Patents by Inventor Tai-Hsiang Lai
Tai-Hsiang Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20200066709Abstract: A semiconductor device includes a P-type substrate, a first isolation region, a plurality of first N-well walls, and an electrostatic discharge (ESD) clamp circuit. The first isolation region is formed within the P-type substrate. The ESD clamp circuit is arranged to discharge ESD current upon detection of an ESD event, and includes a clamping component that is arranged to provide a discharge path for the ESD current. The clamping component is formed on a region wrapped in the first isolation layer and the first N-well walls.Type: ApplicationFiled: August 2, 2019Publication date: February 27, 2020Inventors: Shih-Fan Chen, Kuo-Chun Hsu, Tai-Hsiang Lai
-
Patent number: 9735144Abstract: An electrostatic discharge (ESD) protection device includes a semiconductor layer having a first doped region, a second doped region, and an intrinsic region formed therein, and a plurality of insulating elements respectively formed therein. The plurality of insulating elements is respectively formed in a portion of the semiconductor layer between the first, second and third doped regions. The intrinsic region is formed at least in the semiconductor layer between one of the second and third regions and the other one of the second and third regions or between one of the second and third regions and the first region. The first doped region is formed with a first conductivity type, and the second and third doped regions are formed with a second conductivity type opposite to the first conductivity type.Type: GrantFiled: February 3, 2016Date of Patent: August 15, 2017Assignee: MEDIATEK INC.Inventors: Shih-Fan Chen, Tai-Hsiang Lai
-
Publication number: 20160240524Abstract: An electrostatic discharge (ESD) protection device includes a semiconductor layer having a first doped region, a second doped region, and an intrinsic region formed therein, and a plurality of insulating elements respectively formed therein. The plurality of insulating elements is respectively formed in a portion of the semiconductor layer between the first, second and third doped regions. The intrinsic region is formed at least in the semiconductor layer between one of the second and third regions and the other one of the second and third regions or between one of the second and third regions and the first region. The first doped region is formed with a first conductivity type, and the second and third doped regions are formed with a second conductivity type opposite to the first conductivity type.Type: ApplicationFiled: February 3, 2016Publication date: August 18, 2016Inventors: Shih-Fan CHEN, Tai-Hsiang LAI
-
Patent number: 8723263Abstract: An electrostatic discharge (ESD) includes a semiconductor substrate having the first conductive type, a well having the first conductive type, a buried layer having the second conductive type and a well having the second conductive type. The buried layer having a second conductive type is disposed in the semiconductor substrate under the well having the first conductive type. The well having the second conductive type disposed to divide the well having the first conductive type into a first well and a second well. The well having the second conductive type contacts the buried layer, and the well having the second conductive type and the buried layer are jointly used to isolate the first well from the second well.Type: GrantFiled: July 24, 2012Date of Patent: May 13, 2014Assignee: United Microelectronics Corp.Inventors: Mei-Ling Chao, Yi-Chun Chen, Lu-An Chen, Tai-Hsiang Lai, Tien-Hao Tang
-
Patent number: 8716801Abstract: Provided is a metal oxide semiconductor device, including a substrate, a gate, a first-type first heavily doped region, a first-type drift region, a second-type first heavily doped region, a contact, a first electrode, and a second electrode. The gate is disposed on the substrate. The first-type first heavily doped region is disposed in the substrate at a side of the gate. The first-type drift region is disposed in the substrate at another side of the gate. The second-type first heavily doped region is disposed in the first-type drift region. The contact is electrically connected to the second-type first heavily doped region. The contact is the closest contact to the gate on the first-type drift region. The first electrode is electrically connected to the contact, and the second electrode is electrically connected to the first-type first heavily doped region and the gate.Type: GrantFiled: January 18, 2012Date of Patent: May 6, 2014Assignee: United Microelectronics Corp.Inventors: Lu-An Chen, Chang-Tzu Wang, Tai-Hsiang Lai, Tien-Hao Tang
-
