Patents by Inventor Tae-Youn LIM

Tae-Youn LIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11243247
    Abstract: A device for testing a semiconductor device includes a blade, a socket, and a test board. The blade includes one or more outer blade conductors disposed on one or more side surfaces of the blade. The socket includes one or more outer socket conductors disposed on one or more side surfaces of the socket. The one or more outer socket conductors are disposed at a location such that they are in contact with or are isolated from the one or more outer blade conductors depending on a position of the blade. The test board transfers a test signal to the one or more outer socket conductors.
    Type: Grant
    Filed: May 10, 2019
    Date of Patent: February 8, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Tae Youn Lim
  • Publication number: 20200132753
    Abstract: A device for testing a semiconductor device includes a blade, a socket, and a test board. The blade includes one or more outer blade conductors disposed on one or more side surfaces of the blade. The socket includes one or more outer socket conductors disposed on one or more side surfaces of the socket. The one or more outer socket conductors are disposed at a location such that they are in contact with or are isolated from the one or more outer blade conductors depending on a position of the blade. The test board transfers a test signal to the one or more outer socket conductors.
    Type: Application
    Filed: May 10, 2019
    Publication date: April 30, 2020
    Inventor: TAE YOUN LIM
  • Patent number: 9164127
    Abstract: Provided is a test contactor for testing a semiconductor device which includes a cylinder, a piston which is configured to reciprocate between a first position and a second position according to a change in pressure in the cylinder, and a pressing part which is configured to change its location according to the reciprocating motion of the piston. The pressing part is configured to be in contact with the semiconductor device when the piston is located at the first position, and the pressing part is configured not to be in contact with the semiconductor device when the piston is located at the second position.
    Type: Grant
    Filed: August 10, 2012
    Date of Patent: October 20, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Tae-Youn Lim
  • Publication number: 20130141129
    Abstract: Provided is a test contactor for testing a semiconductor device which includes a cylinder, a piston which is configured to reciprocate between a first position and a second position according to a change in pressure in the cylinder, and a pressing part which is configured to change its location according to the reciprocating motion of the piston. The pressing part is configured to be in contact with the semiconductor device when the piston is located at the first position, and the pressing part is configured not to be in contact with the semiconductor device when the piston is located at the second position.
    Type: Application
    Filed: August 10, 2012
    Publication date: June 6, 2013
    Inventor: Tae-Youn LIM