Abstract: Various example embodiments provide a transfer hand for transferring a substrate. The transfer hand for transferring the substrate comprises: a body; and a vacuum assembly installed in the body and providing decompression to the bottom surface of a substrate to support the substrate at the upper part of the body; wherein the vacuum assembly comprises: an vacuum pad with conductivity contacting the substrate; and a sealing member provided between the vacuum pad and the body, the sealing member electrically connected to the vacuum pad; wherein the sealing member is grounded.

Abstract: A dynamic characteristic-reflected shoreline evaluation system and a method thereof are proposed. The system may include a data collection processor configured to collect various types of information for shoreline evaluation with respect to an evaluation target region. The system may also include a shoreline evaluation processor configured to determine a shoreline rank by reflecting static characteristics and dynamic characteristics of the evaluation target region on a basis of data collected through the data collection unit. The system may further include an output processor configured to output the various types of information comprising an evaluation result of the shoreline evaluation unit and an overall process and result of the system. The system may further include a communication processor configured to transmit and receive various types of data through wired or wireless communication with an external device. The system may include a controller configured to control an overall operation of the system.

Abstract: Disclosed is an apparatus and method for audio encoding/decoding that is robust against coding distortion in a transition section. An audio encoding method includes outputting a frequency domain signal by time-to-frequency (T/F) transform of an input signal, outputting a frequency domain residual signal in which a frequency axis envelope is removed from the frequency domain signal by applying frequency domain noise shaping (FDNS) encoding to the frequency domain signal, outputting a time domain residual signal in which a time axis envelope is removed by performing linear prediction coefficient (LPC) analysis based on the frequency domain residual signal, and quantizing and transmitting the time domain residual signal.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a support plate for supporting a substrate and applying a power; a plasma control unit placed above the support plate to face the support plate; and a top electrode unit positioned to surround the plasma control unit, and wherein the plasma control unit includes: a dielectric plate positioned to face a top surface of a substrate mounted on the support plate; and a metal plate positioned above the dielectric plate, and the metal plate is electrically connected to the top electrode unit.

Abstract: An infusion flow regulator includes: a main body having an inlet through which fluid is introduced and an outlet through which the fluid is discharged; and a rotary dial rotatably coupled to the main body, with a sealing member interposed therebetween, so as to regulate a flow rate of the fluid, in which the rotary dial includes a regulating flow path having a shape of a recessed groove in cross section with a first width and a first height, and the regulating flow path includes a first region in which the first width is constant and the first height is decreased, and a second region in which both the first width and the first height are decreased. By the aforementioned configuration, the infusion flow regulator for the fluid can accurately regulate the flow rate even in a region where the flow rate of the fluid is very small.

Abstract: An optical sensor includes a substrate, a photoelectric element disposed on the substrate and that includes a first electrode, an intermediate layer disposed on the first electrode, and a second electrode disposed on the intermediate layer, a barrier layer disposed on the second electrode, an insulating layer that covers the photoelectric element and the barrier layer, and a bias electrode disposed on the insulating layer and electrically connected to the second electrode. The barrier layer is spaced apart from the first electrode.

Abstract: Disclosed herein are a method for access control using real-time positioning technology and a device using the same. According to a positioning method of a positioning module, the positioning module is configured to measure a location of at least one location-unrecognized device and a location of a terminal, wherein the at least one location-unrecognized device, the terminal and at least one location-recognized device is located in a certain zone, and wherein the positioning module has coordinate information of the at least one location-recognized device and the positioning module has not coordinate information of the at least one location-unrecognized device.

Abstract: A semiconductor device according to an embodiment may include: a light emitting structure; a light transmitting electrode layer disposed on the light emitting structure; and a reflective layer disposed on the light transmitting electrode layer and including a plurality of first openings and a plurality of second openings. The semiconductor device according to the embodiment may include: a first electrode in contact with a first conductivity type semiconductor layer of the light emitting structure; and a second electrode in contact with the light transmitting electrode layer through the plurality of first openings.

Abstract: A semiconductor device includes a semiconductor die, a defect detection structure and an input-output circuit. The semiconductor die includes a central region and a peripheral region surrounding the central region. The peripheral region includes a left-bottom corner region, a left-upper corner region, a right-upper corner region and a right-bottom corner region. The defect detection structure is formed in the peripheral region. The defect detection structure includes a first conduction loop in the left-bottom corner region, a second conduction loop in the right-bottom corner region, a third conduction loop in the left-bottom corner region and the left-upper corner region and a fourth conduction loop in the right-bottom corner region and the right-upper corner region. The input-output circuit is electrically connected to end nodes of the first conduction loop, the second conduction loop, the third conduction loop and the fourth conduction loop.

Abstract: An image sensor, including a substrate having a first surface, and a second surface opposite to the first surface; a first focus pixel; a first merged pixel; a second merged pixel; a first color filter; a second color filter; a third color filter; a grid pattern separating the first to third color filters, but not overlapped by the first to third color filters; a first micro-lens disposed on the first color filter; and a second micro-lens disposed on the second and third color filters, wherein a first-third unit pixel, the first focus pixel, and a second-third unit pixel are continuously arranged along the first direction, and wherein a width of the grid pattern between the first color filter and the second color filter is greater than a width of the grid pattern between the second color filter and the third color filter.

Abstract: An image sensor that provides a uniform sensitivity for pixels having color filters of the same color to increase the image quality is provided. The image sensor includes a substrate, a first grid pattern disposed on the substrate and including a first side wall and a second side wall opposite to the first side wall, a first pixel including a first photoelectric conversion element and a first color filter, and a second pixel including a second photoelectric conversion element and a second color filter. The first color filter contacts the first side wall and the second color filter contacts the second side wall. The first color filter and the second color filter are color filters of same color, and a first thickness of the first color filter is greater than a second thickness of the second color filter.

