Patents by Inventor Tae Won Seo
Tae Won Seo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240190358Abstract: The present disclosure relates to a beam projector apparatus for a vehicle, in which a beam projector installed on an armrest of a rear seat may be used to project a video onto a screen provided in a vehicle and enable a vehicle passenger to watch the video in a situation in which the vehicle passenger takes a rest, and as necessary, the projector may be taken out of the armrest and used in an outdoor resting space outside the vehicle to allow a user to watch a video.Type: ApplicationFiled: July 10, 2023Publication date: June 13, 2024Inventors: Suk Won HONG, Ga be Nam, Gil Ju Kim, Sang Man Seo, Tae Hwan Kim, Hyung Sun Park, Ji Sung Bae
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Patent number: 11994309Abstract: An air conditioner includes an outdoor unit, a plurality of mode change devices including at least one mode changer including a branch duct and a changing valve, and configured to receive a control signal from the outdoor unit to control an operation of the at least one mode changer. A plurality of indoor units are connected to the outdoor unit or the plurality of mode change devices. The outdoor unit may determine an operation mode to operate the plurality of mode change devices a plurality of times. Each of the plurality of indoor units may detect a temperature change of an indoor heat exchanger in response to the operation of the mode change devices, to determine the number of connected mode changers and a connectable mode changer candidate group based on the temperature change of the indoor heat exchanger.Type: GrantFiled: August 19, 2019Date of Patent: May 28, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jong Won Bak, Tae Il Kim, Dong-Il Jung, Dong Hyun Goh, Hyeong Joon Seo, Suk Ho Lee, Byoung Guk Lee, Hyeong Seok Lim, Yong Hee Jang
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Publication number: 20240147487Abstract: The method for transmitting control information in a mobile communication system includes: determining a control channel resource for transmitting control information by means of the data channel region; and transmitting the control information using the determined control channel resource. A capacity for control information, which increases for multiple user multiple-input multiple-out (MIMOs) in a heterogeneous network environment, for heterogeneous network interference control using carrier aggregation, for frequent use of a multicast-broadcast single frequency network (MBSFN) subframe, and for a CoMP transmission control, may be satisfied. Further, an adaptive resource allocation based on a requested capacity for control information may be enabled, and the efficient utilization of resources may also be enabled.Type: ApplicationFiled: January 8, 2024Publication date: May 2, 2024Applicant: Electronics and Telecommunications Research InstituteInventors: Bang-Won Seo, Young-Jo Ko, Tae-Gyun Noh, Jae-Young Ahn
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Publication number: 20240129211Abstract: An apparatus for predicting a traffic speed and a method thereof are provided. The apparatus includes an input device that receives traffic speed sequences of a plurality of links and a controller that detects a spatio-temporal relationship between traffic speeds of the plurality of links and predicts a future traffic speed of a target link based on the spatio-temporal relationship between the traffic speeds of the plurality of links.Type: ApplicationFiled: March 6, 2023Publication date: April 18, 2024Inventors: Nam Hyuk Kim, Tae Heon Kim, Sung Hwan Park, Sang Wook Kim, Jun Ho Song, Ji Won Son, Dong Hyuk Seo
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Publication number: 20240102727Abstract: A refrigerator may include a storage compartment, an inner door which comprises an opening having a size corresponding to a size of the storage compartment, a plurality of door guards, and an outer door which open and close the storage compartment, wherein the inner door comprises a control unit may control an internal environment of the storage compartment.Type: ApplicationFiled: December 6, 2023Publication date: March 28, 2024Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hyun Joo KIM, Yong Man SEO, In-Sung HWANG, Bok Hyun JANG, Tae Youl LEE, Jeong Won CHOI
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Publication number: 20240097860Abstract: Provided is a data transmission system using a carrier aggregation. The data transmission system may assign a radio resource based on a correspondence relationship between a downlink and an uplink, and may transmit data using the assigned radio resource.Type: ApplicationFiled: October 26, 2023Publication date: March 21, 2024Applicant: Electronics and Telecommunications Research InstituteInventors: Young Jo KO, Tae Gyun NOH, Kyoung Seok LEE, Bang Won SEO, Byung Jang JEONG, Heesoo LEE
