Patents by Inventor Taek K. Kim

Taek K. Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11769600
    Abstract: A heat transfer module can include an envelope sealed to define an internal volume that contains a working fluid and a wick disposed on an internal surface of the envelope. The wick and envelope each has a first portion extending through an evaporator region and a second portion extending through adiabatic and condenser regions. The first portion of the wick is a metal hydride. The first portion of the envelope includes a metal liner surrounding the first portion of the wick, a first diffusion barrier layer disposed between the first portion of the wick and the metal liner, and a ceramic matrix composite cladding surrounding the metal liner. The second portions of the wick and envelope each includes a refractory metal and/or stainless steel.
    Type: Grant
    Filed: September 3, 2020
    Date of Patent: September 26, 2023
    Assignee: UCHICAGO ARGONNE, LLC
    Inventors: Nicolas E. Stauff, Yinbin Miao, Abdellatif M. Yacout, Taek K. Kim
  • Patent number: 11443858
    Abstract: Provided herein is a neutron moderation module and a thermal-neutron nuclear micro-reactor.
    Type: Grant
    Filed: July 10, 2020
    Date of Patent: September 13, 2022
    Assignee: UCHICAGO ARGONNE, LLC
    Inventors: Yinbin Miao, Nicolas E. Stauff, Sumit Bhattacharya, Abdellatif M. Yacout, Taek K. Kim
  • Patent number: 11378230
    Abstract: A gas enclosure can include a refractory metal liner; a ceramic matrix composite cladding; and a diffusion barrier layer. The refractory metal liner is adapted to surround and enclose a gas to be contained within the gas enclosure. The diffusion barrier layer is disposed between the refractory metal liner and the ceramic matrix composite cladding.
    Type: Grant
    Filed: July 10, 2020
    Date of Patent: July 5, 2022
    Assignee: UCHICAGO ARGONNE, LLC
    Inventors: Yinbin Miao, Nicolas E. Stauff, Sumit Bhattacharya, Abdellatif M. Yacout, Taek K. Kim
  • Publication number: 20220068513
    Abstract: A heat transfer module can include an envelope sealed to define an internal volume that contains a working fluid and a wick disposed on an internal surface of the envelope. The wick and envelope each has a first portion extending through an evaporator region and a second portion extending through adiabatic and condenser regions. The first portion of the wick is a metal hydride. The first portion of the envelope includes a metal liner surrounding the first portion of the wick, a first diffusion barrier layer disposed between the first portion of the wick and the metal liner, and a ceramic matrix composite cladding surrounding the metal liner. The second portions of the wick and envelope each includes a refractory metal and/or stainless steel.
    Type: Application
    Filed: September 3, 2020
    Publication date: March 3, 2022
    Inventors: Nicolas E. Stauff, Yinbin Miao, Abdellatif M. Yacout, Taek K. Kim
  • Publication number: 20220013243
    Abstract: Provided herein is a moderation module and a thermal neutron micro-reactor.
    Type: Application
    Filed: July 10, 2020
    Publication date: January 13, 2022
    Inventors: Yinbin Miao, Nicolas E. Stauff, Sumit Bhattacharya, Abdellatif M. Yacout, Taek K. Kim
  • Publication number: 20220010929
    Abstract: A gas enclosure of can include a refractory metal liner adapted to surround and enclose a gas to be contained; a ceramic matrix composite cladding; and a diffusion barrier layer disposed between the refractory metal liner and the ceramic matrix composite cladding.
    Type: Application
    Filed: July 10, 2020
    Publication date: January 13, 2022
    Inventors: Yinbin Miao, Nicolas E. Stauff, Sumit Bhattacharya, Abdellatif M. Yacout, Taek K. Kim
  • Patent number: 7101736
    Abstract: A method of assembling a semiconductor component includes providing a pedestal, placing a first piece on the curved pedestal, wherein the first piece comprises a semiconductor die, placing a second piece over the first piece, and providing an adhesive between the first piece and the second piece. The method further includes applying pressure with a first plate to the first piece and second piece to snap the first piece with the second piece, and applying heat with a second plate to reflow the adhesive, wherein applying heat is performed simultaneously with applying pressure.
    Type: Grant
    Filed: July 15, 2004
    Date of Patent: September 5, 2006
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Audel A. Sanchez, Taek K. Kim