Abstract: The present disclosure provides a terminal set comprising an extended display and, more specifically, a terminal set having a main body and a sub body fastened to each other in order to solve the problem that multiple displays are output in different directions because a device inclination value measured by a sensor is in a range that has no influence. The terminal set comprises: an inclination sensor mounted on the main body so as to sense the inclination of the main body; and a controller for executing an application and thereby controlling a first display of the main body or a second display of the sub body so as to output the application. If the controller receives a new output signal regarding a first application in a state in which the sensed inclination of the main body is within a screen rotation nonactivation range, the controller retrieves an output rotation value allocated to the first display and an output rotation value allocated to the second display.

Abstract: An image sensor includes a substrate including a first surface on which light is incident and a second surface opposite to the first surface, unit pixels in the substrate, each including a photoelectric conversion layer, color filters on the first surface of the substrate, a grid pattern on the first surface of the substrate defining a respective light receiving area of each of the unit pixels, and microlenses on the color filters, each of the microlenses corresponding to a respective one of the unit pixels, wherein the unit pixels include a first pixel and a second pixel sharing a first color filter which is one of the color filters, and a first light receiving area of the first pixel is different from a second light receiving area of the second pixel.

Abstract: An image sensor in which a shading phenomenon is decreased and the quality is increased is provided. The image sensor includes a light-receiving region including a plurality of unit pixels. The image sensor further includes a first region with unit pixels adjacent to a center of the light-receiving region, and a second region with the unit pixels spaced apart from the center of the light-receiving region. In both regions, a plurality of color filters corresponding to the plurality of unit pixels is disposed on a first face of the substrate, as well as a grid pattern interposed between the plurality of color filters defining boundaries between the unit pixels. A width of the grid pattern in the second region is greater than a width of the grid pattern in the first region, thereby adjusting light receiving areas near the edge of the image sensor to correct for a shading phenomenon.

Abstract: An embodiment relates to a light emitting module, a flash module, and a terminal including the same. The light emitting module according to an embodiment comprises: a semiconductor layer; a phosphor layer arranged on one surface of the semiconductor layer; a plurality of light emitting chips including a plurality of electrodes arranged on a surface facing one surface of the semiconductor layer; a first partition arranged at one side of the plurality of light emitting chips, and a second partition arranged at the other side of the plurality of light emitting chips so as to face the first partition; and an opaque molding part, which encompasses the plurality of light emitting chips such that the upper surface of the phosphor layer and the bottom surfaces of the plurality of electrodes are exposed to the outside, and is arranged on the inner side of the first and second partitions.

Abstract: A semiconductor device includes a semiconductor die, a defect detection structure and an input-output circuit. The semiconductor die includes a central region and a peripheral region surrounding the central region. The peripheral region includes a left-bottom corner region, a left-upper corner region, a right-upper corner region and a right-bottom corner region. The defect detection structure is formed in the peripheral region. The defect detection structure includes a first conduction loop in the left-bottom corner region, a second conduction loop in the right-bottom corner region, a third conduction loop in the left-bottom corner region and the left-upper corner region and a fourth conduction loop in the right-bottom corner region and the right-upper corner region. The input-output circuit is electrically connected to end nodes of the first conduction loop, the second conduction loop, the third conduction loop and the fourth conduction loop.

Abstract: An embodiment relates to a light emitting module, a flash module, and a terminal including the same. The light emitting module according to an embodiment comprises: a semiconductor layer; a phosphor layer arranged on one surface of the semiconductor layer; a plurality of light emitting chips including a plurality of electrodes arranged on a surface facing one surface of the semiconductor layer; a first partition arranged at one side of the plurality of light emitting chips, and a second partition arranged at the other side of the plurality of light emitting chips so as to face the first partition; and an opaque molding part, which encompasses the plurality of light emitting chips such that the upper surface of the phosphor layer and the bottom surfaces of the plurality of electrodes are exposed to the outside, and is arranged on the inner side of the first and second partitions.

Abstract: A semiconductor device includes a semiconductor die, a defect detection structure and an input-output circuit. The semiconductor die includes a central region and a peripheral region surrounding the central region. The peripheral region includes a left-bottom corner region, a left-upper corner region, a right-upper corner region and a right-bottom corner region. The defect detection structure is formed in the peripheral region. The defect detection structure includes a first conduction loop in the left-bottom corner region, a second conduction loop in the right-bottom corner region, a third conduction loop in the left-bottom corner region and the left-upper corner region and a fourth conduction loop in the right-bottom corner region and the right-upper corner region. The input-output circuit is electrically connected to end nodes of the first conduction loop, the second conduction loop, the third conduction loop and the fourth conduction loop.

Abstract: A light emitting device package can include a package body; a light emitting device disposed on the package body and including first and second electrode pads on a bottom surface of the light emitting device; a first through hole in the package body; a second through hole in the package body, in which the first through hole is separated from the second through hole, the first electrode pad of the light emitting device directly overlaps with the first through hole in the package body, and the second electrode pad of the light emitting device directly overlaps with the second through hole in the package body.

Abstract: An embodiment may have a substrate (110) including a predetermined cavity (C); a plurality of light emitting chips (120) spaced apart from the cavity (C) of the substrate (110); a frame (130), disposed on the substrate (110) including a support portion (132) and a guide portion (134) including a predetermined through hole (H1); and a lens unit (140) disposed in the through hole (H1) of the guide portion (134).