Abstract: The present invention provides a photochromic curable composition capable of providing a cured product excellent in appearance, a photochromic optical article including the cured product, and a method for producing the same. According to an embodiment, there is provided a photochromic curable composition including (A) a siloxane having an acyclic polysiloxane bond and at least one of a radically polymerizable group and a group reactive with a radically polymerizable group, (B) a radically polymerizable monomer component, and (C) a photochromic compound.

Abstract: The present invention provides: a photochromic curable composition for providing a cured product having excellent durability and appearance; and a cured product (photochromic laminate) having a particularly favorable appearance. A photochromic curable composition according to an embodiment includes: (A1) a first hindered amine compound having at least one reactive group selected from the group consisting of a radically polymerizable group and a group reactive with a radically polymerizable group; (B) a radically polymerizable monomer comprising a polyrotaxane component (B1) having a radically polymerizable group while not having a piperidyl group; and (C) a photochromic compound.

Abstract: Provided is an antistatic white polyester film for a surface illuminant reflector, which has practically adequate reflective performance in a visible light region, can form a film with stability even if inorganic fine particles are added in a high concentration, prevents dirt and dust from adhering to the surface of the film due to having an antistatic coat, can control the gloss levels of the front and back sides of the film, and thereby can control a diffusing property of light, and can be suitably used as a base material for a reflector used for a liquid crystal display or an internally illuminated electric ornament signboard. An antistatic white polyester film for a surface illuminant reflector, having a base material layer formed by using a polyester resin and an antistatic applied layer having the surface resistivity of 3×1012?/? or less at a temperature of 23° C.

Abstract: The object of the present invention is to provide a white polyester film which achieves a high reflectivity and a high hiding property, and has high productivity. A white polyester film, wherein the white polyester film has a layer (layer B) containing voids therein, and contains amorphous cyclic olefin copolymerized resin incompatible with polyester in an amount of 3 to 15% by weight, a block copolymer resin of polyalkylene glycol and a polyester resin formed from an aliphatic diol component having 2 to 6 carbon atoms and terephthalic acid in an amount of 2 to 10% by weight, and inorganic particles in an amount of 5 to 25% by weight relative to the total amounts of constituents in the layer B, and wherein the average particle sizes on number in the layer B are 0.4 to 3 ?m, and the maximum particle sizes thereof are not more than 5 ?m.

Abstract: Provided is an antistatic white polyester film for a surface illuminant reflector, which has practically adequate reflective performance in a visible light region, can form a film with stability even if inorganic fine particles are added in a high concentration, prevents dirt and dust from adhering to the surface of the film due to having an antistatic coat, can control the gloss levels of the front and back sides of the film, and thereby can control a diffusing property of light, and can be suitably used as a base material for a reflector used for a liquid crystal display or an internally illuminated electric ornament signboard. An antistatic white polyester film for a surface illuminant reflector, having a base material layer formed by using a polyester resin and an antistatic applied layer having the surface resistivity of 3×1012 ?/? or less at a temperature of 23° C.

Abstract: An organic resin film 27 having an opening on an electrode pad is formed on a main surface of an IC chip 10, and a protruding electrode 12 formed on the electrode pad is formed of a low melting point eutectic solder. As a result, the protruding electrode 12 is formed without melting the organic resin film while preventing a crack from being generated by a stress applied between the electrode pad and the IC chip. Thus, the reliability of a semiconductor package can be enhanced.