Abstract: A module having high reliability in terms of its connection to an external unit is provided. The module includes: a wiring substrate that mounts components and 3b thereon; a substrate electrode formed on one main surface of the wiring substrate; a columnar conductor connected at one end to the substrate electrode; an intermediate coating formed to cover an outer peripheral surface of the columnar conductor; and a first sealing resin layer provided to cover one main surface of the wiring substrate and the intermediate coating. The intermediate coating has a coefficient of linear expansion which is between that of the columnar conductor and that of the first sealing resin layer.

Abstract: To provide a compact module that is capable of achieving a low profile and that has excellent high-frequency characteristics, a module includes a parent board; first and second child boards arranged so as to face the parent board; multiple electronic components that include first electrodes and second electrodes electrically connected to the first electrodes, respectively, on both opposing faces, the first electrodes being connected to the first child board, the second electrodes being connected to the parent board; and multiple electronic components that include first electrodes and second electrodes electrically connected to the first electrodes, respectively, on both opposing faces, the first electrodes being connected to the second child board, the second electrodes being connected to the parent board.

Abstract: A module includes a circuit board, a resin layer, an external connection conductor, a solder bump. The resin layer is disposed on a first principal surface of the circuit board. The external connection conductor is arranged in the resin layer, has a first end connected to the circuit board and a second end protruding through the surface of the resin layer and includes a projection extending along the surface of the resin layer in a portion that protrudes through the surface of the resin layer. The solder bump is disposed on the second end of the external connection conductor.

Abstract: A low profile module is provided that has a high functionality achieved by increasing the component mounting density. In spite of achieving high functionality in a module 100 by respectively mounting components such as a semiconductor substrate 104 and chip components 105 on the two main surfaces 101a and 101b of a wiring substrate 101, the low-profile module 100 can be provided which has a high functionality as a result of increasing its component mounting density by forming a thickness Ha of a first component layer 102 formed by mounting only the semiconductor substrate 104 face down on one main surface 101a of the wiring substrate 101 so as to be smaller than the thickness of a second component layer 103 formed by mounting a plurality of chip components 105 on the other main surface 101b of the wiring substrate 101.

Abstract: An infinitely variable physical vapor deposition matrix system that allows the synthesis of multiple combinatorial catalyst samples at essentially the same time, by the co-deposition of multiple materials, or the sequential layer by layer deposition of multiple catalyst constituents, or both, such that the optimum mix of materials for a pre-determined application can be experimentally determined in subsequent testing. The discovery of optimal catalyst combinations for utilization in specified reactions and devices is facilitated. The high throughput system reduces the time and complexity of processing typically required to formulate and test combinatorial catalyst materials.

Abstract: A window cover for an automobile integrally includes: a front sheet to cover an outer surface of an automobile windshield; and a pair of side sheets to cover outer surfaces of left and right front door glasses, respectively. The side sheets are fixed to a vehicle body by a fixing device. The device includes a plate-shaped tab fixed to a rear edge of each side sheet. The tab is fixed by being inserted into a clearance between a rear edge of each of the front door glasses and a front edge of a rear door glass of a rear door placed rearward of the rear edge. Accordingly, convenience is improved because the cover can be easily attached to the vehicle body with the front and rear doors remaining closed, and workability is not deteriorated because the cover is not twisted or entwined when the front doors are opened or closed.

Abstract: An engagement structure for preventing the separation of a resin layer is formed in a contact surface of an insulating substrate in a connecting component, the contact surface being in contact with the resin layer. The resin layer engages with the engagement structure in the contact surface in the insulating substrate in contact with the resin layer, the contact surface forming the side surface of the connecting component.

Abstract: A module includes a circuit board, a resin layer, an external connection conductor, a solder bump. The resin layer is disposed on a first principal surface of the circuit board. The external connection conductor is arranged in the resin layer, has a first end connected to the circuit board and a second end protruding through the surface of the resin layer and includes a projection extending along the surface of the resin layer in a portion that protrudes through the surface of the resin layer. The solder bump is disposed on the second end of the external connection conductor.

Abstract: A packaging bag is provided with a bag body and thermoplastic resin-made reinforcing members provided at the outer edge of the bag body. A window is provided in each reinforcing member. In forming the packaging bag, the bag body is placed between a pair of molds respectively having recesses to clamp these two molds so that a corresponding pair of the recesses are opposed to each other. Thereafter, in order to form the reinforcing members at the outer edge of the bag body, melted or softened thermoplastic resin is injected to fill cavities formed by the recesses of the thus clamped molds. Each of the cavities of the molds is formed so as to coincide with an outer shape of the corresponding reinforcing member. A projection extends from the bottom face of each recess at a part of the cavity corresponding to a part of each reinforcing member on which the window is provided.

Abstract: A bi-laterally surfaced substrate in which the first surface consists of one or more than one of cerium oxide, aluminum oxide, tin oxide manganese oxide, copper oxide, cobalt oxide, nickel oxide, praseodymium oxide, terbium oxide, ruthenium, rhodium, palladium, silver, iridium, platinum and gold and the second surface consists of one or more than one of ruthenium, rhodium, palladium, silver, iridium, platinum and gold and micro channel micro component reactors including such substrates in a predetermined formed shape and methods for making the same utilizing a thermal spray on one side and a physical deposition process on the other side.

Abstract: A fuel cell system includes a branch anode gas supply pipe in which hydrogen before supplied to a fuel cell flows; and a branch cathode gas supply pipe in which air before supplied to the fuel cell flows. One end on the upstream side of the branch anode gas supply pipe is connected to the upstream side of a regulator in an anode gas supply pipe, and the other end thereof is connected to the branch cathode gas supply pipe via a hydrogen injector. The branch anode gas supply pipe is provided with a hydrogen regulator, which detects a pressure in the branch cathode gas supply pipe as a signal pressure.

Abstract: The present teachings are directed toward electrocatalyst composition of an alloy of platinum and tungsten for use in fuel cells. The alloy consists essentially of platinum metal present in an atomic percentage ranging between about 20 percent and about 50 percent, and tungsten metal present in an atomic percentage ranging between about 50 percent and about 80 percent.

Abstract: An LED can include a pair of electrode members, an LED chip joined on top of a chip mounting portion disposed at an end of one of the pair of electrode members. The LED chip can be electrically connected to both of the pair of electrode members, and a clear resin portion can be formed to surround the LED chip. The clear resin portion can include a wavelength converting material mixed therein, wherein the LED chip emits ultraviolet, blue, or green light, and wherein the wavelength converting material mixed in the clear resin portion converts light from the LED chip to green and red light that is longer in wavelength than the originally emitted light from the LED chip.

Abstract: A headlight device (27) for motor vehicle includes a plurality of headlight units (29 and 30). At least one of those headlight units is a movable headlight unit (30) having a light distribution adjusting mechanism (83) for changing a range of illumination during a cornering of the motor vehicle.

Abstract: A constant velocity joint comprises an outer race, inner race and torque transmitting elements. The outer race has a cylindrical hollow part with an opening at one end and plural walls on an inner surface of the cylindrical hollow part. At the opening of the cylindrical hollow part, the walls have projections formed by a pin-drive. The inner race is assembled with the torque transmitting elements and press-fitted into the cylindrical hollow part of the outer race.