Patents by Inventor Tae Won Kim

Tae Won Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210027308
    Abstract: A banking processing method according is performed by a processing logic including an application for banking processing implemented on a user terminal and a computer-readable storage medium. The method comprises the steps of: when the application for banking processing is run, searching a hardware security area of the user terminal and confirming the existence of a certificate for confirming an execution history of the application for banking processing; when the existence of the certificate is confirmed, searching the security area and confirming the existence of a token key for identifying whether login information of the user has been set; when the existence of the token key is not confirmed, setting the login information of the user by providing a membership page for setting the login information of the user; and opening an account according to a request of the user whose login information has been set.
    Type: Application
    Filed: March 25, 2019
    Publication date: January 28, 2021
    Inventors: Jung Hee KO, Tae Ki HA, Yeun Su KOO, Bo Hyun OH, Lee Rang PARK, Sung Jun KIM, Ji Hong PARK, Dong Joon LEE, Jung Min AHN, Geun Won MO, Hyeong Jin JANG, Jun Hyuk YUN, Hack Cheon KIM, Eun Jung GIL, Ji Eun KIM, Tae Won KIM, Seung Jin LEE, Do Young LEE
  • Patent number: 10892198
    Abstract: Exemplary etching methods may include flowing a hydrogen-containing precursor into a semiconductor processing chamber. The methods may include flowing a fluorine-containing precursor into a remote plasma region of the semiconductor processing chamber. The methods may include forming a plasma of the fluorine-containing precursor in the remote plasma region. The methods may include etching a pre-determined amount of a silicon-containing material from a substrate in a processing region of the semiconductor processing chamber. The methods may include measuring a radical density within the remote plasma region during the etching. The methods may also include halting the flow of the hydrogen-containing precursor into the semiconductor processing chamber when the radical density measured over time correlates to a produced amount of etchant to remove the pre-determined amount of the silicon-containing material.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: January 12, 2021
    Assignee: Applied Materials, Inc.
    Inventors: Chirantha P. Rodrigo, Suketu A. Parikh, Tsz Keung Cheung, Satya Gowthami Achanta, Jingchun Zhang, Saravjeet Singh, Tae Won Kim
  • Publication number: 20200345882
    Abstract: An aerogel carrying an active material, and a composite of a hydrogel and the aerogel are provided. The method for preparing the composite according to the present invention comprises the steps of preparing a plurality of aerogel particles having an active material in the pores, preparing a polymer solution in which a polymer is dissolved in a water-soluble solvent, preparing an aerogel/polymer dispersion by homogenizing after mixing the aerogel particles in the polymer solution, and preparing an aerogel/hydrogel composite carrier by mixing the dispersion with a crosslinking agent solution. According to the present invention, by producing a hydrogel composite in which a plurality of aerogel particles is distributed, a complex carrier in which oil and moisture can be carried simultaneously without any surfactant can be provided. Furthermore, a composite carrier having improved properties such as low density, high strength, high component content and stable desorption can be prepared.
    Type: Application
    Filed: January 21, 2019
    Publication date: November 5, 2020
    Applicant: Industry-University Cooperation Foundation Hanyang University
    Inventor: Tae Won KIM
  • Publication number: 20200337302
    Abstract: Disclosed is a method of manufacturing an antimicrobial adhesive film including (a) providing an adhesive film including a substrate film and an adhesive layer formed on one surface of the substrate film, (b) forming a laminated film including an antimicrobial material layer/substrate film/adhesive layer by applying an antimicrobial solution including an antimicrobial material and a solvent on the remaining surface of the substrate film of the adhesive film and performing drying, and (c) manufacturing an antimicrobial adhesive film including a substrate film/adhesive layer/antimicrobial material layer by rolling the laminated film into a cylinder shape so that the antimicrobial material layer and the adhesive layer are brought into contact with each other to thereby transfer the antimicrobial material layer onto the adhesive layer.
    Type: Application
    Filed: November 16, 2018
    Publication date: October 29, 2020
    Inventors: Tae Won KIM, Jae Cheol PARK
  • Patent number: 10755900
    Abstract: A method of applying a multi-layer plasma resistant coating on an article comprises performing plating or ALD to form a conformal first plasma resistant layer on an article, wherein the conformal first plasma resistant layer is formed on a surface of the article and on walls of high aspect ratio features in the article. The conformal first plasma resistant coating has a porosity of approximately 0% and a thickness of approximately 200 nm to approximately 1 micron. One of electron beam ion assisted deposition (EB-IAD), plasma enhanced chemical vapor deposition (PECVD), aerosol deposition or plasma spraying is then performed to form a second plasma resistant layer that covers the conformal first plasma resistant layer at a region of the surface but not at the walls of the high aspect ratio features.