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Publication number: 20170159167Abstract: The present invention relates to a thin film deposition apparatus, which includes: a deposition chamber supporting a substrate therein; a plurality of crucibles keeping a deposition material to be deposited on the substrate; a distribution conduit having a plurality of coupling holes axially arranged to communicate with the crucibles, and spraying the deposition material evaporated from the crucibles through a plurality of nozzles formed through a top thereof; distribution conduit heaters independently installed and facing an outer side of the distribution conduit to heat the distribution conduit; crucible heaters heating the crucibles to evaporate the deposition material; and a top plate having an exit port corresponding to the nozzles and disposed over the distribution conduit. Accordingly, it is possible to reduce the height of the chamber by decreasing the height of the crucibles and to perform symmetric or asymmetric deposition by independently performing left/right deposition on a substrate.Type: ApplicationFiled: July 10, 2014Publication date: June 8, 2017Applicant: SUNIC SYSTEM LTD.Inventors: Young Man Oh, Jae Soo Choi, Soon Chul Lee, Su Bin Kim, Myoung Soo Kim, Young Jong Lee, Ki Min Song, Young Shin Park, Tae Won Seo, Young Jin Bae, Jeong Taek Kim, Jung Gyun Lee
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Patent number: 9412924Abstract: A light emitting diode package having heat dissipating slugs is provided. The light emitting diode package comprises first and second heat dissipating slugs formed of a conductive material and spaced apart from each other; a package main body coupled to the first and second heat dissipating slugs to support the first and second heat dissipating slugs; and a light emitting diode die electrically connected to the first and second heat dissipating slugs, wherein the respective first and second heat dissipating slugs are exposed to the outside through lower and side surfaces of the package main body. As such, the first and second heat dissipating slugs can be used as external leads.Type: GrantFiled: March 26, 2014Date of Patent: August 9, 2016Assignee: Seoul Semiconductor Co., Ltd.Inventors: Tae Won Seo, Sang Cheol Lee, Chan Sung Jung
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Patent number: 9276182Abstract: A heat radiation structure of a light emitting element has leads, each lead having a plurality of leg sections, and a light emitting chip mounted on any one of the leads. The present invention can provide a high-efficiency light emitting element, in which a thermal load is reduced by widening a connecting section through which a lead and a chip seating section of the light emitting element are connected, and the heat generated from a heat source can be more rapidly radiated to the outside. Further, the present invention can also provide a high-efficiency light emitting element, in which heat radiation fins are formed between a stopper and a molding portion of a lead of the light emitting element so that natural convection can occur between the heat radiation fins, and an area in which heat radiation can occur is widened to maximize a heat radiation effect.Type: GrantFiled: April 30, 2014Date of Patent: March 1, 2016Assignee: Seoul Semiconductor Co., Ltd.Inventors: Tae Won Seo, Zhbanov Alexander, Dae Won Kim
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Publication number: 20160056359Abstract: A heat radiation structure of a light emitting element has leads, each lead having a plurality of leg sections, and a light emitting chip mounted on any one of the leads. The present invention can provide a high-efficiency light emitting element, in which a thermal load is reduced by widening a connecting section through which a lead and a chip seating section of the light emitting element are connected, and the heat generated from a heat source can be more rapidly radiated to the outside. Further, the present invention can also provide a high-efficiency light emitting element, in which heat radiation fins are formed between a stopper and a molding portion of a lead of the light emitting element so that natural convection can occur between the heat radiation fins, and an area in which heat radiation can occur is widened to maximize a heat radiation effect.Type: ApplicationFiled: April 30, 2014Publication date: February 25, 2016Applicant: Seoul Semiconductor Co., Ltd.Inventors: Tae Won SEO, Zhbanov Alexander, Dae Won Kim
