Patents by Inventor Tai-Jo Jeon

Tai-Jo Jeon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor wafer stocker apparatus and wafer transferring methods using the same
    Patent number: 9543178
    Abstract: A semiconductor wafer stocker apparatus includes a body frame, an inlet port to load a wafer shipping box into the body frame, an outlet port to unload the wafer shipping box from the body frame, an automated transfer robot operable to convey the wafer shipping box between the inlet port and the outlet port, and a shelf module within the body frame. The shelf module includes a shelf plate configured to support the wafer shipping box. The shelf plate includes first, second, and third protruding support pins arranged to align with respective grooves in an underside of the wafer shipping box and orient the wafer shipping box with a door thereof facing away from the body frame. The first and second support pins may be closer to the body frame than the third support pin. Related apparatus and methods of operation are also discussed.
    Type: Grant
    Filed: January 22, 2015
    Date of Patent: January 10, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyun-Woo Lee, Chang-Woo Son, Yong-Jun Ahn, Tai-Jo Jeon
  • SEMICONDUCTOR WAFER STOCKER APPARATUS AND WAFER TRANSFERRING METHODS USING THE SAME
    Publication number: 20160035607
    Abstract: A semiconductor wafer stocker apparatus includes a body frame, an inlet port to load a wafer shipping box into the body frame, an outlet port to unload the wafer shipping box from the body frame, an automated transfer robot operable to convey the wafer shipping box between the inlet port and the outlet port, and a shelf module within the body frame. The shelf module includes a shelf plate configured to support the wafer shipping box. The shelf plate includes first, second, and third protruding support pins arranged to align with respective grooves in an underside of the wafer shipping box and orient the wafer shipping box with a door thereof facing away from the body frame. The first and second support pins may be closer to the body frame than the third support pin. Related apparatus and methods of operation are also discussed.
    Type: Application
    Filed: January 22, 2015
    Publication date: February 4, 2016
    Inventors: Hyun-Woo Lee, Chang-Woo Son, Yong-Jun Ahn, Tai-Jo Jeon