Abstract: Provided is a spin head for supporting and rotating a substrate. The spin head includes a body, chuck pins disposed at the body and movable between supporting positions and rest positions, and a chuck pin moving unit configured to move the chuck pins straight. The chuck pins supports a substrate at the supporting positions and provides a substrate loading/unloading space at the rest position. The chuck pin moving unit includes movable rods fixed to the chuck pins, a rotatable cam including protrusions on an outer surface thereof so as to move the chuck pins from the supporting positions to the rest positions, and chuck pin return units respectively applying forces to the movable rods so as to move the chuck pins individually from the rest positions to the supporting positions. The chuck pin moving unit further includes contact maintaining members.

Abstract: A substrate support unit supplies a swirl flow to a substrate to rotate and float the substrate from a chuck plate during a process. A process is performed while rotating and floating the substrate. Thus, the substrate is supported and rotates at a process speed while floating form the chuck plate with a non-contact manner.

Abstract: The present invention is directed to a wafer transfer apparatus having cylinder-driving movable fingers. The wafer transfer apparatus a robot arm unit whose operation is controlled by driving means, a blade on which a wafer is placed, and a clamping member for locating the wafer placed on the blade in position while fixing the wafer. The blade is installed at the end of the robot arm unit, and-the clamping is installed at the blade.