Abstract: A display device includes a first substrate and a second substrate facing each other; and a filling layer disposed between the first substrate and the second substrate. The first substrate comprises a support substrate comprising a display area in which emission areas associated with sub-pixels, are arranged; a light-emitting element layer disposed on one surface of the support substrate; and an encapsulation layer disposed on the light-emitting element layer. The encapsulation layer comprises a first inorganic layer covering the light-emitting element layer; an organic layer disposed on the first inorganic layer and overlapping the light-emitting element layer; and a second inorganic layer disposed on the first inorganic layer and covering the organic layer. A thickness of the first inorganic layer is smaller than a thickness of the second inorganic layer.

Abstract: A display device includes a base layer including a first base layer and a second base layer disposed on a rear surface of the first base layer, light emitting elements disposed on a surface of the first base layer, and pads including a first pad and a second pad, which are disposed on the rear surface of the first base layer and are spaced apart from each other. The base layer further includes blocking layers which are disposed between the first base layer and the second base layer and at least portions of the blocking layers do not overlap the pads in a plan view. The blocking layers include a first blocking layer and a second blocking layer, which are disposed in different layers.

Abstract: A display device comprises a first substrate comprising a first contact hole, a laser absorption layer disposed on the first substrate and containing amorphous silicon, a first barrier insulating layer disposed on the laser absorption layer, fan-out lines disposed in a metal layer on the first barrier insulating layer and comprising pad portions inserted into second contact holes provided in the first barrier insulating layer and the laser absorption layer, a second barrier insulating layer disposed on the metal layer, a second substrate disposed on the second barrier insulating layer, and a display layer disposed on the second substrate. The second substrate is inserted into a third contact hole provided in the second barrier insulating layer, the first barrier insulating layer, and the laser absorption layer disposed between the pad portions.

Abstract: A display device includes a display panel including a display area and a non-display area surrounding the display area, and a metal wiring layer disposed on at least a portion of the non-display area, an encapsulation substrate disposed on the display panel, a sealing member which is disposed between the display panel and the encapsulation substrate and bonds the display panel to the encapsulation substrate and a first fusion region provided in at least a partial region between the sealing member and the encapsulation substrate, where the first fusion region has no physical boundary, and where at least a portion of the sealing member is disposed on the metal wiring layer in the non-display area, and the first fusion region is separated from the metal wiring layer while overlapping the metal wiring layer in a thickness direction.

Abstract: A display device includes a base layer including an upper base layer and a lower base layer on a rear surface of the upper base layer; at least one light emitting element on a surface of the upper base layer; and at least one pad on the rear surface of the upper base layer and including a first pad layer adjacent to the upper base layer and a second pad layer adjacent to the lower base layer. The second pad layer includes indium zinc oxide (IZO).

Abstract: A display device includes a display panel including a display area and a non-display area surrounding the display area, and a metal wiring layer disposed on at least a portion of the non-display area, an encapsulation substrate disposed on the display panel, a sealing member which is disposed between the display panel and the encapsulation substrate and bonds the display panel to the encapsulation substrate and a first fusion region provided in at least a partial region between the sealing member and the encapsulation substrate, where the first fusion region has no physical boundary, and where at least a portion of the sealing member is disposed on the metal wiring layer in the non-display area, and the first fusion region is separated from the metal wiring layer while overlapping the metal wiring layer in a thickness direction.

Abstract: A display device comprises a first substrate including a first contact hole, a first barrier insulating layer disposed on the first substrate and including a second contact hole, a fan-out line disposed in a first metal layer on the first barrier insulating layer, the fan-out line including a protruding part inserted in the second contact hole to protrude from below the first barrier insulating layer, and a recessed part formed by the second contact hole, an etching electrode disposed in the recessed part of the fan-out line, a second substrate disposed on the fan-out line and the etching electrode and including a third contact hole, a display layer disposed on the second substrate, and a flexible film disposed below the first substrate and inserted in the first contact hole to be electrically connected to the protruding part of the fan-out line.

Abstract: A display device comprises a first substrate including a first contact hole, a first barrier insulating layer disposed on the first substrate and including second contact holes overlapping the first contact hole, pad electrodes disposed on the first barrier insulating layer, at least a subset of the pad electrodes being disposed in the second contact holes, a display layer disposed on the pad electrodes, and a flexible film disposed below the first substrate and electrically connected to the pad electrodes through the first contact hole and the second contact holes, wherein the first substrate includes a substrate buffer portion overlapping the first contact hole and not-overlapping the second contact holes.

Abstract: A display device, a method of manufacturing the same and a tiled display device including the same are provided. The display device includes a first substrate including a first contact hole, a first barrier insulating layer disposed on the first substrate and including a second contact hole overlapping the first contact hole in a thickness direction, a capping layer disposed on the first barrier insulating layer, at least a portion of the capping layer being disposed in the second contact hole and the first contact hole, a pad electrode disposed on the capping layer, a display layer disposed on the pad electrode, and a flexible film disposed under the first substrate and electrically connected to the pad electrode through the first contact hole and the second contact hole.

Abstract: A display device includes a display panel including a display area and a non-display area surrounding the display area, an encapsulation substrate disposed on the display panel, a sealing member disposed between the display panel and the encapsulation substrate to bond the display panel and the encapsulation substrate together and a first fusion pattern disposed inside the display panel, the sealing member and the encapsulation substrate, where the display panel comprises a trench formed in the non-display area and recessed into a portion of an upper surface of the display panel, the sealing member is inserted into the trench, and the first fusion pattern is disposed to overlap the trench.