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: August 25, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Toan Tran, Laksheswar Kalita, Tae Won Kim, Dmitry Lubomirsky, Xiaowei Wu, Xiao-Ming He, Cheng-Hsuan Chou, Jennifer Y. Sun
  • Publication number: 20200224313
    Abstract: Exemplary semiconductor processing chamber showerheads may include a dielectric plate characterized by a first surface and a second surface opposite the first surface. The dielectric plate may define a plurality of apertures through the dielectric plate. The dielectric plate may define a first annular channel in the first surface of the dielectric plate, and the first annular channel may extend about the plurality of apertures. The dielectric plate may define a second annular channel in the first surface of the dielectric plate. The second annular channel may be formed radially outward from the first annular channel. The showerheads may also include a conductive material embedded within the dielectric plate and extending about the plurality of apertures without being exposed by the apertures. The conductive material may be exposed at the second annular channel.
    Type: Application
    Filed: January 11, 2019
    Publication date: July 16, 2020
    Applicant: Applied Materials, Inc.
    Inventors: Laksheswar Kalita, Soonam Park, Dmitry Lubomirsky, Tien Fak Tan, LokKee Loh, Saravjeet Singh, Tae Won Kim
  • Publication number: 20200161491
    Abstract: A pattern-glass, according to one embodiment of the present invention, can comprise: a base plate unit coupled to a support body; and a pattern unit provided in the base plate unit, and comprising a transmission area to which light transmits while an angle, formed between an entrance direction and a deviation direction in a light path formed by the light emitted from a light source, forms an obtuse angle range, and a reflection area in which an angle, formed between an entrance direction and a deviation direction in a light path of vision light transferred to an observer, forms an acute angle range so as to have reflectivity bigger than that in the transmission area.
    Type: Application
    Filed: August 17, 2018
    Publication date: May 21, 2020
    Inventors: Tae-Won Kim, Tae-Joon Park, A-Rong Kim, Ji-Sang Park, Kun-Hoon Baek
  • Publication number: 20200158524
    Abstract: A carpool service system includes a service providing device which is configured to: receive carpool service requesting information from a user terminal; generate at least two routes based on the carpool service requesting information; and providing a carpool partner matching based on location information about each of the at least two routes and about each of one or more preregistered user routes.
    Type: Application
    Filed: July 18, 2019
    Publication date: May 21, 2020
    Inventors: Se Joon JOO, Tae Won KIM, Moo Shin RHEE, Ji Soo KIM
  • Publication number: 20200087788
    Abstract: Exemplary semiconductor showerheads may include a first plate characterized by a first surface in which a plurality of first apertures are defined, and further characterized by a second surface opposite the first surface and from which extends a plurality of annular members. Each annular member of the plurality of annular members may extend from a separate first aperture of the plurality of first apertures. A channel may be defined by each first aperture and corresponding annular member. The showerheads may also include a second plate coupled with the first plate and characterized by a first surface facing the first plate and a second surface opposite the first surface. A plurality of second apertures may be defined through the second plate within an internal area of the second plate. Each annular member of the plurality of annular members may extend within a separate second aperture of the plurality of second apertures.
    Type: Application
    Filed: September 17, 2018
    Publication date: March 19, 2020
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Tien Fak Tan, Saravjeet Singh, Tae Won Kim
  • Publication number: 20200091018
    Abstract: Exemplary etching methods may include flowing a hydrogen-containing precursor into a semiconductor processing chamber. The methods may include flowing a fluorine-containing precursor into a remote plasma region of the semiconductor processing chamber. The methods may include forming a plasma of the fluorine-containing precursor in the remote plasma region. The methods may include etching a pre-determined amount of a silicon-containing material from a substrate in a processing region of the semiconductor processing chamber. The methods may include measuring a radical density within the remote plasma region during the etching. The methods may also include halting the flow of the hydrogen-containing precursor into the semiconductor processing chamber when the radical density measured over time correlates to a produced amount of etchant to remove the pre-determined amount of the silicon-containing material.
    Type: Application
    Filed: September 14, 2018
    Publication date: March 19, 2020
    Applicant: Applied Materials, Inc.
