Patents by Inventor Taek Kyu Kim

Taek Kyu Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11984429
    Abstract: Leadless power amplifier (PA) packages having topside termination interposer (TTI) arrangements, and associated fabrication methods, are disclosed. Embodiments of the leadless PA package include a base flange, a first set of interposer mount pads, a first RF power die, a package body. The first RF power die is attached to a die mount surface of the base flange and electrically interconnected with the first set of interposer mount pads. The TTI arrangement is electrically coupled to the first set of interposer mount pads and projects therefrom in the package height direction. The package body encloses the first RF power die and having a package topside surface opposite the lower flange surface. Topside input/output terminals of the PA package are accessible from the package topside surface and are electrically interconnected with the first RF power die through the TTI arrangement and the first set of interposer mount pads.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: May 14, 2024
    Assignee: NXP USA, Inc.
    Inventors: Yun Wei, Scott Duncan Marshall, Lakshminarayan Viswanathan, Taek Kyu Kim, Ricardo Uscola, Fernando A. Santos
  • Publication number: 20230115340
    Abstract: Leadless power amplifier (PA) packages having topside termination interposer (TTI) arrangements, and associated fabrication methods, are disclosed. Embodiments of the leadless PA package include a base flange, a first set of interposer mount pads, a first RF power die, a package body. The first RF power die is attached to a die mount surface of the base flange and electrically interconnected with the first set of interposer mount pads. The TTI arrangement is electrically coupled to the first set of interposer mount pads and projects therefrom in the package height direction. The package body encloses the first RF power die and having a package topside surface opposite the lower flange surface. Topside input/output terminals of the PA package are accessible from the package topside surface and are electrically interconnected with the first RF power die through the TTI arrangement and the first set of interposer mount pads.
    Type: Application
    Filed: September 30, 2021
    Publication date: April 13, 2023
    Inventors: Yun Wei, Scott Duncan Marshall, Lakshminarayan Viswanathan, Taek Kyu Kim, Ricardo Uscola, Fernando A. Santos
  • Patent number: 9285528
    Abstract: Disclosed herein is an edge-type lighting device which is configured such that when a light guide plate thermally expands, a light source is prevented from being pressed. In the lighting device according to the present invention, a light guide plate (2) is slidably supported so that the light guide plate (2) can expand in the planar direction, and a light source (3) disposed on an edge of the light guide plate (2) is movably supported in the same direction. A light-guide-plate stopper (4b) is disposed at a position facing an edge (2A) of the light guide plate (2) to prevent the light guide plate (2) from expanding excessively. Thus, the light source (3) can be prevented from being pressed toward a frame member (4).
    Type: Grant
    Filed: February 28, 2012
    Date of Patent: March 15, 2016
    Assignees: NextEye Co., Ltd., Kowa Company, Ltd.
    Inventors: Seog Joon Kim, Mee Suk Rho, Taek Kyu Kim, Kazuhiro Kashiwagi, Isao Koike, Kunitoshi Shimizu, Akira Ikemoto
  • Patent number: 8858054
    Abstract: The present invention relates to an edge-type lighting device using an LED light source which has high light-emitting efficiency regardless of thermal expansion of a light guide plate. An LED light source (3) is disposed on an edge of a light guide plate (2) so as to be movable in the normal line direction (±n) of the edge (2c) of the light guide plate. A slide member (7) is slidably disposed on the rear surface of the LED light source. A spring (8) is disposed in a frame member (4) on the rear surface of the slide member. Thus, the LED light source can always be pressed toward the edge of the light guide plate regardless of the thermal expansion of the light guide plate. Because the spring has a simple structure, the lighting device can be compact compared to the case where a coil spring is used.
    Type: Grant
    Filed: February 28, 2012
    Date of Patent: October 14, 2014
    Assignees: Techsign Light Panel Co., Ltd., Kowa Company, Ltd.
    Inventors: Seog Joon Kim, Mee Suk Rho, Taek Kyu Kim, Kazuhiro Kashiwagi, Isao Koike, Kunitoshi Shimizu, Akira Ikemoto
  • Publication number: 20140022821
    Abstract: Disclosed herein is an edge-type lighting device which is configured such that when a light guide plate thermally expands, a light source is prevented from being pressed. In the lighting device according to the present invention, a light guide plate (2) is slidably supported so that the light guide plate (2) can expand in the planar direction, and a light source (3) disposed on an edge of the light guide plate (2) is movably supported in the same direction. A light-guide-plate stopper (4b) is disposed at a position facing an edge (2A) of the light guide plate (2) to prevent the light guide plate (2) from expanding excessively. Thus, the light source (3) can be prevented from being pressed toward a frame member (4).
    Type: Application
    Filed: February 28, 2012
    Publication date: January 23, 2014
    Applicants: KOWA COMPANY, LTD., TECHSIGN LIGHT PANEL CO., LTD.
    Inventors: Seog Joon Kim, Mee Suk Rho, Taek Kyu Kim, Kazuhiro Kashiwagi, Isao Koike, Kunitoshi Shimizu, Akira Ikemoto
  • Publication number: 20130336008
    Abstract: The present invention relates to an edge-type lighting device using an LED light source which has high light-emitting efficiency regardless of thermal expansion of a light guide plate. An LED light source (3) is disposed on an edge of a light guide plate (2) so as to be movable in the normal line direction (±n) of the edge (2c) of the light guide plate. A slide member (7) is slidably disposed on the rear surface of the LED light source. A spring (8) is disposed in a frame member (4) on the rear surface of the slide member. Thus, the LED light source can always be pressed toward the edge of the light guide plate regardless of the thermal expansion of the light guide plate. Because the spring has a simple structure, the lighting device can be compact compared to the case where a coil spring is used.
    Type: Application
    Filed: February 28, 2012
    Publication date: December 19, 2013
    Applicants: KOWA COMPANY, LTD., TECHSIGN LIGHT PANEL CO., LTD.
    Inventors: Seog Joon Kim, Mee Suk Rho, Taek Kyu Kim, Kazuhiro Kashiwago, Isao Koike, Kunitoshi Shimizu, Akira Ikemoto