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Patent number: 8860068Abstract: A light emitting diode package having heat dissipating slugs is provided. The light emitting diode package comprises first and second heat dissipating slugs formed of a conductive material and spaced apart from each other; a package main body coupled to the first and second heat dissipating slugs to support the first and second heat dissipating slugs; and a light emitting diode die electrically connected to the first and second heat dissipating slugs, wherein the respective first and second heat dissipating slugs are exposed to the outside through lower and side surfaces of the package main body. As such, the first and second heat dissipating slugs can be used as external leads.Type: GrantFiled: January 3, 2012Date of Patent: October 14, 2014Assignee: Seoul Semiconductor Co. Ltd.Inventors: Tae Won Seo, Sang Cheol Lee, Chan Sung Jung
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Publication number: 20140231860Abstract: A heat radiation structure of a light emitting element has leads, each lead having a plurality of leg sections, and a light emitting chip mounted on any one of the leads. The present invention can provide a high-efficiency light emitting element, in which a thermal load is reduced by widening a connecting section through which a lead and a chip seating section of the light emitting element are connected, and the heat generated from a heat source can be more rapidly radiated to the outside. Further, the present invention can also provide a high-efficiency light emitting element, in which heat radiation fins are formed between a stopper and a molding portion of a lead of the light emitting element so that natural convection can occur between the heat radiation fins, and an area in which heat radiation can occur is widened to maximize a heat radiation effect.Type: ApplicationFiled: April 30, 2014Publication date: August 21, 2014Applicant: Seoul Semiconductor Co., Ltd.Inventors: Tae Won SEO, Zhbanov Alexander, Dae Won Kim
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Patent number: 8791482Abstract: Disclosed is a light emitting device package. The light emitting device package includes a package body, a light emitting device installed in a cavity of the package body, an encapsulation layer to seal the light emitting device, and an electrode connected to the light emitting device. The package body includes a material having thermal conductivity lower than thermal conductivity of a material constituting the encapsulation layer.Type: GrantFiled: November 18, 2010Date of Patent: July 29, 2014Assignee: LG Innotek Co., Ltd.Inventor: Tae Won Seo
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Publication number: 20140203321Abstract: A light emitting diode package having heat dissipating slugs is provided. The light emitting diode package comprises first and second heat dissipating slugs formed of a conductive material and spaced apart from each other; a package main body coupled to the first and second heat dissipating slugs to support the first and second heat dissipating slugs; and a light emitting diode die electrically connected to the first and second heat dissipating slugs, wherein the respective first and second heat dissipating slugs are exposed to the outside through lower and side surfaces of the package main body. As such, the first and second heat dissipating slugs can be used as external leads.Type: ApplicationFiled: March 26, 2014Publication date: July 24, 2014Applicant: Seoul Semiconductor Co., Ltd.Inventors: Tae Won SEO, Sang Cheol LEE, Chan Sung JUNG
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Patent number: 8759869Abstract: A heat radiation structure of a light emitting element has leads, each lead having a plurality of leg sections, and a light emitting chip mounted on any one of the leads. The present invention can provide a high-efficiency light emitting element, in which a thermal load is reduced by widening a connecting section through which a lead and a chip seating section of the light emitting element are connected, and the heat generated from a heat source can be more rapidly radiated to the outside. Further, the present invention can also provide a high-efficiency light emitting element, in which heat radiation fins are formed between a stopper and a molding portion of a lead of the light emitting element so that natural convection can occur between the heat radiation fins, and an area in which heat radiation can occur is widened to maximize a heat radiation effect.Type: GrantFiled: December 11, 2012Date of Patent: June 24, 2014Assignee: Seoul Semiconductor Co., Ltd.Inventors: Tae Won Seo, Zhbanov Alexander, Dae Won Kim
