Abstract: A gasket includes a cavity provided within the gasket, and a convex and a concave included in an inner surface of the gasket and configured to contact with the cavity so as to face with each other along a direction in which the gasket is sandwiched.

Abstract: A strain waveform control apparatus of the present invention is adapted to horizontally supporting a printed circuit board over a trestle and cause strains on the printed circuit board by a dropped rigid ball with buffer blocks being located on both surfaces of the printed circuit board. These buffer blocks are movably supported by movable stages so as to be in contact with proper places of both surfaces of the printed circuit board. The buffer blocks are capable of regulating and relatively modify/adjusting first and second occurred strain waveforms generated by application of the impact to the printed circuit board and modifying/adjusting a steepness of each of the strain waveforms.

Abstract: The present invention has been made to provide a laser bending process estimation apparatus, a laser bending process estimation program, and a laser bending process estimation method capable of estimating a result of a laser bending process without an actual workpiece. A laser bending process estimation apparatus that estimates a result of a bending process performed using a laser beam comprises: a process condition acquisition section 1 that acquires a process condition of the bending process; an analysis model creation section 3 that creates an analysis model based on the process condition acquired by the process condition acquisition section 1; and an analysis section 5 that performs heat transfer analysis and heat stress analysis based on the analysis model created by the analysis model creation section 3 to calculate an analysis result of the bending process.

Abstract: The present invention has been made to provide a laser bending process estimation apparatus, a laser bending process estimation program, and a laser bending process estimation method capable of estimating a result of a laser bending process without an actual workpiece. A laser bending process estimation apparatus that estimates a result of a bending process performed using a laser beam comprises: a process condition acquisition section 1 that acquires a process condition of the bending process; an analysis model creation section 3 that creates an analysis model based on the process condition acquired by the process condition acquisition section 1; and an analysis section 5 that performs heat transfer analysis and heat stress analysis based on the analysis model created by the analysis model creation section 3 to calculate an analysis result of the bending process.

Abstract: A strain waveform control apparatus of the present invention is adapted to horizontally supporting a printed circuit board over a trestle and cause strains on the printed circuit board by a dropped rigid ball with buffer blocks being located on both surfaces of the printed circuit board. These buffer blocks are movably supported by movable stages so as to be in contact with proper places of both surfaces of the printed circuit board. The buffer blocks are capable of regulating and relatively modify/adjusting first and second occurred strain waveforms generated by application of the impact to the printed circuit board and modifying/adjusting a steepness of each of the strain waveforms.

Abstract: An inductor of the invention is obtained by forming conductors of a desired shape on bendable plate type support members, providing a slit in one end of each of the conductors, and a claw on the other end of each of the conductors, bending the plate type support members, engaging the slits and claws with each other so as to form windings on the support members and openings therein, and inserting magnetic cores through the openings.

Abstract: An inductor of the invention is obtained by forming conductors 21 of a desired shape on bendable plate type support members 20, providing a slit 24 in one end of each of the conductors 21, and a claw 25 on the other end of each of the conductors, bending the plate type support members 20, engaging the slits and claws with each other so as to form windings 12 on the support members and openings 28 therein, and inserting magnetic cores 11 through the openings.