Abstract: The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate.

Abstract: The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate.In manufacturing the article of manufacture, a surface treatment technique such as wet process or a plasma/optional silane coupling agent may be applied to either the substrate, adhesive polyimide film or polyimide film prior to the bonding operation.

Abstract: A composition for an intergranular insulation type semiconductive ceramic capacitor essentially consisting of 1 mole of SrTiO.sub.3, 0.005 mole to 0.012 mole of TiO.sub.2, and 0.003 mole to 0.006 mole of a quinquevalent ion oxide selected from a group consisting of Nb.sub.2 O.sub.5, Ta.sub.2 O.sub.5, Sb.sub.2 O.sub.5 and the mixture thereof. An intergranular insulation type semiconductive ceramic capacitor is made by sintering a ceramic body made of the composition at a temperature of not less than 1,500.degree. C. in the atmosphere, to form a sintered body having a liquid phase at its grain boundaries, and cooling the sintered body so that the liquid phase forms an intergranular insulating layer. The intergranular insulation type semiconductive ceramic capacitor exhibits a dielectric constant of not less than 40,000 and an insulation resistance of not less than 10.sup.9 .OMEGA..

Abstract: An intercrystalline semiconductive ceramic capacitor having a dielectric ceramic body formed by sintering a dielectric ceramic having a composition essentially consisting of a major component comprised of 1 mole SrTiO.sub.3 and a minor component comprised of 0.01 to 0.04 mole TiO.sub.2, 0.001 to 0.010 mole Dy.sub.2 O.sub.3, 0.001 to 0.007 mole ZnO, 0.002 to 0.012 mole MnO.sub.2 and 0.01 to 0.07 mole Al.sub.2 O.sub.3 at a temperature of 1,400.degree. to 1,470.degree. C. in a reducing atmosphere, an intercrystalline insulation layer formed by coating an insulation paste over both surfaces of the dielectric ceramic body and heat treating the resultant body, and external electrodes formed on the both surface of the dielectric ceramic body, respectively.

Abstract: The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate.In manufacturing the article of manufacture, a surface treatment technique such as wet process or a plasma/optional silane coupling agent may be applied to either the substrate, adhesive polyimide film or polyimide film prior to the bonding operation.

Abstract: A heater with a humidifier wherein the humidifier comprises a plurality of double pipes in the uppermost line of the heat exchanging pipes of the heater. The double pipe includes an inner pipe for burned gas flow and an outer pipe for containing humidifying water, both of which are arranged concentrically. A plurality of orifices are formed at the top portion of the outer pipe so that the steam generated from the humidifying water by heat of the burned gas in the inner pipe may be spurted from the orifices to humidify the air stream blown by a blower. The outer pipes are connected to a common feed-water pipe in which a flow control valve may be provided. The control valve is also electrically connected to a feed-water level sensor in the outer pipe so that the level of the water in the outer pipe may be detected and controlled.