Publication number: 20140027856Abstract: An electrostatic discharge (ESD) includes a semiconductor substrate having the first conductive type, a well having the first conductive type, a buried layer having the second conductive type and a well having the second conductive type. The buried layer having a second conductive type is disposed in the semiconductor substrate under the well having the first conductive type. The well having the second conductive type disposed to divide the well having the first conductive type into a first well and a second well. The well having the second conductive type contacts the buried layer, and the well having the second conductive type and the buried layer are jointly used to isolate the first well from the second well.Type: ApplicationFiled: July 24, 2012Publication date: January 30, 2014Inventors: Mei-Ling Chao, Yi-Chun Chen, Lu-An Chen, Tai-Hsiang Lai, Tien-Hao Tang
-
Patent number: 8530969Abstract: A semiconductor device includes a substrate, a gate structure, a source structure and a drain structure. The substrate includes a deep well region, and the gate structure is disposed on the deep well region. The source structure is formed within the deep well and located at a first side of the gate structure. The drain structure is formed within the deep well region and located at a second side of the gate structure. The drain structure includes a first doped region of a first conductivity type, a first electrode and a second doped region of a second conductivity type. The first doped region is located in the deep well region; the first electrode is electrically connected to the first doped region. The second doped region is disposed within the first doped region and between the first electrode and the gate structure.Type: GrantFiled: February 9, 2012Date of Patent: September 10, 2013Assignee: United Microelectronics CorporationInventors: Lu-An Chen, Tai-Hsiang Lai, Tien-Hao Tang
-
Publication number: 20130207184Abstract: A semiconductor device includes a substrate, a gate structure, a source structure and a drain structure. The substrate includes a deep well region, and the gate structure is disposed on the deep well region. The source structure is formed within the deep well and located at a first side of the gate structure. The drain structure is formed within the deep well region and located at a second side of the gate structure. The drain structure includes a first doped region of a first conductivity type, a first electrode and a second doped region of a second conductivity type. The first doped region is located in the deep well region; the first electrode is electrically connected to the first doped region. The second doped region is disposed within the first doped region and between the first electrode and the gate structure.Type: ApplicationFiled: February 9, 2012Publication date: August 15, 2013Applicant: UNITED MICROELECTRONICS CORPORATIONInventors: Lu-An CHEN, Tai-Hsiang LAI, Tien-Hao TANG
-
Patent number: 8507981Abstract: A method for forming an NMOS transistor includes forming a P-substrate; forming an N-well on the P-substrate; forming an N-drift region on the N-well; forming an n+ drain on the N-drift region; forming a plurality of first contacts on the n+ drain along a longitudinal direction; forming a P-body on the N-well; forming a source on the P-body, the source including a plurality of n+ doped regions and at least one p+ doped region arranged along the longitudinal direction; forming a plurality of second contacts on the plurality of n+ doped regions and the at least one p+ doped region; forming a polygate on the P-body; and forming a gate oxide between the polygate and the source.Type: GrantFiled: October 12, 2011Date of Patent: August 13, 2013Assignee: United Microelectronics Corp.Inventors: Lu-An Chen, Tai-Hsiang Lai, Tien-Hao Tang
-
Patent number: 8492834Abstract: An electrostatic discharge protection device comprises a substrate with a first conductivity, a gate, a drain structure and a source structure. The gate is disposed on a surface of the substrate. The drain structure with a second conductivity type comprises a first doping region with a first doping concentration disposed adjacent to the gate and extending into the substrate from the surface of the substrate, a second doping region extending into and stooped at the first doping region from the surface of the substrate and having a second doping concentration substantially greater than the first doping concentration, and a third doping region disposed in the substrate beneath the second doping region and having a third doping concentration substantially greater than the first doping concentration. The source structure with the second conductivity is disposed in the substrate and adjacent to the gate electrode.Type: GrantFiled: August 22, 2011Date of Patent: July 23, 2013Assignee: United Microelectronics Corp.Inventors: Tai-Hsiang Lai, Lu-An Chen, Tien-Hao Tang
