Abstract: An apparatus and a method for etching a plurality of glass panels are disclosed. The apparatus is constructed by mounting a panel holder in an etch tank equipped with a rotating means for rotating the panel holder during the etching process. The panel holder is adapted for receiving a plurality of glass panels and mounting the panels in a vertical position with at least two edges of the panels mounted in a plurality of tracks for protecting conductive elements formed on the edges of the panels and also for holding the panels securely during the rotation of the panel holder. The method for etching the panels can be carried about at a rotational speed between about 5 rpm and about 60 rpm in an etchant solution of a diluted acid such as HF having a concentration of at least 5 vol. %. A suitable immersing time for the plurality of glass panels in the diluted etchant for producing panels of smaller thicknesses is at least 3 min.