Patents by Inventor Taewon SUN

Taewon SUN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11943862
    Abstract: An electronic device is provided. The electronic device includes a board including a first conductive line, a second conductive line, a ground plane, and a conductive via hole connecting the first conductive line and the ground plane, at least one electronic component disposed in the board, an insulation member covering the at least one electronic component, and a conductive layer, the conductive layer includes a first part formed on a surface of the insulation member, a second part extending from an edge of the first part and electrically connected to the first conductive line, and a third part spaced apart from the second part and electrically connected to the second conductive line, and the electronic device includes at least one transmission line constituted by the second conductive line and the third part of the conductive layer.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: March 26, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Bongchoon Park, Taewon Sun, Sangyong Kim, Bosung Choi
  • Patent number: 11832389
    Abstract: An electronic device according to various embodiments may include: a display, a first circuit board disposed under the display, a first component and a second component disposed on one surface of the first circuit board, the first and second components each having different heights, a first interposer surrounding at least one side surface of the first component and disposed in a first region of the first circuit board, the first interposer part having a first height, a second interposer part surrounding at least one side surface of the second component and disposed in a second region of the first circuit board, the second interposer part having a second height different from the first height, a first second circuit board, at least a portion of which is spaced apart from the first region of the first circuit board, the first second circuit board including a first first portion bonded to the first interposer part, and a second second circuit board, at least a portion of which is spaced apart from the second reg
    Type: Grant
    Filed: August 13, 2021
    Date of Patent: November 28, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Taewon Sun, Jichul Kim, Kicheol Bae, Jinyong Park, Jungje Bang, Yongjae Song
  • Publication number: 20230035240
    Abstract: An electronic device is provided. The electronic device includes a board including a first conductive line, a second conductive line, a ground plane, and a conductive via hole connecting the first conductive line and the ground plane, at least one electronic component disposed in the board, an insulation member covering the at least one electronic component, and a conductive layer, the conductive layer includes a first part formed on a surface of the insulation member, a second part extending from an edge of the first part and electrically connected to the first conductive line, and a third part spaced apart from the second part and electrically connected to the second conductive line, and the electronic device includes at least one transmission line constituted by the second conductive line and the third part of the conductive layer.
    Type: Application
    Filed: May 26, 2022
    Publication date: February 2, 2023
    Inventors: Bongchoon PARK, Taewon SUN, Sangyong KIM, Bosung CHOI
  • Publication number: 20220361334
    Abstract: An electronic device according to various embodiments may include: a display, a first circuit board disposed under the display, a first component and a second component disposed on one surface of the first circuit board, the first and second components each having different heights, a first interposer surrounding at least one side surface of the first component and disposed in a first region of the first circuit board, the first interposer part having a first height, a second interposer part surrounding at least one side surface of the second component and disposed in a second region of the first circuit board, the second interposer part having a second height different from the first height, a first second circuit board, at least a portion of which is spaced apart from the first region of the first circuit board, the first second circuit board including a first first portion bonded to the first interposer part, and a second second circuit board, at least a portion of which is spaced apart from the second reg
    Type: Application
    Filed: August 13, 2021
    Publication date: November 10, 2022
    Inventors: Taewon SUN, Jichul KIM, Kicheol BAE, Jinyong PARK, Jungje BANG, Yongjae SONG