-
Publication number: 20130181211Abstract: Provided is a metal oxide semiconductor device, including a substrate, a gate, a first-type first heavily doped region, a first-type drift region, a second-type first heavily doped region, a contact, a first electrode, and a second electrode. The gate is disposed on the substrate. The first-type first heavily doped region is disposed in the substrate at a side of the gate. The first-type drift region is disposed in the substrate at another side of the gate. The second-type first heavily doped region is disposed in the first-type drift region. The contact is electrically connected to the second-type first heavily doped region. The contact is the closest contact to the gate on the first-type drift region. The first electrode is electrically connected to the contact, and the second electrode is electrically connected to the first-type first heavily doped region and the gate.Type: ApplicationFiled: January 18, 2012Publication date: July 18, 2013Applicant: United Microelectronics Corp.Inventors: Lu-An Chen, Chang-Tzu Wang, Tai-Hsiang Lai, Tien-Hao Tang
-
Patent number: 8477467Abstract: An electrostatic discharge protection circuit is located between a first voltage terminal and a second voltage terminal. The electrostatic discharge protection circuit includes a first semiconductor switch and a second semiconductor switch. The first semiconductor switch is electrically connected to the first voltage terminal. If a voltage at the first voltage terminal complies with a starting condition, the first semiconductor switch is turned on, so that an electrostatic discharge current flows through the first voltage terminal and the first semiconductor switch. The second semiconductor switch is electrically connected between the first semiconductor switch and the second voltage terminal, wherein the electrostatic discharge current from the first semiconductor switch passes to the second voltage terminal through the second semiconductor switch.Type: GrantFiled: July 26, 2011Date of Patent: July 2, 2013Assignee: United Microelectronics Corp.Inventors: Lu-An Chen, Tai-Hsiang Lai, Tien-Hao Tang
-
Publication number: 20130093009Abstract: A method for forming an NMOS transistor includes forming a P-substrate; forming an N-well on the P-substrate; forming an N-drift region on the N-well; forming an n+ drain on the N-drift region; forming a plurality of first contacts on the n+ drain along a longitudinal direction; forming a P-body on the N-well; forming a source on the P-body, the source including a plurality of n+ doped regions and at least one p+ doped region arranged along the longitudinal direction; forming a plurality of second contacts on the plurality of n+ doped regions and the at least one p+ doped region; forming a polygate on the P-body; and forming a gate oxide between the polygate and the source.Type: ApplicationFiled: October 12, 2011Publication date: April 18, 2013Inventors: Lu-An Chen, Tai-Hsiang Lai, Tien-Hao Tang
-
Publication number: 20130049112Abstract: An electrostatic discharge protection device comprises a substrate with a first conductivity, a gate, a drain structure and a source structure. The gate is disposed on a surface of the substrate. The drain structure with a second conductivity type comprises a first doping region with a first doping concentration disposed adjacent to the gate and extending into the substrate from the surface of the substrate, a second doping region extending into and stooped at the first doping region from the surface of the substrate and having a second doping concentration substantially greater than the first doping concentration, and a third doping region disposed in the substrate beneath the second doping region and having a third doping concentration substantially greater than the first doping concentration. The source structure with the second conductivity is disposed in the substrate and adjacent to the gate electrode.Type: ApplicationFiled: August 22, 2011Publication date: February 28, 2013Applicant: UNITED MICROELECTRONICS CORP.Inventors: Tai-Hsiang LAI, Lu-An Chen, Tien-Hao Tang
-
