Abstract: A vehicle body rear structure includes: left and right rear side frames extending in a fore-and-aft direction in a rear part of a vehicle; a rear subframe attached to the rear side frames; left and right rear wheels supported by the rear subframe via respective suspensions; and a driving source mounted to the rear subframe. The driving source is arranged such that a center of gravity thereof is positioned more rearward than a rotation axis of the rear wheels. The rear subframe includes left and right rear subframe longitudinal members extending in the fore-and-aft direction and a rear subframe cross member extending laterally and joined to the rear subframe longitudinal members. The rear subframe cross member includes a protrusion that protrudes rearward at a laterally central part thereof. A rear end of the protrusion is positioned more rearward than a rear end of the driving source.

Abstract: A vehicle body rear structure includes: a pair of left and right rear side frames extending in a fore-and-aft direction in a rear part of a vehicle; a rear subframe attached to the rear side frames; and a pair of left and right shock-absorbing structures respectively provided at rear ends of the rear side frames and extending rearward. The rear subframe includes a pair of left and right rear subframe longitudinal members extending in the fore-and-aft direction and a rear subframe cross member extending laterally and joined to the left and right rear subframe longitudinal members. The rear subframe cross member includes a protrusion that protrudes rearward in a laterally central part thereof. A rear end of the protrusion is positioned more rearward than the rear ends of the rear side frames and more forward than rear ends of the shock-absorbing structures.

Abstract: A vehicle body rear structure includes: a pair of left and right rear side frames extending in a fore-and-aft direction in a rear part of a vehicle; a rear subframe attached to the rear side frames; and a pair of left and right shock-absorbing structures respectively provided at rear ends of the rear side frames and extending rearward. The rear subframe includes a pair of left and right rear subframe longitudinal members extending in the fore-and-aft direction and a rear subframe cross member extending laterally and joined to the left and right rear subframe longitudinal members. The rear subframe cross member includes a protrusion that protrudes rearward in a laterally central part thereof. A rear end of the protrusion is positioned more rearward than the rear ends of the rear side frames and more forward than rear ends of the shock-absorbing structures.

Abstract: A vehicle body rear structure includes: left and right rear side frames extending in a fore-and-aft direction in a rear part of a vehicle; a rear subframe attached to the rear side frames; left and right rear wheels supported by the rear subframe via respective suspensions; and a driving source mounted to the rear subframe. The driving source is arranged such that a center of gravity thereof is positioned more rearward than a rotation axis of the rear wheels. The rear subframe includes left and right rear subframe longitudinal members extending in the fore-and-aft direction and a rear subframe cross member extending laterally and joined to the rear subframe longitudinal members. The rear subframe cross member includes a protrusion that protrudes rearward at a laterally central part thereof. A rear end of the protrusion is positioned more rearward than a rear end of the driving source.

Abstract: A rear side door 20 designed to open and close an opening formed in a body 40 includes an inner panel 21 and a door beam 24. The door beam 24 is mounted on an inner panel 21 through a bracket 25 placed between the door beam 24 and the inner panel 21, and a patch member 26 is disposed on a tip part 24A of the door beam 24 at a position overlapping the tip part 24A of the door beam 24 in the vehicle widthwise direction.

Abstract: A rear side door 20 designed to open and close an opening formed in a body 40 includes an inner panel 21 and a door beam 24. The door beam 24 is mounted on an inner panel 21 through a bracket 25 placed between the door beam 24 and the inner panel 21, and a patch member 26 is disposed on a tip part 24A of the door beam 24 at a position overlapping the tip part 24A of the door beam 24 in the vehicle widthwise direction.

Abstract: A side airbag apparatus deployed between a vehicle compartment sidewall and a vehicle occupant. The airbag has an upper chamber, a lower chamber, and a middle chamber formed between the upper and lower chambers. The middle chamber is deployed prior to the timing of deployment of the upper and lower chambers.

Abstract: A side airbag apparatus deployed between a vehicle compartment sidewall and a vehicle occupant. The airbag has an upper chamber, a lower chamber, and a middle chamber formed between the upper and lower chambers. The middle chamber is deployed prior to the timing of deployment of the upper and lower chambers.

Abstract: High density bonding pads in a printed circuit board for mounting a semiconductor chip are provided using a simple structure and at a low cost, while minimizing the difference in levels of bonding pads. A printed circuit board for mounting semiconductor chip(s) includes conductive traces on both sides of a base material, the first traces on a first surface of the base material having first bonding pads, the second traces on a second opposite surface of the base material having the second bonding pads. The bonding pads are located in rows adjacent each other with the base material having openings leading to the second bonding pads, such that chip bonding wires are connectible from the chip directly to the first bonding pads and through the openings to the second bonding pads.

Abstract: An area grid array package such as a ball grid array enables high pin count and high density with no problems of routing, and at low cost. Independent and non-connected circuits are formed on a first surface and a second surface of an insulative base material, each circuit on each surface having first chip connection pads formed on one end to connect to a semiconductor chip, the other end having second solder ball pads to mount solder balls. The chip is connected to the first connection pads by either bonding wires or connection bumps extending through holes in the base material and are molded by a resin. Each solder ball pad on each surface has a solder ball attached with the solder balls extending through openings in the base material. The insulative base material and the semiconductor chip may be attached to a heat slug.

Abstract: A ball grid array semiconductor package includes an insulative base material; circuitry metallizations formed on a first surface of the material, each metallization having a grid pad electrode; and a semiconductor chip mounted on the first surface and electrically connected to the circuitry metallizations. The base material is opened from a second surface of the base material at a location under each grid pad electrode; and each opening confines a portion of a solder ball which is in melt-fixed connection to a back side of each grid electrode.

