Abstract: There is provided a gas trapping material and vacuum heat insulation equipment where the gas trapping material can be activated in a sealing step of the vacuum heat insulation equipment, and production efficiency can be enhanced by maintaining a high gas trapping characteristic even when a gas is released in a baking step or in a sealing step under an air atmosphere. The gas trapping material contains porous metal oxide and silver particles having an average particle size of 0.5 nm to 100 nm inclusive.

Abstract: The present invention provides a highly reliable multilayered glass panel and an encapsulating material for achieving the highly reliable multilayered glass panel. The encapsulating material includes lead-free low melting glass particles containing vanadium oxide and tellurium oxide, low thermal expansion filler particles, and glass beads as a solid content. A volume fraction of the glass beads in the solid content is not less than 10% to not more than 35%, and a volume fraction of the lead-free low melting glass particles in the solid content is larger than a volume fraction of the low thermal expansion filler in the solid content.

Abstract: A lead-free low-melting glass composition containing vanadium oxide, tellurium oxide, silver oxide and lithium oxide, said composition satisfying the following two relational expressions (1) and (2) in terms of oxides. [Ag2O]?[TeO2]?[V2O5]?[Li2O]??(1) 2[V2O5]?[Ag2O]+[Li2O]?40??(2) (In the formula, [X] represents a content of component X, and the unit thereof is “mol %”; the same applies hereinafter.) Thus, it is possible to provide a lead-free low-melting glass composition which enables sealing and adhesion at around the melting point (232° C.) of tin and which has high adhesiveness and stickiness.

Abstract: The lead-free glass composition contains vanadium oxide, tellurium oxide, alkali metal oxide, iron oxide, barium oxide, and tungsten oxide while containing substantially no phosphorus oxide, and further contains at least one of additional components including yttrium oxide, lanthanum oxide, cerium oxide, erbium oxide, ytterbium oxide, aluminum oxide, and gallium oxide. A content of the tellurium oxide is equal to or more than 25 mol %, and equal to or less than 43 mol % in terms of oxide TeO2. A content of the alkali metal oxide is equal to or more than 4 mol %, and equal to or less than 27 mol % in terms of oxide R2O (R: alkali metal element).

Abstract: The present invention provides a highly reliable multilayered glass panel and an encapsulating material for achieving the highly reliable multilayered glass panel. The encapsulating material includes lead-free low melting glass particles containing vanadium oxide and tellurium oxide, low thermal expansion filler particles, and glass beads as a solid content. A volume fraction of the glass beads in the solid content is not less than 10% to not more than 35%, and a volume fraction of the lead-free low melting glass particles in the solid content is larger than a volume fraction of the low thermal expansion filler in the solid content.

Abstract: There is provided a gas trapping material and vacuum heat insulation equipment where the gas trapping material can be activated in a sealing step of the vacuum heat insulation equipment, and production efficiency can be enhanced by maintaining a high gas trapping characteristic even when a gas is released in a baking step or in a sealing step under an air atmosphere. The gas trapping material contains porous metal oxide and silver particles having an average particle size of 0.5 nm to 100 nm inclusive.

Abstract: A carbon dioxide removal device 100 that include an adsorbent 1 and a reaction vessel 10 that have the adsorbent 1 installed therein, and that brings a gas to be treated containing carbon dioxide into contact with the adsorbent 1 and thereby removes carbon dioxide from the gas, in which the carbon dioxide removal device 100 further includes a water adjustment unit 20 that supplies water to the reaction vessel 10 and discharges water from the reaction vessel 10.

Abstract: The lead-free glass composition contains vanadium oxide, tellurium oxide, alkaline metal oxide, iron oxide, barium oxide, and tungsten oxide while containing substantially no phosphorus oxide, and further contains at least one of additional components including yttrium oxide, lanthanum oxide, cerium oxide, erbium oxide, ytterbium oxide, aluminum oxide, and gallium oxide. A content of the tellurium oxide is equal to or more than 25 mol %, and equal to or less than 43 mol % in terms of oxide TeO2. A content of the alkaline metal oxide is equal to or more than 4 mol %, and equal to or less than 27 mol % in terms of oxide R2O (R: alkali metal element).

Abstract: It is an objective of the invention to provide a conductive joint article exhibiting electrical joinability comparable to that of solder joining of easy-to-solder joinable metals even when a joined member of the conductive joint article is made of a hard-to-solder joinable metal. There is provided a conductive joint article with conductive joined members electrically joined via a joining layer, at least one of the joined members being made of a hard-to-solder joinable metal. The joining layer comprises an oxide glass phase and a conductive metal phase. The oxide glass phase includes vanadium as a major constituent and at least one of phosphorus, barium and tungsten as an accessory constituent, and has a glass transition point of 390° C. or less. And, connection resistance between the joined members exhibits less than 1×10?5 ?/mm2.

Abstract: Provided is an adsorbent used for removing carbon dioxide from a gas containing carbon dioxide, the adsorbent containing cerium oxide containing cerium and a metallic element (excluding cerium) having an electronegativity of 1.00 or more.

Abstract: There is disclosed a heat-insulating member including a pair of substrates and an airtight sealing part, in which the airtight sealing part is formed in an outer peripheral part between the pair of substrates to form a space between the pair of substrates, the space being in a vacuum or reduced pressure state, a sealing material that forms the airtight sealing part includes a low-melting glass, and the low-melting glass contains a vanadium oxide, barium oxide, phosphorus oxide, and tungsten oxide, in which the following two relational expressions are satisfied in terms of oxide contents: V2O5+BaO+P2O5+WO3?90 and V2O5>BaO>P2O5>WO3 (wherein unit: mol %). Thereby, influence on environmental impact can be reduced and maintenance of airtightness and an improvement in acid resistance can be achieved.

