Patents by Inventor Taichi Tsuchiya

Taichi Tsuchiya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package structure of a piezoelectric device mounting and supporting a piezoelectric vibration element
    Patent number: 8558435
    Abstract: A piezoelectric device has a piezoelectric vibration element mounted in a package wherein the piezoelectric vibration element comprises two stick-like vibration legs; a central leg provided between the two vibration legs; a coupling portion that couples one end of each of the two vibration legs and one end of the central leg; and a protrusion portion that is coupled to another end of the central leg, has a predetermined angle, neither 0 nor 180 degrees, to the length direction of the central leg, and extends into a direction not interfering with the driving legs. In making the piezoelectric device smaller and thinner, this configuration avoids interference between a support point on the central leg, provided for supporting the vibration element, and conductive electrodes, improves insulation between the conductive electrodes, and reduces the generation of short-circuits between the conductive electrodes.
    Type: Grant
    Filed: March 17, 2009
    Date of Patent: October 15, 2013
    Assignee: Citizen Holdings Co., Ltd.
    Inventors: Kazuo Murata, Kazuhiro Toriumi, Toshiya Kubo, Takashi Maruyama, Tomoyuki Nakazawa, Taichi Tsuchiya, Izumi Yamamoto, Akiko Katoh, Sadao Horiuchi, Hiroshi Miyauchi, Isao Arai, Akihiro Shioji, Tomoo Ikeda, Maki Takizawa, Keisuke Kigawa
  • PIEZOELECTRIC DEVICE
    Publication number: 20110018399
    Abstract: A piezoelectric device has a piezoelectric vibration element mounted in a package wherein the piezoelectric vibration element comprises two stick-like vibration legs; a central leg provided between the two vibration legs; a coupling portion that couples one end of each of the two vibration legs and one end of the central leg; and a protrusion portion that is coupled to another end of the central leg, has a predetermined angle, neither 0 nor 180 degrees, to the length direction of the central leg, and extends into a direction not interfering with the driving legs. In making the piezoelectric device smaller and thinner, this configuration avoids interference between a support point on the central leg, provided for supporting the vibration element, and conductive electrodes, improves insulation between the conductive electrodes, and reduces the generation of short-circuits between the conductive electrodes.
    Type: Application
    Filed: March 17, 2009
    Publication date: January 27, 2011
    Applicant: CITIZEN HOLDINGS CO., LTD.
    Inventors: Kazuo Murata, Kazuhiro Toriumi, Toshiya Kubo, Takashi Maruyama, Tomoyuki Nakazawa, Taichi Tsuchiya, Izumi Yamamoto, Akiko Katoh, Sadao Horiuchi, Hiroshi Miyauchi, Isao Arai, Akihiro Shioji, Tomoo Ikeda, Maki Takizawa, Keisuke Kigawa
  • Silicon device manufacturing method, silicon device, and optical component
    Patent number: 6730535
    Abstract: The silicon substrate is masked on one surface of the silicon substrate where structures like combs and beams of comb drive are not to be formed on the other surface. The unmasked areas are then etched followed by masking areas on the other surface corresponding to the structures. Finally, the unmasked areas on the other surface are again etched by anisotropic reactive ion etching to form the structures.
    Type: Grant
    Filed: November 8, 2002
    Date of Patent: May 4, 2004
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Koji Morimoto, Kouki Sato, Masahito Morimoto, Kazuhiro Toriumi, Taichi Tsuchiya
  • Silicon device manufacturing method, silicon device, and optical component
    Publication number: 20030162318
    Abstract: The silicon substrate is masked on one surface of the silicon substrate where structures like combs and beams of comb drive are not to be formed on the other surface. The unmasked areas are then etched followed by masking areas on the other surface corresponding to the structures. Finally, the unmasked areas on the other surface are again etched by anisotropic reactive ion etching to form the structures.
    Type: Application
    Filed: November 8, 2002
    Publication date: August 28, 2003
    Inventors: Koji Morimoto, Kouki Sato, Masahito Morimoto, Kazuhiro Toriumi, Taichi Tsuchiya