Abstract: A new ultrasonic aided laser joining method (UAL) for bonding dissimilar materials has been developed. The method is capable of eliminating the laser-induced bubbles at the bonding faces and to improve the joint strength over that of the conventional laser-assisted metal and plastic joining method (LAMP). Some experiments on joining titanium to polyethylene terephthalate have been conducted to show the superiority of UAL over LAMP. The results showed that the joint strength, measured in terms of failure load, was significantly increased when ultrasonic vibration was employed during laser joining. For the LAMP joined specimens, fracture normally occurred at the metal-plastic interface, whereas for the UAL joined specimens, fracture normally occurred in the parent plastic part. The improvement in joint strength is mainly due to the elimination of pores in the resolidified plastic.

Abstract: A new electrospark deposition (ESD) method and related system are provided in the present invention based on the use of a magnetized electrode, namely magnetic-aided ESD (M-ESD). In particular, the present invention uses a magnetized electrode (either magnetized by an electro-magnet or being a permanent magnet) to attract fine coating powders at the tip thereof which acts as a soft brush to coat on intricate surface profiles. Accordingly, the method of the present invention is able to provide a soft contact between the magnetized anode and the workpiece to be coated or manipulated. The present invention is useful in various surface engineering applications in the fields of aeronautical (e.g. restoration and repair of damaged aircraft turbine blades), nuclear reactors, military engineering, and in medical industries.

Abstract: A new ultrasonic aided laser joining method (UAL) for bonding dissimilar materials has been developed. The method is capable of eliminating the laser-induced bubbles at the bonding faces and to improve the joint strength over that of the conventional laser-assisted metal and plastic joining method (LAMP). Some experiments on joining titanium to polyethylene terephthalate have been conducted to show the superiority of UAL over LAMP. The results showed that the joint strength, measured in terms of failure load, was significantly increased when ultrasonic vibration was employed during laser joining. For the LAMP joined specimens, fracture normally occurred at the metal-plastic interface, whereas for the UAL joined specimens, fracture normally occurred in the parent plastic part. The improvement in joint strength is mainly due to the elimination of pores in the resolidified plastic.

Abstract: A new electrospark deposition (ESD) method and related system are provided in the present invention based on the use of a magnetized electrode, namely magnetic-aided ESD (M-ESD). In particular, the present invention uses a magnetized electrode (either magnetized by an electro-magnet or being a permanent magnet) to attract fine coating powders at the tip thereof which acts as a soft brush to coat on intricate surface profiles. Accordingly, the method of the present invention is able to provide a soft contact between the magnetized anode and the workpiece to be coated or manipulated. The present invention is useful in various surface engineering applications in the fields of aeronautical (e.g. restoration and repair of damaged aircraft turbine blades), nuclear reactors, military engineering, and in medical industries.

Abstract: A method of fabricating a porous metal-based biomaterial, the method includes dispersing microwave susceptors into organic solvent to form a homogeneous suspension, dispersing bioactive fillers into organic solvent to form a homogeneous solution, mixing metal powder with the homogeneous solution and the homogeneous suspension to form a mixture, cold-pressing the mixture into a compact with predefined shape and size, placing the compact in a sintering container, and emitting microwave to heat the compact and remove the organic solvent resided in the compact at the same time.

Abstract: An antimicrobial article prepared by a method includes forming an antimicrobial mixture by adding a calculated amount of antimicrobial agent to a solution of water and alcohol, depositing the antimicrobial mixture in a container, the antimicrobial mixture having a thickness of 0.1 ?m to 10 ?m, evaporating the water and alcohol of the antimicrobial mixture to form the layer of antimicrobial coating, adding silicone resin on top of the layer of antimicrobial coating and allow the silicone resin to permeate and crosslink with the layer of antimicrobial coating, and removing the silicone composite with the layer of antimicrobial coating from the container.

Abstract: A method of fabricating silicone composite with a layer of antimicrobial coating, the method includes forming an antimicrobial mixture by adding a calculated amount of antimicrobial agent to a solution of water and alcohol, depositing the antimicrobial mixture in a container with a thickness of 0.1 ?m to 10 ?m, evaporating the water and alcohol of the antimicrobial mixture to form the layer of antimicrobial coating, adding silicone resin on top of the layer of antimicrobial coating and allow the silicone resin to permeate and crosslink with the layer of antimicrobial coating and removing the silicone composite with the layer of antimicrobial coating from the container.

Abstract: A method of fabricating silicone composite with a layer of antimicrobial coating, the method includes forming an antimicrobial mixture by adding a calculated amount of antimicrobial agent to a solution of water and alcohol, depositing the antimicrobial mixture in a container with a thickness of 0.1 ?m to 10 ?m, evaporating the water and alcohol of the antimicrobial mixture to form the layer of antimicrobial coating, adding silicone resin on top of the layer of antimicrobial coating and allow the silicone resin to permeate and crosslink with the layer of antimicrobial coating and removing the silicone composite with the layer of antimicrobial coating from the container.

Abstract: A method of fabricating a porous metal-based biomaterial, the method includes dispersing microwave susceptors into organic solvent to form a homogeneous suspension, dispersing bioactive fillers into organic solvent to form a homogeneous solution, mixing metal powder with the homogeneous solution and the homogeneous suspension to form a mixture, cold-pressing the mixture into a compact with predefined shape and size, placing the compact in a sintering container, and emitting microwave to heat the compact and remove the organic solvent resided in the compact at the same time.

Abstract: A thermal conductive dielectric coated metal-plate includes a metal carrier, and a partially cured dielectric layer coated to the metal carrier. The dielectric layer includes an epoxy resin, a filler, and a coupling agent.

Abstract: A circuit board comprising a dielectric material provided with a conductive layer is drilled with laser operated at an energy density below the ablation threshold of the conductive layer. The method of drilling includes providing on the conductive layer an ablation layer having an ablation threshold near or below that laser energy density, directing the laser at a target area of the ablation layer to ablate portions of the conductive and dielectric layers in the target area, and removing any remaining ablation layer from the conductive layer.

Abstract: A circuit board comprising a dielectric material provided with a conductive layer is drilled with laser operated at an energy density below the ablation threshold of the conductive layer. The method of drilling includes providing on the conductive layer an ablation layer having an ablation threshold near or below that laser energy density, directing the laser at a target area of the ablation layer to ablate portions of the conductive and dielectric layers in the target area, and removing any remaining ablation layer from the conductive layer.

Abstract: It is known to apply a pulse current during electrodeposition of nickel. In the invention, pulse current waveforms have ramp-down spikes leading to improvements in surface finishes of electroforms created by the process.

Abstract: It is known to apply pulse current during electrodeposition of nickel. In the processes described herein, pulse current waveforms have ramp-down spikes leading to improvements in surface finishes of electroforms created by the processes.