Abstract: A capacitive biosensor is provided. The capacitive biosensor includes: a transistor, an interconnect structure on the transistor, and a passivation layer on the interconnect structure. The interconnect structure includes a first metal structure on the transistor, a second metal structure on the first metal structure, and a third metal structure on the second metal structure. The third metal structure includes a first conductive layer, a second conductive layer, and a third conductive layer that are sequentially stacked. The passivation has an opening exposing a portion of the third metal structure. The capacitive biosensor further includes a sensing region on the interconnect structure. The sensing region includes a first sensing electrode and a second sensing electrode. The first sensing electrode is formed of the third conductive layer, and the second sensing electrode is disposed on the passivation layer.

Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.

Abstract: In some examples, an electronic device includes a tip pressure sensor to capture tip pressure data based on a writing surface. In some examples, the electronic device includes a processor to produce a classification of the writing surface based on the tip pressure data via a machine learning model. In some examples, the electronic device may include a haptic device to control haptic feedback based on the classification.

Abstract: Examples of an input device holder assembly are described herein. In one example, the input device holder assembly can include a first holding element and a second holding element to cooperate with the first holding element to hold a writing instrument. The first holding element includes a first receptacle channel and the second holding element includes a second receptacle channel. Both, the first and the second receptacle channels are formed as open-ended slots. The first holding element and the second holding element are positioned relative to each other to align the first receptacle channel and the second receptacle channel to receive and remove the writing instrument.

Abstract: In some examples, an electronic device includes a tip pressure sensor to capture tip pressure data based on a writing surface. In some examples, the electronic device includes a processor to produce a classification of the writing surface based on the tip pressure data via a machine learning model. In some examples, the electronic device may include a haptic device to control haptic feedback based on the classification.

Abstract: In one example, an input pen may include an electronic component, a communication interface to establish a short-range wireless connection with an electronic device, and a controller communicatively coupled to the electronic component and the communication interface. The controller may receive a command from the electronic device via the communication interface. The command may uniquely correspond to an operating mode of the electronic device. Further, the controller may control a power state of the electronic component based on the command.

Abstract: An example stylus pen may include a main body including a first battery and a writing tip attached to the main body. Further, the stylus pen may include a cap removably disposed on the main body to cover the writing tip. The cap may include a second battery. Furthermore, the stylus pen may include a controller to charge the first battery from the second battery.

Abstract: In one example, an electronic device may include a touch panel defining an input surface having an input region and a display panel disposed below the touch panel. The display panel may visualize a virtual keyboard including a set of virtual keys. Further, the electronic device may include a haptic array module disposed below the display panel. The haptic array module may include a first actuator disposed below the input region corresponding to a first virtual key of the set of virtual keys. Further, the electronic device may include a controller in communication with the haptic array module to trigger the first actuator to generate a haptic output at the input region in response to an activation of the virtual keyboard.

Abstract: Techniques for proving haptic feedback in computing systems are described. In operation, an input representing utilisation parameters of an electronic pen is received. In an example, the electronic pen may be electronically coupled to the computing system. Based on the received utilisation parameters, the computing system provides a pattern of haptic feedback to the user.

Abstract: In one example, an input pen may include an electronic component, a communication interface to establish a short-range wireless connection with an electronic device, and a controller communicatively coupled to the electronic component and the communication interface. The controller may receive a command from the electronic device via the communication interface. The command may uniquely correspond to an operating mode of the electronic device. Further, the controller may control a power state of the electronic component based on the command.

Abstract: A light-emitting diode apparatus includes a light-emitting diode, a first package layer provided over the light-emitting diode, and a second package layer provided over the first package layer. The first package layer is dosed with phosphor. The second package layer is not dosed with any phosphor. The second package layer is formed with a textured light-emitting surface.