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Patent number: 8350286Abstract: A heat radiation structure of a light emitting element has leads, each lead having a plurality of leg sections, and a light emitting chip mounted on any one of the leads. The present invention can provide a high-efficiency light emitting element, in which a thermal load is reduced by widening a connecting section through which a lead and a chip seating section of the light emitting element are connected, and the heat generated from a heat source can be more rapidly radiated to the outside. Further, the present invention can also provide a high-efficiency light emitting element, in which heat radiation fins are formed between a stopper and a molding portion of a lead of the light emitting element so that natural convection can occur between the heat radiation fins, and an area in which heat radiation can occur is widened to maximize a heat radiation effect.Type: GrantFiled: February 14, 2011Date of Patent: January 8, 2013Assignee: Seoul Semiconductor Co., Ltd.Inventors: Tae Won Seo, Zhbanov Alexander, Dae Won Kim
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Patent number: 8350287Abstract: A heat radiation structure of a light emitting element has leads, each lead having a plurality of leg sections, and a light emitting chip mounted on any one of the leads. The present invention can provide a high-efficiency light emitting element, in which a thermal load is reduced by widening a connecting section through which a lead and a chip seating section of the light emitting element are connected, and the heat generated from a heat source can be more rapidly radiated to the outside. Further, the present invention can also provide a high-efficiency light emitting element, in which heat radiation fins are formed between a stopper and a molding portion of a lead of the light emitting element so that natural convection can occur between the heat radiation fins, and an area in which heat radiation can occur is widened to maximize a heat radiation effect.Type: GrantFiled: July 20, 2011Date of Patent: January 8, 2013Assignee: Seoul Semiconductor Co., Ltd.Inventors: Tae Won Seo, Zhbanov Alexander, Dae Won Kim
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Publication number: 20120098019Abstract: A light emitting diode package having heat dissipating slugs is provided. The light emitting diode package comprises first and second heat dissipating slugs formed of a conductive material and spaced apart from each other; a package main body coupled to the first and second heat dissipating slugs to support the first and second heat dissipating slugs; and a light emitting diode die electrically connected to the first and second heat dissipating slugs, wherein the respective first and second heat dissipating slugs are exposed to the outside through lower and side surfaces of the package main body. As such, the first and second heat dissipating slugs can be used as external leads.Type: ApplicationFiled: January 3, 2012Publication date: April 26, 2012Applicant: SEOUL SEMICONDUCTOR CO., LTD.Inventors: Tae Won SEO, Sang Cheol LEE, Chan Sung JUNG
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Patent number: 8120054Abstract: A light emitting diode package having heat dissipating slugs is provided. The light emitting diode package comprises first and second heat dissipating slugs formed of a conductive material and spaced apart from each other; a package main body coupled to the first and second heat dissipating slugs to support the first and second heat dissipating slugs; and a light emitting diode die electrically connected to the first and second heat dissipating slugs, wherein the respective first and second heat dissipating slugs are exposed to the outside through lower and side surfaces of the package main body. As such, the first and second heat dissipating slugs can be used as external leads.Type: GrantFiled: September 4, 2008Date of Patent: February 21, 2012Assignee: Seoul Semiconductor Co., Ltd.Inventors: Tae Won Seo, Sang Cheol Lee, Chan Sung Jung
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Publication number: 20110278636Abstract: A heat radiation structure of a light emitting element has leads, each lead having a plurality of leg sections, and a light emitting chip mounted on any one of the leads. The present invention can provide a high-efficiency light emitting element, in which a thermal load is reduced by widening a connecting section through which a lead and a chip seating section of the light emitting element are connected, and the heat generated from a heat source can be more rapidly radiated to the outside. Further, the present invention can also provide a high-efficiency light emitting element, in which heat radiation fins are formed between a stopper and a molding portion of a lead of the light emitting element so that natural convection can occur between the heat radiation fins, and an area in which heat radiation can occur is widened to maximize a heat radiation effect.Type: ApplicationFiled: July 20, 2011Publication date: November 17, 2011Applicant: SEOUL SEMICONDUCTOR CO., LTD.Inventors: Tae Won SEO, Zhbanov ALEXANDER, Dae Won KIM