    Inventors: Chirantha P. Rodrigo, Suketu A. Parikh, Tsz Keung Cheung, Satya Gowthami Achanta, Jingchun Zhang, Saravjeet Singh, Tae Won Kim
  • Publication number: 20200022159
    Abstract: A communication apparatus for inter-vehicular communication according to the present invention includes: a network state estimating unit configured to estimate network state information indicating a current network state based on driving information and channel state information of neighboring vehicles; a network access controller configured to control whether to transmit a message based on the network state information; a transmission scheduler configured to control a transmission time point of the message based on the network state information; and a transmission buffer unit configured to delay transmission of the message according to the control of the transmission time point of the transmission scheduler.
    Type: Application
    Filed: September 23, 2019
    Publication date: January 16, 2020
    Inventors: Song Nan Bai, Jae Il Jung, Tae Won Kim, Won Jae Yi
  • Publication number: 20190304756
    Abstract: Systems and methods may be used to produce coated components. Exemplary chamber components may include an aluminum, stainless steel, or nickel plate defining a plurality of apertures. The plate may include a hybrid coating, and the hybrid coating may include a first layer comprising a corrosion resistant coating. The first layer may extend conformally through each aperture of the plurality of apertures. The hybrid coating may also include a second layer comprising an erosion resistant coating extending across a plasma-facing surface of the semiconductor chamber component.
    Type: Application
    Filed: April 3, 2019
    Publication date: October 3, 2019
    Applicant: Applied Materials, Inc.
    Inventors: Laksheswar Kalita, Soonam Park, Toan Q. Tran, Lili Ji, Dmitry Lubomirsky, Akhil Devarakonda, Tien Fak Tan, Tae Won Kim, Saravjeet Singh, Alexander Tam, Jingchun Zhang, Jing J. Zhang
  • Patent number: 10425960
    Abstract: A communication apparatus for inter-vehicular communication according to the present invention includes: a network state estimating unit configured to estimate network state information indicating a current network state based on driving information and channel state information of neighboring vehicles; a network access controller configured to control whether to transmit a message based on the network state information; a transmission scheduler configured to control a transmission time point of the message based on the network state information; and a transmission buffer unit configured to delay transmission of the message according to the control of the transmission time point of the transmission scheduler.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: September 24, 2019
    Assignee: HYUNDAI MOBIS CO., LTD.
    Inventors: Song Nan Bai, Jae Il Jung, Tae Won Kim, Won Jae Yi
  • Patent number: 10395845
    Abstract: A flexible Ti—In—Zn—O transparent electrode for a dye-sensitized solar cell includes a flexible transparent substrate, and a Ti—In—Zn—O thin-film on the flexible transparent substrate. The Ti—In—Zn—O thin-film has an amorphous structure. The flexible transparent electrode, despite being deposited at room or low temperature, has low surface resistance, high conductivity and transmittance, superior resistance against external bending, improved surface characteristics and better surface roughness performance.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: August 27, 2019
    Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
    Inventors: Gi Seok Heo, Tae Won Kim, Jae Cheol Park, Kwang Young Kim
  • Patent number: 10393499
    Abstract: A method of determining an angle by an encoder includes generating a first angle data based on a rotation of a bipolar magnet and a second angle data based on a rotation of the multipolar magnet; determining a first waveform signal based on the first angle data and a second waveform signal based on the second angle data; converting the first waveform signal into a third waveform signal having a cycle similar to the second waveform signal; calculating an angle result value as a function of the second angle data and a determined value about a location of a rotation cycle of the multipolar magnet based on a difference between the second waveform signal and the third waveform signal; and determining an absolute angle corresponding to the calculated angle result value based on stored angle data.
    Type: Grant
    Filed: May 4, 2017
    Date of Patent: August 27, 2019
    Assignee: FASTECH CO., LTD.
    Inventors: Jae Wook Jeon, Nguyen Xuan Ha, Jae Wan Park, Jun Young Moon, Tae Won Kim, Do Eon Lee
  • Patent number: 10381312
    Abstract: Disclosed herein are a semiconductor package and a method of manufacturing the same. The semiconductor package according to embodiments of the present disclosure includes a wiring including a plurality of layers including an insulating layer and a wiring layer, a semiconductor chip mounted on the wiring and electrically connected to the wiring layer through a bonding pad, a cover member configured to cover side surfaces of the semiconductor chip and the wiring and be in contact with at least one wiring layer, and an encapsulant configured to seal the cover member. Accordingly, the cover member covers the semiconductor chip and is in contact with the wiring formed under the semiconductor chip, thereby reducing electromagnetic interference, minimizing noise between operations of the semiconductor package, and improving a signal speed.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: August 13, 2019
    Assignee: NEPES CO., LTD.
