Abstract: In embodiments of the present disclosure, disclosure is an immunogenicity prediction method comprising the steps of: acquiring information about synthetic long peptides for treating carcinoma in a subject through an immunogenicity prediction device; processing the synthetic long peptides by one processing method of embedding, one-hot encoding, and BLOSUM through the immunogenicity prediction device, and outputting one or more antigen feature values based on the processed data; inputting the cleavage probability vector for each position of the synthetic long peptides through the immunogenicity prediction device to output one or more cleavage feature values; inputting a neoantigen peptide sequence, an HLA class I sequence, an HLA class II sequence within the synthetic long peptides through the immunogenicity prediction device to output one or more neoantigen feature values related to the immunity and binding affinity to the neoantigen peptide sequence; and outputting an immunogenicity score of the neoantigen pe

Abstract: An X-ray apparatus which aligns an X-ray radiator with an X-ray detector, an X-ray apparatus which aligns an X-ray radiator with an X-ray detector while maintaining a Source to Image-receptor Distance (SID) and a Source to Object Distance (SOD) therebetween, and methods of operating the X-ray apparatuses are provided.

Abstract: An X-ray apparatus which aligns an X-ray radiator with an X-ray detector, an X-ray apparatus which aligns an X-ray radiator with an X-ray detector while maintaining a Source to Image-receptor Distance (SID) and a Source to Object Distance (SOD) therebetween, and methods of operating the X-ray apparatuses are provided.

Abstract: A method of manufacturing a multi-band front end module having an embedded passive element, the method including: preparing metal plates formed on either surface of an adhesion layer interposed therebetween; forming first circuit patterns on the plates; separating the plates by removing the adhesion layer; pressing one of the plates to one surface of an insulation layer and another of the plates to the other surface of the insulation layer; removing the plates to form the insulation layer having the first circuit patterns formed on either surface thereof; stacking dielectric layers on either surface of the insulation layer; and forming a second circuit pattern on the dielectric layers stacked on the either surface of the insulation layer.

Abstract: A method of manufacturing a printed circuit board (PCB) having embedded resistors, including providing a PCB on which internal layer circuit patterns, including electrode pads, are formed; layering insulating layers on the PCB; forming first via holes on the electrode pads and simultaneously forming second via holes at predetermined locations on the internal layer circuit patterns; forming contact pads for connecting the electrode pads with resistors by filling the first via holes with oxidation-resistant conductive material and flattening the oxidation-resistant conductive material; forming the resistors so that ends of each resistor are connected to two respective contact pads, which are spaced apart from each other; forming circuit patterns on the PCB, in which the second via holes are formed; and layering insulting layers on the PCB having the formed circuit patterns, and forming external layer circuit patterns.

Abstract: Disclosed are a printed circuit board for improving the tolerance of embedded capacitors and a method of manufacturing the same. The printed circuit board having embedded capacitors is manufactured by transferring and embedding a circuit layer having a lower electrode formed through an additive process into a resin insulating layer, and thereby is minimized in the circuit tolerance conventionally caused by an etching process to thus be applied to capacitors for RF matching.

Abstract: A method of manufacturing a printed circuit board (PCB) having embedded resistors, including providing a PCB on which internal layer circuit patterns, including electrode pads, are formed; layering insulating layers on the PCB; forming first via holes on the electrode pads and simultaneously forming second via holes at predetermined locations on the internal layer circuit patterns; forming contact pads for connecting the electrode pads with resistors by filling the first via holes with oxidation-resistant conductive material and flattening the oxidation-resistant conductive material; forming the resistors so that ends of each resistor are connected to two respective contact pads, which are spaced apart from each other; forming circuit patterns on the PCB, in which the second via holes are formed; and layering insulting layers on the PCB having the formed circuit patterns, and forming external layer circuit patterns.

Abstract: A multi-band front end module and a method of manufacturing the multi-band front end module. The method may include forming a first circuit pattern on one side of an insulation layer, stacking a dielectric layer over the one side of the insulation layer, and forming a second circuit pattern on the dielectric layer in correspondence with the first circuit pattern such that at least one of a capacitor and an inductor is implemented. An embodiment of the invention allows the positioning of various passive elements while maintaining a compact size for the multi-band front end module.

Abstract: Disclosed are a printed circuit board for improving the tolerance of embedded capacitors and a method of manufacturing the same. The printed circuit board having embedded capacitors is manufactured by transferring and embedding a circuit layer having a lower electrode formed through an additive process into a resin insulating layer, and thereby is minimized in the circuit tolerance conventionally caused by an etching process to thus be applied to capacitors for RF matching.

Abstract: Disclosed herein is a Printed Circuit Board (PCB) having embedded resistors and a method of manufacturing the same, in which contact pads are formed by filling via holes formed on electrode pads with oxidation-resistant conductive material, and resistors are formed on the contact pads. Accordingly, erosion that occurs between the electrode pads and the resistors can be prevented using the contact pads made of oxidation-resistant conductive material, and connections between circuits also can be realized. Furthermore, resistors are formed on a flat plane without any difference in height, attributable to the electrode pads, and thus differences between the resistance values of the built-in resistors can be greatly reduced.