable monomer, is conducted in a polymerization vessel fitted with a reflux condenser, the process including the steps of: (A) adding to the reaction mixture a high-activity, oil-soluble polymerization initiator, with a 10-hour half life temperature of no more than 40° C. at a concentration of 0.
    Type: Application
    Filed: December 21, 2004
    Publication date: August 3, 2006
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Makoto Ooura, Tadashi Amano
  • Publication number: 20060134443
    Abstract: A flexible metal foil/polyimide laminate consists of all three layers, a polyimide film, a metal foil, and a polyimide resin layer disposed between the polyimide film and the metal foil.
    Type: Application
    Filed: June 16, 2004
    Publication date: June 22, 2006
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Michio Aizawa, Masahiro Usuki, Shigehiro Hoshida, Tadashi Amano
  • Patent number: 7060784
    Abstract: A polyimide precursor resin solution composition sheet having a solvent content of 1–50% by weight and a thickness of 1–10 microns has improved adhesion, forms a heat resistant polyimide layer when cured, and is advantageously used in the bonding of conductors to plastic films.
    Type: Grant
    Filed: June 24, 2004
    Date of Patent: June 13, 2006
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Shigehiro Hoshida, Masahiro Usuki, Michio Aizawa, Tadashi Amano
  • Publication number: 20060069200
    Abstract: Provided is an acrylic adhesive composition, including: (A) 100 parts by mass of an acrylic polymer containing a carboxyl group, with a glass transition temperature of 5 to 30° C., (B) 1 to 20 parts by mass of a resol-type phenol resin, (C) 1 to 20 parts by mass of an epoxy resin, and (D) 10 to 100 parts by mass of an inorganic filler, the composition optionally including 0 to 0.5 parts by mass of a curing accelerator per 100 parts by mass of the component (A). Also provided are an acrylic adhesive sheet that contains an adhesive layer including this composition and a method of bonding two substrates using this acrylic adhesive sheet. The acrylic adhesive sheet exhibits excellent adhesiveness, heat resistance, workability, handling properties and storage stability, and the acrylic adhesive composition is useful in the production of such an adhesive sheet.
    Type: Application
    Filed: September 28, 2005
    Publication date: March 30, 2006
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kazunori Kondo, Shigehiro Hoshida, Michio Aizawa, Tadashi Amano
  • Publication number: 20060069201
    Abstract: Provided is an acrylic flame retardant adhesive composition, including: (A) 100 parts by mass of an acrylic polymer containing a carboxyl group, with a glass transition temperature of 5 to 30° C., (B) 1 to 20 parts by mass of a resol-type phenol resin, (C) 1 to 20 parts by mass of an epoxy resin, (D) 0.1 to 5 parts by mass of a curing accelerator, (E) a bromine-based flame retardant, in sufficient quantity to produce a bromine content within the entire composition, excluding the component (F), of 15 to 40% by mass, and (F) 10 to 100 parts by mass of an inorganic filler. Also provided are an acrylic adhesive sheet that contains an adhesive layer including this composition and a method of bonding two substrates using this acrylic adhesive sheet. The acrylic adhesive sheet exhibits excellent adhesiveness, heat resistance, workability, handling properties and flame retardancy, and the acrylic adhesive composition is useful in the production of such an adhesive sheet.
    Type: Application
    Filed: September 28, 2005
    Publication date: March 30, 2006
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Kazunori Kondo, Shigehiro Hoshida, Michio Aizawa, Tadashi Amano
  • Publication number: 20060042750
    Abstract: A flexible metal foil/polyimide laminate is prepared by applying a polyamic acid varnish onto a very thin copper foil on a carrier, semi-drying the varnish, laminating a polyimide film to the varnish-coated copper foil using a hot roll press, and heat treating the laminate for solvent removal and imidization in an atmosphere having a controlled oxygen concentration. A polyimide adhesive layer resulting from the imidization of polyamic acid has a thickness of up to 6 ?m, the sum of the thicknesses of the polyimide film and the polyimide adhesive layer is up to 25 ?m. The polyimide adhesive layer has a Tg>400° C.
    Type: Application
    Filed: August 2, 2005
    Publication date: March 2, 2006
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Masahiro Usuki, Makoto Fujiwara, Shigehiro Hoshida, Michio Aizawa, Tadashi Amano