    Inventors: Il-Hwan Kim, Jun-Kyu Lee, Min-A Yoon, Dong-Hoon Oh, Tae-Won Kim
  • Publication number: 20190148771
    Abstract: The method for manufacturing a solid electrolyte using an LLZ material for a lithium-ion battery comprises the steps of: providing a starting material in which lanthanum nitrate [La(NO3)3.6H2O] and zirconium nitrate [ZrO(NO3)2.6H2O] are mixed at a mole ratio of 3:2; forming an aqueous solution by dissolving the starting material; forming a precipitate by putting ammonia, which is a complex agent, and sodium hydroxide, which adjusts the pH of a reactor, into the aqueous solution, mixing the same, and then co-precipitating the mixture; forming a primary precursor powder by cleaning, drying and pulverizing the precipitate; forming a secondary precursor powder by mixing lithium powder [LiOH.H2O] with the primary precursor powder and ball-milling the mixture so as to solidify the lithium; and forming a solid electrolyte powder by heat-treating the secondary precursor powder.
    Type: Application
    Filed: January 16, 2019
    Publication date: May 16, 2019
    Inventors: Ho Sung KIM, Tae Won KIM, Duck Rye CHANG, Jong Ho LEE, Kyeong Wan KIM, Min Young KIM
  • Publication number: 20190127802
    Abstract: The present disclosure relates to a new biomarker for predicting susceptibility to an EGFR-targeted agent and a use thereof, and more particularly, provides a biomarker for predicting susceptibility to an EGFR (Epidermal Growth Factor Receptor)-targeted agent, comprising a RON (Recepteur d'Origine Nantais) gene; a composition for predicting susceptibility to the EGFR-targeted agent, comprising an agent which measures a gene expression level of the biomarker; or an expression or activity level of a protein thereof; a composition for enhancing the susceptibility to the EGFR-targeted agent, comprising an inhibitor of the expression of the gene or the expression or activity of the protein of the gene as active ingredients; a kit for predicting the susceptibility to the EGFR-targeted agent, comprising the composition; and a method for predicting the susceptibility to the EGFR-targeted agent.
    Type: Application
    Filed: July 29, 2015
    Publication date: May 2, 2019
    Inventors: Tae Won Kim, Dong Hoon Jin, Seung Woo Hong, Jai Hee Moon, Jae Sik Shin, Seung Mi Kim, Dae Hee Lee, Eun Young Lee, Seul Lee, Yong Sang Hong
  • Publication number: 20190122899
    Abstract: A semiconductor package comprising a fan-out structure and a manufacturing method therefor are disclosed. A semiconductor package according to an embodiment of the present invention comprises: a wiring unit comprising an insulation layer and a wiring layer; a semiconductor chip mounted on the wiring unit and coupled to the wiring layer by flip-chip bonding; a filling member for filling a gap between the semiconductor chip and the wiring unit; and a film member for performing coating so as to cover one surface of each of the semiconductor chip, the filling member, and the wiring unit.
    Type: Application
    Filed: April 3, 2017
    Publication date: April 25, 2019
    Applicant: NEPES CO., LTD.
    Inventors: Yong-Tae KWON, Jun-Kyu LEE, Si Woo LIM, Dong Hoon OH, Jun Sung MA, Tae-Won KIM
  • Patent number: 10133910
    Abstract: An electronic device according to the present disclosure includes: a housing including a first plate directed in a first direction, a second plate facing a second direction opposite the first direction, and a side member that encloses at least a portion of a space between the first plate and the second plate; a display disposed to be exposed through a first region of the first plate; a first opening formed in a second region of the first plate that is located adjacent to the display; a button structure disposed through the first opening, in which the button structure includes a cover layer exposed to an outside of the housing, an annular structure that encloses at least a portion of the cover layer when viewed from above the cover layer, and a fingerprint recognizing member enclosed by the annular structure and including a fingerprint recognizing pad including a plurality of conductive lines formed to recognize a fingerprint when a user's finger comes in contact with the cover layer, and a circuit region incl
    Type: Grant
    Filed: January 20, 2017
    Date of Patent: November 20, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Joon-Won Chang, Ki-Hwan Kwak, Jeong-Eon Kim, Tae-Won Kim, Ye-Seul Lee