Patents by Inventor Tae Yun Lee

Tae Yun Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for manufacturing a semiconductor package
    Patent number: 8911229
    Abstract: An apparatus for manufacturing a semiconductor package includes at least a first mold, a rotator, and a driver. The first mold has a first mold section, a second mold section, and at least one cavity formed when the first mold section and the second mold are brought together. The rotator is coupled to the first mold, and the driver is between the first mold and a rotating axis of the rotator. The driver supplies a molding resin into the cavity based on centrifugal force generated when the rotator rotates on the rotating axis.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: December 16, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tae Yun Lee, Seong Wook Cheong, Byeong Kap Choi, Sang Jin Choi
  • APPARATUS FOR MANUFACTURING A SEMICONDUCTOR PACKAGE
    Publication number: 20130230618
    Abstract: An apparatus for manufacturing a semiconductor package includes at least a first mold, a rotator, and a driver. The first mold has a first mold section, a second mold section, and at least one cavity formed when the first mold section and the second mold are brought together. The rotator is coupled to the first mold, and the driver is between the first mold and a rotating axis of the rotator. The driver supplies a molding resin into the cavity based on centrifugal force generated when the rotator rotates on the rotating axis.
    Type: Application
    Filed: February 28, 2013
    Publication date: September 5, 2013
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Tae Yun LEE, Seong Wook CHEONG, Byeong Kap CHOI, Sang Jin CHOI
  • Patterning apparatus and method using dip-pen nanolithography
    Publication number: 20100119710
    Abstract: An apparatus and a method according to example embodiments is capable of patterning ink on a substrate by using dip-pen nanolithography regardless of the interaction between the ink and the substrate. The patterning apparatus may includes a heat supply control device. The heat supply control device may supply heat so as to liquefy the ink and facilitate the patterning of the ink on the substrate. The melting point of the ink may be set within the predetermined temperature controlled by the heat supply control device.
    Type: Application
    Filed: September 28, 2009
    Publication date: May 13, 2010
    Inventors: Seung Hun Hong, Tae Yun Lee, Jong Han Oh, Moon Gyu Sung, Dong Min Kim