Patents by Inventor Tae Hyeon JEON

Tae Hyeon JEON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD AND APPARATUS FOR TREATING SUBSTRATE
    Publication number: 20230073489
    Abstract: Provided is a substrate treating method of removing a thin film formed on a substrate. The substrate treating method includes a reaction process of transferring an etchant to the thin film, and a removal process of removing process by-products generated by reacting the thin film with the etchant, in which the reaction process and the removal process are repeated at least twice or more, and any one of the removal processes is to remove partially the process by-products.
    Type: Application
    Filed: September 2, 2022
    Publication date: March 9, 2023
    Applicant: SEMES CO., LTD.
    Inventors: Dong-Hun KIM, Jae Hwan KIM, Hye Joon KHEEL, Gun Woo KIM, Tae Hyeon JEON
  • Flexible circuit board and frame assembly including same
    Patent number: 11309593
    Abstract: Provided is a flexible circuit board installed on a frame to which a bus bar is coupled. The flexible circuit board may include a central portion having a band shape, first connection circuit portions formed at both ends of the central portion and disposed to face each other, second connection circuit portions extending from the first connection circuit portions in parallel with the central portion, and third connection circuit portions extending from the first connection circuit portions and the second connection circuit portions and connected to the bus bar. An overlapped may be formed when each of the second connection circuit portions is folded toward one side of each of the first connection circuit portions.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: April 19, 2022
    Assignee: Yura Corporation Co., Ltd.
    Inventors: Jung Hak Oh, Jin Su Yeom, Jong Won Lee, Tae Hyeon Jeon, Cheon Hyo Lee, Kwang Ouk Sa, Ji Eun Kang, Seung Jun Noh
  • FLEXIBLE CIRCUIT BOARD AND FRAME ASSEMBLY INCLUDING SAME
    Publication number: 20190348720
    Abstract: Provided is a flexible circuit board installed on a frame to which a bus bar is coupled. The flexible circuit board may include a central portion having a band shape, first connection circuit portions formed at both ends of the central portion and disposed to face each other, second connection circuit portions extending from the first connection circuit portions in parallel with the central portion, and third connection circuit portions extending from the first connection circuit portions and the second connection circuit portions and connected to the bus bar. An overlapped may be formed when each of the second connection circuit portions is folded toward one side of each of the first connection circuit portions.
    Type: Application
    Filed: December 27, 2017
    Publication date: November 14, 2019
    Applicant: Yura Corporation Co., Ltd.
    Inventors: Jung Hak OH, Jin Su YEON, Jong Won LEE, Tae Hyeon JEON, Cheon Hyo LEE, Kwang Ouk SA, Ji Eun KANG, Seung Jun NOH