Abstract: A temporary part is fixed to a base by using an adhesive layer to which fillers are mixed at a predetermined density. When the temporary part is heated, heat is applied to the fillers and the adhesive layer. At a temperature equal to or higher than the glass-transition temperature of the adhesive agent, the heated adhesive layer is thermally contracted so as to release remaining stress, and on the other hand, the heated fillers are thermally expanded. In this manner, the peel-off strength between the adhesive layer and the base (or the temporary part) is reduced, and the disassembly is facilitated.

Abstract: To ensure required adhesion even when a pipe of a piping module collides with a temporary material during transport and achieve easier dismantling, the following measure is taken: the temporary material is fixed on a support rack to prevent the piping module placed on the support rack from largely displaced during conveyance and after the conveyance of the piping module, the temporary material is removed from the support rack. In this method, the following measures are taken: at the step of fixing the temporary material to the support rack, the temporary material is bonded to the support rack with the piping module set therein using adhesive; and at the step of removing the temporary material from the support rack after the conveyance of the piping module, the temporary material bonded to the support rack with the adhesive is peeled off from the support rack with heat applied thereto.

Abstract: A temporary part is fixed to a base by using an adhesive layer to which fillers are mixed at a predetermined density. When the temporary part is heated, heat is applied to the fillers and the adhesive layer. At a temperature equal to or higher than the glass-transition temperature of the adhesive agent, the heated adhesive layer is thermally contracted so as to release remaining stress, and on the other hand, the heated fillers are thermally expanded. In this manner, the peel-off strength between the adhesive layer and the base (or the temporary part) is reduced, and the disassembly is facilitated.