Abstract: Provided is an apparatus for treating a substrate, the apparatus including: an equipment front end module including a load port and a transfer frame; a process chamber for performing a process treatment on a substrate; and a load lock chamber disposed in a transfer path of the substrate transferred between the transfer frame and the process chamber, in which the load lock chamber includes: a housing having an interior space; a compartmentalizing plate for compartmentalizing the interior space into a first space, and a second space independent of the first space; and an aligning unit for aligning a notch of the substrate provided in any one of the first space and the second space.

Abstract: Disclosed are a backside illuminated image sensor and a method of manufacturing the same. More particularly, a backside illuminated image sensor and a method of manufacturing the backside illuminated image sensor include a light scattering portion in a substrate configured to converge a path of incident light to a photoelectric conversion structure, thereby preventing cross-talk between adjacent pixels and increasing light sensitivity.

Abstract: Disclosed are a backside illuminated image sensor and a method of manufacturing the same. More particularly, a backside illuminated image sensor and a method of manufacturing the backside illuminated image sensor include a plurality of sequential layers have different refractive indexes to extend a path of incident light passing through a lens, thereby increasing sensitivity.

Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a support unit configured to support a substrate; and a cleaning unit configured to clean a bottom surface of the substrate supported on the support unit, and wherein the cleaning unit comprises: a body; and a protrusion formed to be upwardly protruding from the body, and the protrusion is positioned to be spaced apart from the bottom surface.

Abstract: A substrate processing apparatus, which may suppress occurrence of temperature deviation caused by an air current, is provided. The substrate processing apparatus includes a chamber including an upper body and a lower body and having a processing space formed therein by the upper body and the lower body, a substrate support unit disposed in the processing space and having a support surface on which the substrate is supported, a heater disposed to heat gas in the processing space, an introduction unit configured to supply gas toward an edge of the support surface, and a discharge unit configured to discharge the gas in the processing space. The discharge unit may include a plurality of outlets spaced apart from a centerline of the support surface in the upper body and disposed to be closer to the centerline of the support surface than to the introduction unit.

Abstract: A substrate processing apparatus includes a substrate support unit, supporting a substrate, and an ultrasonic cleaning module disposed in a location lower than an upper surface of the substrate support unit. The ultrasonic cleaning module may include a receiving portion receiving a chemical, an opening portion in which at least a portion of an upper surface of the receiving portion is opened, and an ultrasonic vibration unit disposed to be directed toward the opening portion from the receiving portion, and may be configured in such a manner that a liquid surface of the chemical, rising by the ultrasonic vibration unit, touches the substrate through the opening portion.

Abstract: Disclosed are a buffer unit, in which a plurality of support plates is stacked in a vertical direction and a connection block is provided between the plurality of support plates to prevent vibration generated at the lower end of the support plate from being transmitted from the upper support plate, and a substrate treating apparatus. According to the present invention, it is possible to reduce the vibration generated in the buffer unit, so that there is an effect of improving the efficiency of the substrate treating process.

Abstract: Disclosed is a cutter apparatus for a double tube for cutting an outer tube in a double pipe including an inner tube and the outer tube, the cutter apparatus for the double tube including: a main body which is grippable by a hand of an operator; a cylindrical protection member which is connected to the main body and into which the inner tube is inserted; and a cutter member including a blade for cutting the outer tube.

Abstract: Provided is an apparatus for removing residual water in a hot water mat using a circulating pump, in which residual water that remains in a boiler and a mat of the hot water mat and a mat can be conveniently and rapidly removed, the configuration of the apparatus for removing residual water in the hot water mat can be simplified and the leakage at a connector of the boiler and the mat is prevented from occurring so that the risk of suffering a low-temperature burn can be eliminated during the removal of residual water.

Abstract: Provided is an apparatus for removing residual water in a hot water mat using a circulating pump, in which residual water that remains in a boiler and a mat of the hot water mat and a mat can be conveniently and rapidly removed, the configuration of the apparatus for removing residual water in the hot water mat can be simplified and the leakage at a connector of the boiler and the mat is prevented from occurring so that the risk of suffering a low-temperature burn can be eliminated during the removal of residual water.