Abstract: A display device includes a display panel having a display area comprising pixels and a non-display area surrounding the display area, an encapsulation substrate which faces the display panel and is disposed on a surface of the display panel, and a sealing member disposed in the non-display area and interposed between the display panel and the encapsulation substrate for bonding. The display panel comprises a base substrate and a first conductive layer disposed on a first surface of the base substrate, the base substrate provides a through hole defined in a part of the non-display area to penetrate the base substrate in a thickness direction, the first conductive layer comprises a signal line disposed in a part of the non-display area and filling the through hole, and the sealing member does not overlap the first conductive layer and the through hole in the thickness direction.

Abstract: An image compression apparatus includes: an image acquisition unit configured to acquire a raw data image; a pre-processing network configured to receive the raw data image and pre-process the raw data image according to a pattern estimation method learned beforehand; and an encoder unit configured to receive the pre-processed image and compress the pre-processed image according to a pre-designated standard compression technique to output a compressed image. The pre-processing network, which can be added during learning and can be implemented as an artificial neural network, can have learned beforehand by way of a backpropagation of a restoration error through a codec modeling unit that has learned beforehand to simulate a standard codec unit, where the restoration error can be obtained by comparing a restored image obtained based on a simulated decoded image with the raw data image.

Abstract: A display device includes a display panel including a display area and non-display areas surrounding the display area; an encapsulation substrate disposed on the display panel and including melting patterns formed in regions overlapping the non-display areas; a sealing member disposed between the display panel and the encapsulation substrate to couple the display panel with the encapsulation substrate; and fusing patterns disposed across the sealing member and the encapsulation substrate. The display panel further includes a metal line layer disposed in at least a portion of the non-display areas, at least a portion of the sealing member is disposed on the metal line layer in the non-display areas, the melting patterns are disposed to overlap the metal line layer in a thickness direction, and the fusing patterns are disposed not to overlap the metal line layer in the thickness direction.

Abstract: An image compression apparatus includes: an image acquisition unit configured to acquire a raw data image; a pre-processing network configured to receive the raw data image and pre-process the raw data image according to a pattern estimation method learned beforehand; and an encoder unit configured to receive the pre-processed image and compress the pre-processed image according to a pre-designated standard compression technique to output a compressed image. The pre-processing network, which can be added during learning and can be implemented as an artificial neural network, can have learned beforehand by way of a backpropagation of a restoration error through a codec modeling unit that has learned beforehand to simulate a standard codec unit, where the restoration error can be obtained by comparing a restored image obtained based on a simulated decoded image with the raw data image.

Abstract: A display device includes: a first substrate; a second substrate facing the first substrate; a through hole penetrating the first substrate and the second substrate; and a hole fusion pattern to bond the first and second substrates to each other around the through hole.

Abstract: A display device includes a display panel having a display area where light emitting elements are disposed and a non-display area surrounding the display area, an encapsulation substrate disposed on the display panel at a distance from the display panel, a sealing member disposed in the non-display area between the display panel and the encapsulation substrate to bond the display panel and the encapsulation substrate together, support members disposed in the display area between the display panel and the encapsulation substrate, and a first fusion pattern, a portion of which is disposed in the support members and the encapsulation substrate. The display area includes a first area in which the support member and the first fusion pattern are disposed and a second area in which no support member is disposed, and each of the light emitting elements is disposed in at least a portion of the second area.

Abstract: A display device includes a display panel including a display area and a non-display area surrounding the display area, an encapsulation substrate disposed on the display panel, a sealing member disposed between the display panel and the encapsulation substrate to bond the display panel and the encapsulation substrate together and a first fusion pattern disposed inside the display panel, the sealing member and the encapsulation substrate, where the display panel comprises a trench formed in the non-display area and recessed into a portion of an upper surface of the display panel, the sealing member is inserted into the trench, and the first fusion pattern is disposed to overlap the trench.

Abstract: A display device includes a display panel including a display area and non-display areas surrounding the display area; an encapsulation substrate disposed on the display panel and including melting patterns formed in regions overlapping the non-display areas; a sealing member disposed between the display panel and the encapsulation substrate to couple the display panel with the encapsulation substrate; and fusing patterns disposed across the sealing member and the encapsulation substrate. The display panel further includes a metal line layer disposed in at least a portion of the non-display areas, at least a portion of the sealing member is disposed on the metal line layer in the non-display areas, the melting patterns are disposed to overlap the metal line layer in a thickness direction, and the fusing patterns are disposed not to overlap the metal line layer in the thickness direction.

Abstract: A display device includes a display panel having a display area comprising pixels and a non-display area surrounding the display area, an encapsulation substrate which faces the display panel and is disposed on a surface of the display panel, and a sealing member disposed in the non-display area and interposed between the display panel and the encapsulation substrate for bonding. The display panel comprises a base substrate and a first conductive layer disposed on a first surface of the base substrate, the base substrate provides a through hole defined in a part of the non-display area to penetrate the base substrate in a thickness direction, the first conductive layer comprises a signal line disposed in a part of the non-display area and filling the through hole, and the sealing member does not overlap the first conductive layer and the through hole in the thickness direction.

Abstract: A display device includes a display panel including a display area and a non-display area surrounding the display area, and a metal wiring layer disposed on at least a portion of the non-display area, an encapsulation substrate disposed on the display panel, a sealing member which is disposed between the display panel and the encapsulation substrate and bonds the display panel to the encapsulation substrate and a first fusion region provided in at least a partial region between the sealing member and the encapsulation substrate, where the first fusion region has no physical boundary, and where at least a portion of the sealing member is disposed on the metal wiring layer in the non-display area, and the first fusion region is separated from the metal wiring layer while overlapping the metal wiring layer in a thickness direction.