Abstract: A product order specification change system for a corrugation machine having a slitter-scorer device and a plurality of cutoff devices for producing corrugated board sheets having various widths and lengths, includes a cutting apparatus wherein at an order change where specifications for the sheet width are changed from one order to the next, a region is formed between the leading end of the new order sheets and the trailing end of the old order sheets, wherein a transitional slit groove is cut connecting a slit groove of the old order sheets with a slit groove of the new order sheets. As a result, the web can be stably transferred through stages of the machine, the cutting dimension accuracy can be maintained precisely, and faults such as jamming can be eliminated.

Abstract: An integrated circuit package, and a method for forming the integrated circuit package, including a single layer or multilayer substrate in which interconnection vias are formed is described. Laser energy is swept across a surface of a mask in which holes have been formed. Laser energy passing through the holes of the mask forms vias in a substrate held in place below the mask. The laser energy is swept at such a speed and is maintained at such an energy level that the laser energy forms vias in the substrate, but does not penetrate a set of leads attached to the substrate. Vias may be formed in this way by either a mask imaging, contact mask or conformal mask technique. The laser energy is emitted from a non-thermal (e.g., excimer) laser. The substrate is formed of an organic (e.g., epoxy) resin. The resin may include reinforcing fibers (e.g., aramid fibers). Substrates may be formed on one or both sides of the set of leads.

Abstract: An epoxy resin-impregnated prepreg useful for the production of a copper foil-laminated board of a chip-on-board having a high heat resistance, high dimension stability and high silver migration-preventing property, comprises an aromatic polyamide fiber base material having 3.0% by weight or less of an equilibrium moisture content, 80 ppm or less of an extracted chlorine content and 50 ppm or less of an extracted sodium content, and an epoxy resin composition comprising an epoxy resin and a curing agent, containing 5 ppm or less of sodium and 600 ppm or less of chlorine and impregnated in the base material, said aromatic polyamide fibers having been produced by a wet spin-drawing process having a draw-washing procedure in which undrawn aromatic polyamide filaments are drawn at a draw ratio of 1.05 to 1.5, while forwarding the filaments through a hot water bath having a path length of 1 to 50 m and while flowing hot water at 30.degree. C. to 100.degree. C.

Abstract: An integrated circuit package, and a method for forming the integrated circuit package, including a single layer or multilayer substrate in which interconnection vias are formed is described. Laser energy is swept across a surface of a mask in which holes have been formed. Laser energy passing through the holes of the mask forms vias in a substrate held in place below the mask. The laser energy is swept at such a speed and is maintained at such an energy level that the laser energy forms vias in the substrate, but does not penetrate a set of leads attached to the substrate. Vias may be formed in this way by either a mask imaging, contact mask or conformal mask technique. The laser energy is emitted from a non-thermal (e.g., excimer) laser. The substrate is formed of an organic (e.g., epoxy) resin. The resin may include reinforcing fibers (e.g., aramid fibers). Substrates may be formed on one or both sides of the set of leads.

Abstract: A ball grid array is formed by mounting and electrically connecting one or more electronic devices to a substrate in which vias are formed to interconnect electrically conductive traces formed in a surface of the substrate to solder ball pads formed at an opposite surface of the substrate. The vias are formed by mechanical or laser drilling. Solder balls are formed on each of the pads and are reflow-attached to, for instance, a printed circuit board. The electronic components can include one or more integrated circuit chips, as well as passive components. The electronic components are attached to the substrate using wirebonding, TAB or flip chip connection. An encapsulating material is applied to encapsulate the electronic devices.

Abstract: An anvil cylinder is severed along an axial direction of a shaft into a plurality of ring-shaped sections, and elastic bodies are fixedly secured to parts of outer circumferential surfaces of the severed anvil cylinder sections over the entire length of the cylinder. In addition, the respective anvil cylinder sections are adapted to be individually engaged with or disengaged from a knife with the aid of a rotary object. By adjusting the positions of the anvil cylinder sections, slitting slots can be formed by machining only at the portions where slitting slots are necessitated.

Abstract: A surface-modified wholly aromatic polyamide fiber having an enhanced bonding property, surface tenacity and durability and a reduced friction, comprises a fiber matrix of a wholly aromatic polyamide material, fine particles of a cation-exchanging inorganic material distributed on and in a surface portion of the matrix and an additive comprising a cationic organic compound or a multi-functional organic silicone compounds, and attached to the fine organic particles.

Abstract: A composition and method for the treatment of inflammation, rheumatism, autoimmune disease, ischemic damage of organs, drug toxicity and arteriosclerosis comprising human ADF is disclosed.

Abstract: A conveyor system for reducing the speed of double-piece cut banks being fed to a stacker is provided. Cut-blanks are fed in pairs with the spacing between the blanks of the pair being small and the spacing between the pairs of objects being large along a first conveyor towards a detecting device which detects the leading edge of the blanks. A delivery member consisting of two sandwiching rollers is variably driven in accordance with signals given by the detecting device so as to deliver from the first conveyor the first blank of each pair at a first higher speed and the second blank of each pair at a second lower speed. Blanks are thereby delivered to a second slower conveyor which may be as low as V1=2l/LV2 wherein V2 is the speed of the first conveyor, l is the length of each blank, and L is the distance between the leading edge of a first pair of blanks to the leading edge of a second pair.