Abstract: There is provided a bonding article comprising: an electrical insulating substrate; a first adhesion layer laminated on one surface of the electrical insulating substrate; and a second adhesion layer laminated on the other surface of the electrical insulating substrate. Both the first adhesion layer and the second adhesion layer include a low-melting-point lead-free glass containing vanadium oxide and tellurium oxide as chemical constituents and having a softening point of 360° C. or lower. And, when contours of the first adhesion layer, the electrical insulating substrate, and the second adhesion layer are projected parallel to one another along the lamination direction, the contour of the first adhesion layer is located inside the contour of the second adhesion layer.

Abstract: Provided is an adsorbent used for removing carbon dioxide from a gas containing carbon dioxide, the adsorbent containing cerium oxide, in which a lattice constant of the cerium oxide is 0.5415 nm or more.

Abstract: A heat-dissipating structure is formed by bonding a first member and a second member, each being any of a metal, ceramic, and semiconductor, via a die bonding member; or a semiconductor module formed by bonding a semiconductor chip, a metal wire, a ceramic insulating substrate, and a heat-dissipating base substrate including metal, with a die bonding member interposed between each. At least one of the die bonding members includes a lead-free low-melting-point glass composition and metal particles. The lead-free low-melting-point glass composition accounts for 78 mol % or more in terms of the total of the oxides V2O5, TeO2, and Ag2O serving as main ingredients. The content of each of TeO2 and Ag2O is 1 to 2 times the content of V2O5, and at least one of BaO, WO3, and P2O5 is included as accessory ingredients, and at least one of Y2O3, La2O3, and Al2O3 is included as additional ingredients.

Abstract: It is an objective of the invention to provide a conductive joint article exhibiting electrical joinability comparable to that of solder joining of easy-to-solder joinable metals even when a joined member of the conductive joint article is made of a hard-to-solder joinable metal. There is provided a conductive joint article with conductive joined members electrically joined via a joining layer, at least one of the joined members being made of a hard-to-solder joinable metal. The joining layer comprises an oxide glass phase and a conductive metal phase. The oxide glass phase includes vanadium as a major constituent and at least one of phosphorus, barium and tungsten as an accessory constituent, and has a glass transition point of 390° C. or less. And, connection resistance between the joined members exhibits less than 1×10?5 ?/mm2.

Abstract: An Ag2O—V2O5—TeO2 lead-free low-melting glass composition that is prevented or restrained from crystallization by heating so as to soften and flow more satisfactorily at a low temperature contains a principal component which includes a vanadium oxide, a tellurium oxide and a silver oxide; a secondary component which includes at least one selected from the group consisting of BaO, WO3 and P2O5; and an additional component which includes at least one selected from the group consisting of oxides of elements in Group 13 of periodic table. A total component of the principal component is 85 mole percent or more in terms of V2O5, TeO2 and Ag2O. Contents of TeO2 and Ag2O each is 1 to 2 times as much as a content of V2O5. A content of the secondary component is 0 to 13 mole percent. A content of the additional component is 0.1 to 3.0 mole percent.

Abstract: Disclosed herein is a method for producing an electrode includes a step of reducing lithium-vanadium oxide by heating in reducing gas, a step of causing the reduced lithium-vanadium oxide to deliquesce, a step of mixing the deliquesced lithium oxide with an active material so as to prepare an electrode mixture, and a step of making the electrode mixture into an electrode by virtue of molding after heat treatment to the electrode mixture. The method for producing an all-solid battery further includes a step of bonding the thus-made electrode to a solid electrode layer in such a way that the solid electrode layer is interposed between the electrode and either of cathode and anode to be paired with the electrode.

Abstract: An ultrasound probe is provided which maintains sufficient adhesion strength of the layers that configure the ultrasound probe and which matches the acoustic impedance of a piezoelectric element to that of the organism; also provided is an ultrasound diagnostic device provided with said ultrasound probe. This ultrasound probe (100a) is characterized by comprising a backing layer, a piezoelectric element layer (6E), an acoustic matching layer (2A) and an acoustic lens (1), laminated in that order, wherein an adhesion layer (14A) containing vanadium glass is provided between the piezoelectric element layer (6E) and the acoustic matching layer (2A).

Abstract: An Ag2O—V2O5—TeO2 lead-free low-melting glass composition that is prevented or restrained from crystallization by heating so as to soften and flow more satisfactorily at a low temperature contains a principal component which includes a vanadium oxide, a tellurium oxide and a silver oxide; a secondary component which includes at least one selected from the group consisting of BaO, WO3 and P2O5; and an additional component which includes at least one selected from the group consisting of oxides of elements in Group 13 of periodic table. A total component of the principal component is 85 mole percent or more in terms of V2O5, TeO2 and Ag2O. Contents of TeO2 and Ag2O each is 1 to 2 times as much as a content of V2O5. A content of the secondary component is 0 to 13 mole percent. A content of the additional component is 0.1 to 3.0 mole percent.

Abstract: A heat-dissipating structure is formed by bonding a first member and a second member, each being any of a metal, ceramic, and semiconductor, via a die bonding member; or a semiconductor module formed by bonding a semiconductor chip, a metal wire, a ceramic insulating substrate, and a heat-dissipating base substrate including metal, with a die bonding member interposed between each. At least one of the die bonding members includes a lead-free low-melting-point glass composition and metal particles. The lead-free low-melting-point glass composition accounts for 78 mol % or more in terms of the total of the oxides V2O5, TeO2, and Ag2O serving as main ingredients. The content of each of TeO2 and Ag2O is 1 to 2 times the content of V2O5, and at least one of BaO, WO3, and P2O5 is included as accessory ingredients, and at least one of Y2O3, La2O3, and Al2O3 is included as additional ingredients.