Publication number: 20130027821Abstract: An electrostatic discharge protection circuit is located between a first voltage terminal and a second voltage terminal. The electrostatic discharge protection circuit includes a first semiconductor switch and a second semiconductor switch. The first semiconductor switch is electrically connected to the first voltage terminal. If a voltage at the first voltage terminal complies with a starting condition, the first semiconductor switch is turned on, so that an electrostatic discharge current flows through the first voltage terminal and the first semiconductor switch. The second semiconductor switch is electrically connected between the first semiconductor switch and the second voltage terminal, wherein the electrostatic discharge current from the first semiconductor switch passes to the second voltage terminal through the second semiconductor switch.Type: ApplicationFiled: July 26, 2011Publication date: January 31, 2013Applicant: UNITED MICROELECTRONICS CORP.Inventors: Lu-An CHEN, Tai-Hsiang LAI, Tien-Hao TANG
-
Patent number: 8299532Abstract: An ESD protection device structure includes a well having a first conductive type, a first doped region having a second conductive type disposed in the well, a second doped region having the first conductive type, and a third doped region having the second conductive type disposed in the well. The second doped region is disposed within the first doped region so as to form a vertical BJT, and the first doped region, the well and the third doped region forms a lateral BJT, so that pulse voltage that the ESD protection structure can tolerate can be raised.Type: GrantFiled: August 20, 2009Date of Patent: October 30, 2012Assignee: United Microelectronics Corp.Inventors: Tai-Hsiang Lai, Kuei-Chih Fan, Tien-Hao Tang
-
Publication number: 20110042716Abstract: An ESD protection device structure includes a well having a first conductive type, a first doped region having a second conductive type disposed in the well, a second doped region having the first conductive type, and a third doped region having the second conductive type disposed in the well. The second doped region is disposed within the first doped region so as to form a vertical BJT, and the first doped region, the well and the third doped region forms a lateral BJT, so that pulse voltage that the ESD protection structure can tolerate can be raised.Type: ApplicationFiled: August 20, 2009Publication date: February 24, 2011Inventors: Tai-Hsiang Lai, Kuei-Chih Fan, Tien-Hao Tang
-
Patent number: 7655980Abstract: A LDNMOS device for an ESD protection circuit including a P-type substrate and an N-type deep well region is provided. The P-type substrate includes a first area and a second area. The N-type deep well region is in the first and second areas of the P-type substrate. The LDNMOS device further includes a gate electrode disposed on the P-type substrate between the first and second areas, a P-type implanted region disposed in the first area of the P-type substrate, an N-type grade region disposed in the N-type deep well region of the first area, an N-type first doped region disposed in the N-type grade region, a P-type body region disposed in the N-type deep well region of the second area, an N-type second doped region disposed in the P-type body region, and a P-type doped region disposed in the P-type body region and adjacent to the N-type second doped region.Type: GrantFiled: July 23, 2008Date of Patent: February 2, 2010Assignee: United Microelectronics Corp.Inventors: Mei-Ling Chao, Chia-Yun Chen, Tai-Hsiang Lai, Tien-Hao Tang
-
Publication number: 20100019318Abstract: A LDNMOS device for an ESD protection circuit including a P-type substrate and an N-type deep well region is provided. The P-type substrate includes a first area and a second area. The N-type deep well region is in the first and second areas of the P-type substrate. The LDNMOS device further includes a gate electrode disposed on the P-type substrate between the first and second areas, a P-type implanted region disposed in the first area of the P-type substrate, an N-type grade region disposed in the N-type deep well region of the first area, an N-type first doped region disposed in the N-type grade region, a P-type body region disposed in the N-type deep well region of the second area, an N-type second doped region disposed in the P-type body region, and a P-type doped region disposed in the P-type body region and adjacent to the N-type second doped region.Type: ApplicationFiled: July 23, 2008Publication date: January 28, 2010Applicant: UNITED MICROELECTRONICS CORP.Inventors: Mei-Ling Chao, Chia-Yun Chen, Tai-Hsiang Lai, Tien-Hao Tang
-
Patent number: 7368761Abstract: An electrostatic discharge (ESD) protection device and a fabrication method thereof are provided. The ESD protection device with an embedded high-voltage P type SCR (EHVPSCR) structure of the present invention is employed to guide the ESD current/voltage to a system voltage trace VDD via a pad.Type: GrantFiled: March 8, 2007Date of Patent: May 6, 2008Assignee: United Microelectronics Corp.Inventors: Tai-Hsiang Lai, Wei-Jen Chang, Ming-Dou Ker, Tien-Hao Tang